Temperature And Humidity; Cleanliness; Cooling System - H3C MSR3610-X1 Installation Manual

Temperature and humidity

Make sure the temperature and humidity in the equipment room meet the requirements described
in Table 2.
•
Lasting high relative humidity can cause poor insulation, electricity leakage, mechanical
property change of materials, and metal corrosion.
•
Lasting low relative humidity can cause washer contraction and ESD and cause problems
including loose mounting screws and circuit failure.
•
High temperature can accelerate the aging of insulation materials and significantly lower the
reliability and lifespan of the device.
Table 2 Temperature and humidity requirements for the equipment room
Temperature
•
With a hard disk:
5°C to 40°C (41°F to 104°F)
•
Without a hard disk:
0°C to 45°C (32°F to 113°F)

Cleanliness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table 3 Dust concentration limit in the equipment room
Substance
Dust particles
NOTE:
Dust particle diameter ≥ 5 µm
The equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 4 Harmful gas limits in the equipment room
Gas
SO
2
H S
2
NH
3
Cl
2

Cooling system

The device uses left to right airflow for heat dissipation.
Humidity
5% to 95% (noncondensing)
Concentration limit (particles/m
4
≤ 3 x 10
(No visible dust on desk in three days)
Table 4.
3
Max. (mg/m )
0.2
0.006
0.05
0.01
2
3
)