Handling Boards And Assemblies - Sun Microsystems Enterprise 6500 Reference Manual

5.1

Handling Boards and Assemblies

Caution – The chassis AC power cord must remain connected to ensure a proper
ground.
Caution – The Disk boards, their modules, and cards have surface-mount
components that can be broken by flexing the boards.
To minimize the amount of board flexing, observe the following precautions:
Hold the board only by the edges near the middle of the board, where the board
stiffener is located. Do not hold the board only at the ends.
When removing the board from an antistatic bag, keep the board vertical until
you lay it on the Sun ESD mat.
Do not place the board on a hard surface. Use a cushioned antistatic mat. The
board connectors and components have very thin pins that bend easily.
Do not use an oscilloscope probe on the components. The soldered pins are easily
damaged or shorted by the probe point.
Transport the board in an antistatic bag.
Be careful of small parts located on the component side of the board.
Be careful not to drag boards across surfaces as board components are easily
damaged.
Caution – The heatsinks on the board can be damaged by incorrect handling. Do
not touch the heatsinks while installing or removing the board. Hold the board only
by the edges. If a heatsink is loose or broken, obtain a replacement board.
Caution – The heatsinks on the board can be damaged by improper packaging.
When storing or shipping the board, ensure that the heatsinks have sufficient
protection.
5-2 Sun Enterprise 6500/5500/4500 Systems Reference Manual • April 1998