Module Installation - Tektronix 8001A Installation Manual

General Information
1-8
Many semiconductor components, especially MOS type components, can be damaged by
static discharge. Damage may not be catastrophic, therefore, not immediately apparent. It
usually appears as a "weakening" of the semiconductor characteristics. Devices that are
particularly susceptible are: MOS, CMOS, JFETs, and high impedance OP amps. Damage
can be significantly reduced by observing the following precautions:
1. Minimize handling by keeping assemblies, modules, or components in their original
containers until ready for use. Minimize the removal and installation of semiconductors
from their circuit boards.
2. Observe precautionary measures to reduce or eliminate static discharge when handling
static sensitive devices or circuit assemblies, by grounding yourself on the instrument
chassis when installing or removing an assembly with semiconductor components.
3. Hold the assembly or device by its sides rather than touching semiconductor terminals
or conductive lines to these terminals.
4. All test equipment, accessories, and soldering tools should be connected to earth
ground.
5. Use containers made of conductive material or filled with conductive material for
storage and transportation. Avoid using ordinary plastic containers. Any static sensitive
part or assembly (circuit board) that is to be returned to Tektronix, Inc. should be pack-
aged in its original container or one with anti-static packaging material.
MODULE INSTALLATION
Before installing or removing a module, switch the POWER to the µProcessor
Lab OFF.
NOTE
The red wire on each cable designates the side of the cable plug that is connected to
pin 1 in the mating connector. In the µProcessor Lab, pin 1 of the mating connector
on the module is always located toward the rear of the unit.
REV A, OCT 1978
8001/8002 Installation Guide