Quectel LTE-A Series Hardware Design page 93

The following figure shows the corresponding position of the eight temperature sensors of the EG18.
NOTES
1. Make sure that the PCB design provides sufficient cooling solutions for the module: proper mounting,
heatsinks, and active cooling may be required depending on the integrated application.
2. For more detailed guidelines on thermal design, please refer to document [8].
EG18_Hardware_Design
Figure 48: Temperature Sensor Distribution
LTE-A Module Series
EG18 Hardware Design
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