Cleanliness; Cooling System - H3C SR6602-I Installation Manual

Item
Humidity

Cleanliness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table2-2 Dust concentration limit in the equipment room
Substance
Dust particles
NOTE:
Dust particle diameter ≥ 5 µm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion
and premature aging of components, as shown in Table2-3.
Table2-3 Harmful gas limits in an equipment room
Gas
SO
2
H S
2
NH
3
Cl
2
NO
2

Cooling system

For adequate cooling of the device, make sure the following requirements are met:
•
A minimum clearance of 100 mm (3.94 in) is reserved around the inlet and outlet air vents.
•
The installation site has a good cooling system.
•
Plan the cooling system at the installation site based on the airflow direction of the device.
•
Verify the airflow directions of the devices above and below the device. Make sure the
exhausted hot air of the lower device will not enter the upper device.
Specification
With GPUs: 0°C to 40°C (32°F to 104°F)

•
Storage: –40°C to +70°C (–40°F to +158°F)
•
Operating: 5% RH to 95% RH, noncondensing
•
Storage: 5% RH to 95% RH, noncondensing
Concentration limit (particles/m
≤ 3 × 10 4
(No visible dust on desk in three days)
Max. (mg/m
0.2
0.006
0.05
0.01
0.04
2-3
3
)
3
)