Quectel LTE-A Series Hardware Design page 91

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The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following figures manifest two kinds of heatsink designs for reference. Please choose one or both of
them according to particular application structure.
EG18 Module
Application Board
Figure 45: Reference Design of Heatsink (Heatsink at the Top of the Module)
EG18 Module
Application Board
Figure 46: Reference Design of Heatsink (Heatsink at the Backside of PCB)
EG18_Hardware_Design
Heatsink
Thermal Pad
Shielding Cover
Thermal Pad
Heatsink
Shielding Cover
LTE-A Module Series
EG18 Hardware Design
Heatsink
Application Board
Thermal Pad
Heatsink
Application Board
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