Manufacturing And Soldering - Quectel LTE-A Series Hardware Design

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8.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module should be 0.13-0.15mm. For more details, please refer to document
[5].
It is suggested that the peak reflow temperature is 238º C ~ 245º C (for SnAg3.0Cu0.5 alloy). The absolute
max reflow temperature is 245º C. To avoid damage to the module caused by repeated heating, it is
strongly recommended that the module should be mounted after reflow soldering for the other side of
PCB has been completed. Recommended reflow soldering thermal profile is shown below:
Temp. (° C)
245
238
220
200
Soak Zone
150
100
Table 47: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150° C and 200° C)
EG18_Hardware_Design
A
Max slope: 1~3° C/sec
Figure 54: Reflow Soldering Thermal Profile
EG18 Hardware Design
Reflow Zone
Max slope:
2~3° C/sec
B
Recommendation
1 to 3° C/sec
60 to 120 sec
LTE-A Module Series
Cooling down
C
slope: 1~4° C/sec
D
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