Manufacturing And Soldering - Quectel FG50V Hardware Design

1)
1. This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033.
2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules to the
air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or the relative
moisture is over 60%, it is recommended to start the solder reflow process within 24 hours after the package
is removed. And do not remove the packages of tremendous modules if they are not ready for soldering.
3. Please take the module out of the packaging and put it on high-temperature resistant fixtures before the
baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for baking procedure.

6.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.13–0.15 mm. For more details, see
document [5].
It is suggested that the peak reflow temperature is 238–246 ºC, and the absolute maximum reflow temperature is
246 ºC. To avoid damage to the module caused by repeated heating, it is strongly recommended that the module
should be mounted after reflow soldering for the other side of PCB has been completed. The recommended
reflow soldering thermal profile (lead-free reflow soldering) and related parameters are shown below.
Temp. (°C)
246
238
220
200
Soak Zone
150
100
Figure 23: Recommended Reflow Soldering Thermal Profile
Table 28: Recommended Thermal Profile Parameters
Factor
FG50V_Hardware_Design
A
Max slope: 1 to 3°C/s
Wi-Fi&BT Module Series
FG50V Hardware Design
Reflow Zone
Max slope:
Cooling down slope:
C
2 to 3°C/s -1.5 to -3°C/s
B D
Recommendation
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