STC8A8K64D4 Series Manual
4.3 QFN48 Package mechanical data (6mm*6mm)
48
1
12
13
K
39
L
35
25
24
The back metal sheet (substrate) of STC's existing QFN48packaged chip is not grounded inside the chip. It can be grounded
or ungrounded on the user's PCB board, which will not affect the performance of the chip.
D (6mm)
37
PIN 1
24
48
R
D2
b(0.20mm)
13
SYMBOL
36
A
A1
A3
b
D
E
D2
E2
e
L
K
25
R
1
12
-
General size
MIN
TYP
MAX
0.70
0.75
0.80
0.00
0.02
0.05
0.20REF
0.15
0.20
0.25
5.90
6.00
6.10
5.90
6.00
6.10
3.95
4.05
4.15
3.95
4.05
4.15
0.35
0.40
0.45
0.35
0.40
0.45
0.20
0.09
-
-
mm
- 38 -
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