Thermal Specifications; Timing Diagrams; Changes To Table 5 - Analog Devices ADV7181B Manual

THERMAL SPECIFICATIONS

Table 5.
1, 2
Parameter
THERMAL CHARACTERISTICS
Junction-to-Ambient Thermal
Resistance (Still Air)
Junction-to-Case Thermal Resistance
Junction-to-Ambient Thermal
Resistance (Still Air)
Junction-to-Case Thermal Resistance
1 Temperature range: T to T , –40°C to +85°C
MIN MAX
2
The min/max specifications are guaranteed over this range.

TIMING DIAGRAMS

SDA
SCLK
Symbol Test Conditions
θ 4-layer PCB with solid ground plane, 64-lead LFCSP
JA
θ 4-layer PCB with solid ground plane, 64-lead LFCSP
JC
θ 4-layer PCB with solid ground plane, 64-lead LQFP
JA
θ 4-layer PCB with solid ground plane, 64-lead LQFP
JC
t
3
t
6
t
t
7
2
OUTPUT LLC
OUTPUTS P0–P15, VS,
HS, FIELD,
SFL
Figure 3. Pixel Port and Control Output Timing
t t
5
t
1
2
Figure 2. I C Timing
t t
9 10
t
11
t
12
Rev. B | Page 9 of 100
Min
3
t
t
4
8
ADV7181B
Typ Max Unit
45.5 °C/W
9.2 °C/W
47 °C/W
11.1 °C/W