General Information
1-2
Repacking for Shipment
If either the µProcessor Lab or Flexible Disc Unit is to be shipped to a Tektronix Service
Center for service or repair, attach a tag showing: owner (with address), name of individual
at your firm that can be contacted, complete serial number, and a description of the service
required. If the original packaging is unfit for use or not available, repackage the equipment
as follows:
1. Obtain a carton of corrugated cardboard having inside dimensions that are at least six
inches more than the equipment dimensions, to allow for cushioning.
2. Surround the equipment with polyethylene sheeting to protect the finish.
3.
Cushion the equipment on all sides with packing material or urethane foam between the
carton and the sides of the equipment.
4.
Seal with shipping tape or industrial stapler.
8001/8002 µPROCESSOR LAB INSTALLATION
The 8002 µProcessor Lab and Flexible Disc Unit should be installed and operated on a flat
surface. The units should be close enough to each other for the interconnecting cables to
reach. Both units draw cooling air through openings in the bottom of the cabinets. The
air is expelled out the back by two fans. These units should not be located where paper,
plastic, carpeting, or other materials might block the air intakes and cause overheating.
Allow at least four inches clearance behind the units so the air flow is not restricted.
The 8001 µProcessor Lab installation requirements are the same as for 8002 µProcessor
Lab.
Cable Interconnections
Refer to Fig. 1-1 for the 8001 /8002 µProcessor Lab System interconnect diagram. Connect
the cables as follows:
@
8001/8002 Installation Guide
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