Quectel SC66 Hardware Design
  1. Manuals
  2. Brands
  3. Quectel Manuals
  4. Wireless modules
  5. SC66
  6. Hardware design

Quectel SC66 Hardware Design

Lte module
Hide thumbs
Table of Contents

Advertisement

Quick Links

Download this manual
Model:SC66-A
SC66
Hardware Design
Smart LTE Module Series
Rev: SC66_Hardware_Design_V1.0
Date: 2019-08-13
Status: Released
www.quectel.com

Advertisement

Table of Contents
loading

Related Manuals for Quectel SC66

Summary of Contents for Quectel SC66

  • Page 1 Model:SC66-A SC66 Hardware Design Smart LTE Module Series Rev: SC66_Hardware_Design_V1.0 Date: 2019-08-13 Status: Released www.quectel.com...
  • Page 2 QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION.

  • Page 3: About The Document

    Smart LTE Module Series SC66 Hardware Design About the Document History Revision Date Author Description Jian WU/ 2019-08-13 Initial Chris ZHANG SC66_Hardware_Design 2 / 139...

  • Page 4: Table Of Contents

    Smart LTE Module Series SC66 Hardware Design Contents About the Document ........................... 2 Contents ............................... 3 Table Index ..............................6 Figure Index ..............................8 Introduction ............................13 1.1. Safety Information ........................14 Product Concept ..........................15 2.1. General Description ........................15 2.2.
  • Page 5 Smart LTE Module Series SC66 Hardware Design 3.18. LCM Interfaces .......................... 69 3.19. Touch Panel Interfaces ......................74 3.20. Camera Interfaces........................75 3.20.1. Design Considerations ....................81 3.21. Sensor Interfaces ........................83 3.22. Audio Interfaces ........................84 3.22.1. Reference Circuit Design for Microphone Interface ............85 3.22.2.
  • Page 6 Smart LTE Module Series SC66 Hardware Design 8.2. Recommended Footprint ......................131 8.3. Top and Bottom View of the Module ..................132 Storage, Manufacturing and Packaging ..................133 9.1. Storage ............................ 133 9.2. Manufacturing and Soldering ....................134 9.3. Packaging ..........................135 10 Appendix A References ........................
  • Page 7 TABLE 3: SC66-J* FREQUENCY BANDS ......................16 TABLE 4: SC66-E* FREQUENCY BANDS ....................... 17 TABLE 5: SC66-W* FREQUENCY BANDS ...................... 17 TABLE 6: SC66-MW*(2 × 2 MIMO WIFI) FREQUENCY BANDS ..............18 TABLE 7: SC66 KEY FEATURES ........................19 TABLE 8: I/O PARAMETERS DEFINITION ....................... 26 TABLE 9: PIN DESCRIPTION ...........................
  • Page 8 TABLE 44: GNSS FREQUENCY ........................103 TABLE 45: ANTENNA REQUIREMENTS ......................106 TABLE 46: ABSOLUTE MAXIMUM RATINGS ....................109 TABLE 47: SC66 MODULE POWER SUPPLY RATINGS ................109 TABLE 48: OPERATION AND STORAGE TEMPERATURES ................. 110 TABLE 49: SC66-CE* CURRENT CONSUMPTION ..................111 TABLE 50: SC66-A* CURRENT CONSUMPTION ...................
  • Page 9 Smart LTE Module Series SC66 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ....................... 23 FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................... 25 FIGURE 3: VOLTAGE DROP SAMPLE ......................43 FIGURE 4: STRUCTURE OF POWER SUPPLY ....................43 FIGURE 5: REFERFENCE CIRCUIT OF POWER SUPPLY ................44 FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ..............
  • Page 10 Smart LTE Module Series SC66 Hardware Design ..................................100 FIGURE 40: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND) ..................................101 FIGURE 41: REFERENCE CIRCUIT DESIGN FOR WI-FI/BT ANTENNA INTERFACE ........ 102 FIGURE 42: REFERENCE CIRCUIT DESIGN FOR WI-FI MINO ANTENNA INTERFACE ......103 FIGURE 43: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA .........
  • Page 11 Smart LTE Module Series SC66 Hardware Design OEM/Integrators Installation Manual Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
  • Page 12 Smart LTE Module Series SC66 Hardware Design In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
  • Page 13 Smart LTE Module Series SC66 Hardware Design Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement."...

  • Page 14: Introduction

    This document can help customers quickly understand module interface specifications, electrical and mechanical details as well as other related information of SC66 module. Associated with application note and user guide, customers can use SC66 module to design and set up mobile applications easily. SC66_Hardware_Design...

  • Page 15: Safety Information

    SC66 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 16: Product Concept

    SC66 Hardware Design Product Concept 2.1. General Description SC66 is a series of Smart LTE module based on Qualcomm platform and Android operating system, and provides industrial grade performance. Its general features are listed below:  Support worldwide LTE-FDD, LTE-TDD, DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA, WCDMA, TD-SCDMA, EVDO/CDMA, EDGE, GSM and GPRS coverage ...
  • Page 17 Smart LTE Module Series SC66 Hardware Design BT5.0 2402MHz~2480MHz GPS: 1575.42MHz±1.023MHz GNSS GLONASS: 1597.5MHz~1605.8MHz BeiDou: 1561.098MHz±2.046MHz Table 2: SC66-A* Frequency Bands Type Frequency Bands LTE-FDD B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 LTE-TDD WCDMA B2/B4/B5 Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz BT 5.0 2402MHz~2480MHz GPS: 1575.42MHz±1.023MHz GNSS GLONASS: 1597.5MHz~1605.8MHz BeiDou: 1561.098MHz±2.046MHz...
  • Page 18 Smart LTE Module Series SC66 Hardware Design Table 4: SC66-E* Frequency Bands Type Frequency Bands LTE-FDD B1/B2/B3/B4/B5/B7/B8/B20/B28(A+B) LTE-TDD B38/B39/B40/B41 WCDMA B1/B2/B4/B5/B8 850/900/1800/1900MHz Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz BT 5.0 2402MHz~2480MHz GPS: 1575.42MHz±1.023MHz GNSS GLONASS: 1597.5MHz~1605.8MHz BeiDou: 1561.098MHz±2.046MHz Table 5: SC66-W* Frequency Bands...
  • Page 19 SC66 is an SMD type module which can be embedded into applications through its 324 pins (including 152 LCC pads and 172 LGA pads). With a compact profile of 43.0mm × 44.0mm × 2.85mm, SC66 can meet almost all requirements for M2M applications such as smart metering, smart home, security, routers, wireless POS, mobile computing devices, PDA phone, tablet PC and etc.

  • Page 20: Key Features

    Smart LTE Module Series SC66 Hardware Design 2.2. Key Features The following table describes the detailed features of SC66 module. Table 7: SC66 Key Features Features Details Customized 64-bit ARM v8-compliant applications processor  Kryo Gold: quad high-performance cores targeting 2.2 GHz Application Processor ...
  • Page 21 Smart LTE Module Series SC66 Hardware Design  WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) Support CCSA Release 3 TD-SCDMA TD-SCDMA Features  Max 4.2Mbps (DL)/Max 2.2Mbps (UL) Support 3GPP2 CDMA2000 1X Advanced, CDMA2000 1x EV-DO Rev.A  CDMA2000 Features EVDO: Max 3.1Mbps (DL)/Max 1.8 Mbps (UL) ...
  • Page 22 Smart LTE Module Series SC66 Hardware Design EVRC, EVRC-B, EVRC-WB; G.711, G.729A/AB; GSM-FR, GSM-EFR, Audio Codec GSM-HR; AMR-NB, AMR-WB, AMR-eAMR, AMR-BeAMR Compliant with USB 3.1 and 2.0 specifications, with transmission rates up to 5Gbps on USB 3.1 and 480Mbps on USB 2.0...

  • Page 23: Functional Diagram

    When the temperature returns to the normal operating temperature levels, the module will meet 3GPP specifications again. 3. “*” means under development. 2.3. Functional Diagram The following figure shows a block diagram of SC66 and illustrates the major functional parts.  Power management ...

  • Page 24: Evaluation Board

    Figure 1: Functional Diagram NOTE The red dotted frame is Wi-Fi MIMO path, which is not supported by SC66-CE and SC66-W. 2.4. Evaluation Board In order to help customers design and test applications with Quectel SC66 modules, Quectel supplies an evaluation kit, which includes an evaluation board, a USB to RS232 converter cable, a USB Type-C data cable, a power adapter, an earphone and antennas.

  • Page 25: Application Interfaces

    Smart LTE Module Series SC66 Hardware Design Application Interfaces 3.1. General Description SC66 is equipped with 324 pins that can be embedded into cellular application platform. The following chapters provide the detailed description of pins/interfaces listed below.  Power supply ...

  • Page 26: Pin Assignment

    Smart LTE Module Series SC66 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of SC66 module. POWER AUDIO (U)SIM CAMERA UART GPIO OTHERS RESERVED Figure 2: Pin Assignment (Top View) SC66_Hardware_Design 25 / 139...

  • Page 27: Pin Description

    Analog input Analog output Digital input Digital output Bidirectional Open drain Power input Power output The following tables show the SC66’s pin definition and electrical characteristics. Table 9: Pin Description Power Supply Pin Name Pin No. Description Comment Characteristics It must be provided with sufficient current Vmax=4.4V...
  • Page 28 Smart LTE Module Series SC66 Hardware Design max=3.2V; Power supply for When VBAT is not VRTC internal RTC circuit connected: =2.1V~3.25V Power supply for 1.8V output power Vnorm=1.8V external GPIO’s pull up LDO13A_1P8 supply max=20mA circuits and level shift circuit.
  • Page 29 Smart LTE Module Series SC66 Hardware Design 193, 195, 219, 225, 243, 257~ Audio Interfaces Pin Name Pin No. Description Comment Characteristics Microphone bias MIC_BIAS =1.6V~2.9V voltage Microphone input for MIC1_P channel 1 (+) Microphone input for MIC1_M channel 1 (-)
  • Page 30 Smart LTE Module Series SC66 Hardware Design Charging power input; Vmax=10V Power supply output USB_VBUS 41, 42 Vmin=3.6V for OTG device; Vnorm=5.0V USB/charger insertion detection 90Ω differential USB 2.0 differential USB2_HS_DM data bus (-) impedance; USB 2.0 standard compliant; USB 2.0 differential...
  • Page 31 Smart LTE Module Series SC66 Hardware Design When Micro USB is USB Type-C USB_CC1 used, it can be used as detection channel 1 USB_ID pin. USB Type-C USB_CC2 detection channel 2 When USB Type-C is used, it should be connected to VPH_PWR through a 10KΩ...
  • Page 32 Smart LTE Module Series SC66 Hardware Design min= 0.7 × USIM1_VDD max=0.4V min= 0.8 × USIM1_VDD Either 1.8V or 2.95V (U)SIM1 card power USIM1_VDD (U)SIM card is supply supported. Active Low. Need external pull-up (U)SIM2 card max=0.63V USIM2_DET to 1.8V.
  • Page 33 Smart LTE Module Series SC66 Hardware Design UART6 transmit UART6_TXD data max=0.45V min=1.35V UART6 request to UART6_RTS send UART6 clear to max=0.63V UART6_CTS send min=1.17V LPI_UART_2_ LPI_UART_2 max=0.45V Cannot be multiplexed transmit data min=1.35V into general-purpose LPI_UART_2_ LPI_UART_2 max=0.63V GPIOs.
  • Page 34 Smart LTE Module Series SC66 Hardware Design Reset signal of max=0.45V TP0_RST touch panel (TP0) min=1.35V Interrupt signal of max=0.63V TP0_INT touch panel (TP0) min=1.17V I2C clock signal of TP0_I2C_SCL touch panel (TP0) I2C data signal of TP0_I2C_SDA touch panel (TP0) 1.8V power domain.
  • Page 35 Smart LTE Module Series SC66 Hardware Design LCD0 MIPI lane 1 data DSI0_LN1_P signal (+) LCD0 MIPI lane 2 data DSI0_LN2_N signal (-) 85Ω differential impedance. LCD0 MIPI lane 2 data DSI0_LN2_P signal (+) LCD0 MIPI lane 3 data DSI0_LN3_N signal (-) 85Ω...
  • Page 36 Smart LTE Module Series SC66 Hardware Design impedance. signal (-) LCD1 MIPI lane 3 data DSI1_LN3_P signal (+) Camera Interfaces Pin Name Description Comment Characteristics MIPI clock signal of CSI1_CLK_N rear camera (-) 85Ω differential impedance. MIPI clock signal of...
  • Page 37 Smart LTE Module Series SC66 Hardware Design MIPI clock signal of CSI2_CLK_P depth camera (+) MIPI lane 0 data signal CSI2_LN0_N of depth camera (-) 85Ω differential impedance. MIPI lane 0 data signal CSI2_LN0_P of depth camera (+) MIPI lane 1 data signal...
  • Page 38 Smart LTE Module Series SC66 Hardware Design impedance. of front camera (-) MIPI lane 0 data signal CSI0_LN0_P of front camera (+) MIPI lane 1 data signal CSI0_LN1_N of front camera (-) 85Ω differential MIPI lane 1 data signal impedance.
  • Page 39 Smart LTE Module Series SC66 Hardware Design camera Power down signal of DCAM_PWDN 1.8V power domain. depth camera CAM_I2C_SDA I2C data signal of depth 1.8V power domain. camera CAM_I2C_SCL I2C data signal of depth 1.8V power domain. camera Keypad Interfaces...
  • Page 40 Smart LTE Module Series SC66 Hardware Design General purpose ADC Max input voltage: ADC0 interface 1.8V. General purpose ADC Max input voltage: ADC1 interface 1.8V. Antenna Interfaces Pin Name Description Comment Characteristics ANT_MAIN Main antenna interface Diversity antenna ANT_DRX interface 50Ω...
  • Page 41 Smart LTE Module Series SC66 Hardware Design GPIO_77 GPIO 1.8V power domain. GPIO_12 GPIO 1.8V power domain. GPIO_13 GPIO 1.8V power domain. GPIO_14 GPIO 1.8V power domain. GPIO_15 GPIO 1.8V power domain. GPIO_61 GPIO 1.8V power domain. GPIO_03B GPIO 1.8V power domain.
  • Page 42 Smart LTE Module Series SC66 Hardware Design Pin Name Description Comment Characteristics MI2S_2_WS I2S word select signal 1.8V power domain. MI2S_2_DATA0 I2S DATA0 signal 1.8V power domain. MI2S_2_SCK I2S serial clock signal 1.8V power domain. MI2S_2_DATA1 I2S DATA1 signal 1.8V power domain.

  • Page 43: Power Supply

    3.4. Power Supply 3.4.1. Power Supply Pins SC66 provides three VBAT pins, two VDD_RF pins and one VPH_PWR pin. VBAT pins must be connected to an external power supply. VDD_RF pins are used to connect bypass capacitors of external RF Power supply, so as to eliminate voltage fluctuation of RF part. VPH_PWR is used for powering other devices.

  • Page 44: Reference Design For Power Supply

    The power supply of SC66 should be able to provide sufficient current up to 3A at least. By default, it is recommended to use a battery to supply power for SC66. But if battery is not intended to be used, it is recommended to use a regulator for SC66.
  • Page 45 Smart LTE Module Series SC66 Hardware Design The following figure shows a reference design for +5V input power source which adopts an LDO (MIC29502WU) from MICROCHIP. The typical output voltage is 4.0V and the maximum rated current is 5.0A. MIC29502WU...

  • Page 46: Turn On And Off Scenarios

    Smart LTE Module Series SC66 Hardware Design 3.5. Turn on and off Scenarios 3.5.1. Turn on the Module Using PWRKEY The module can be turned on by driving PWRKEY pin to a low level for at least 3ms. PWRKEY pin is pulled to 1.8V internally.
  • Page 47 Smart LTE Module Series SC66 Hardware Design The timing of turning on Module is illustrated in the following figure. VBAT (Typ.: 4.0V) PWRKEY >3ms LDO13A_1P8 Software controlled Software LDO11A_1P8 controlled LDO7B_3P125 LDO14A_1P8 Others Active Figure 8: Timing of Turning on Module NOTE Make sure that VBAT is stable before pulling down PWRKEY pin.

  • Page 48: Turn On The Module Automatically

    Smart LTE Module Series SC66 Hardware Design 3.5.2. Turn on the Module Automatically The module can be turned on automatically with CBL_PWR_N. A reference circuit is shown below: CBL_PWR_N SC66 Figure 9: Turn on the Module Automatically NOTE If the module is turned on automatically through CBL_PWR_N, then it cannot be turned off unless the battery is removed.

  • Page 49: Vrtc Interface

    Smart LTE Module Series SC66 Hardware Design 3.6. VRTC Interface The RTC (Real Time Clock) can be powered by an external power source through VRTC when the module is powered down and there is no power supply for the VBAT. The external power source can be a rechargeable battery (such as a button cell battery) according to application demands.

  • Page 50: Power Output

    SC66 Hardware Design 3.7. Power Output SC66 supports output of regulated voltages for peripheral circuits. During application, it is recommended to connect a 33pF and a 10pF capacitor in parallel in the circuit to suppress high frequency noise. Table 10: Power Description...
  • Page 51 GND via a 47KΩ NTC resistor. SC66 module supports battery temperature detection in the condition that the battery integrates a thermistor (47K 1% NTC thermistor with B-constant of 4050K by default; SDNT1608X473F4050FTF of SUNLORD is recommended) and the thermistor is connected to VBAT_THERM pin. If VBAT_THERM pin is not connected, there will be malfunctions such as boot error, battery charging failure, battery level display error, etc.
  • Page 52 33pF Figure 12: Reference Design for Battery Charging Circuit SC66 offers a fuel gauge algorithm that is able to accurately estimate the battery’s state by current and voltage monitor techniques. Using precise measurements of battery voltage, current, and temperature, the fuel gauge provides a dependable state of charge estimate throughout the entire life of the battery and across a broad range of operating conditions.

  • Page 53: Usb Interfaces

    USB_VBUS can be powered by external power or USB adapter, mainly used for USB detection and battery charging. The input of USB_VBUS is 3.6V~10V, and the typical working voltage is 5V. The SC66 module supports the charge management of Li-ion and Li-polymer batteries, but different types or capacities of batteries require different charging parameters, and the maximum charging current can reach 3A.
  • Page 54 Smart LTE Module Series SC66 Hardware Design USB 2.0 differential data bus USB1_HS_DP USB_SS1_RX_P USB 3.1 differential receive (+) USB_SS1_RX_M USB 3.1 differential receive (-) USB 3.1 channel 1 differential USB_SS1_TX_P transmit (+) USB 3.1 channel 1 differential USB_SS1_TX_M transmit (-) USB 3.1 channel 2 differential...

  • Page 55: Displayport Mode

    Figure 13: USB Type-C Interface Reference Design 3.9.1.2. DisplayPort Mode SC66 supports DisplayPort mode with 4 lanes up to 4K@30ps over USB Type-C. The DisplayPort mode and USB Type-C mode cannot operate simultaneously. In the DisplayPort Mode, USB2.0 can be supported simultaneously and USB 3.1 cannot be supported simultaneously.

  • Page 56: Micro Usb Interface

    Figure 14: DisplayPort Reference Design 3.9.2. Micro USB Interface SC66 supports USB Type-C interface by default. Micro USB can be used via software configuration. Micro-USB interface can be supported through USB1_HS_DP/M or USB2_HS_DP/M. Micro-USB interface configured by USB1_HS_DP/M supports OTG and that configured by USB2_HS_DP/M only supports Host mode.
  • Page 57 Smart LTE Module Series SC66 Hardware Design Table 14: USB1 & USB2 Pin Description Comment Pin Name Pin No. Description USB 2.0 standard USB1_HS_DM USB 2.0 differential data bus (-) compliant; USB1_HS_DP USB 2.0 differential data bus (+) Support OTG.

  • Page 58: Usb Interface Design Considerations

    Smart LTE Module Series SC66 Hardware Design Figure 16: USB2 Host 3.9.3. USB Interface Design Considerations Table 15: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (DP-DM) USB1_HS_DP 46.15 1.20 USB1_HS_DM 44.95 USB_SS1_RX_P 39.75 0.00 USB_SS1_RX_M 39.75...

  • Page 59: Uart Interfaces

    Smart LTE Module Series SC66 Hardware Design  It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90Ω.  The ground reference plane must be continuous, without any cuts or any holes under the USB signals, to ensure impedance continuity.
  • Page 60 Figure 17: Reference Circuit with Level Translator Chip (for UART6) The following figure is an example of connection between SC66 and PC. A voltage level translator and a RS-232 level translator chip are recommended to be added between the module and PC, as shown...

  • Page 61: U)Sim Interfaces

    DEBUG UART, UART1, LPI_UART_2. 3.11. (U)SIM Interfaces SC66 provides two (U)SIM interfaces which both meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Both 1.8V and 2.95V (U)SIM cards are supported, and the (U)SIM interfaces are powered by the dedicated low dropout regulators in SC66 module.
  • Page 62 (U)SIM2 card power supply is supported. SC66 supports (U)SIM card hot-plug via the USIM_DET pin, which is disabled by default and can be enabled through software configuration. A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below.

  • Page 63: Sd Card Interface

    USIM_RST signal lines so as to filter RF interference, and they should be placed as close to the (U)SIM card connector as possible. 3.12. SD Card Interface SC66 module supports SD 3.0 specifications. The pin definition of the SD card interface is shown below. Table 18: Pin Definition of SD Card Interface Pin Name Pin No.
  • Page 64 Smart LTE Module Series SC66 Hardware Design Vnorm=2.95V SD_VDD Power supply for SD card max=600mA SD_PU_ SD card pull-up power Support 1.8V/2.95V power supply; supply The maximum drive current is 50mA. High speed digital clock SD_CLK signal of SD card...

  • Page 65: Gpio Interfaces

    SD_DATA1 24.30 SD_DATA2 24.25 SD_DATA3 24.30 3.13. GPIO Interfaces SC66 has abundant GPIO interfaces with power domain of 1.8V. The pin definition is listed below. Table 20: Pin Definition of GPIO Interfaces Pin Name Pin No. GPIO Default Status Comment...

  • Page 66: I2C Interfaces

    Wakeup: interrupt pins that can wake up the system. More details about GPIO configuration, please refer to the Quectel_SC66_GPIO_Configuration. 3.14. I2C Interfaces SC66 can provide up to five I2C Interfaces. As an open drain output, each I2C interface should be pulled SC66_Hardware_Design 65 / 139...

  • Page 67: I2S Interfaces

    Used for TP1. TP1_I2C_SDA TP I2C data 3.15. I2S Interfaces SC66 provides two I2S interfaces with one of them is a low-power I2S. The reference power domain of the interface is 1.8V. Table 22: Pin Definition of I2S Interfaces Pin Name...
  • Page 68 Smart LTE Module Series SC66 Hardware Design MI2S_2_DATA1 I2S serial data1 channel MI2S_2_MCLK I2S main clock LPI_MI2S_SCLK 212 LPI_I2S serial clock signal LPI_MI2S_WS LPI_I2S word select Cannot multiplexed into general-purpose GPIOs. LPI_MI2S_DATA0 154 LPI_I2S signal data0 LPI_MI2S_DATA1 155 LPI_I2S signal data1...

  • Page 69: Spi Interface

    Chip selection signal of SPI interface SPI3_CLK Clock signal of SPI interface 3.17. ADC Interfaces SC66 provides two analog-to-digital converter (ADC) interfaces, and the pin definition is shown below. Table 24: Pin Definition of ADC Interfaces Pin Name Pin No.

  • Page 70: Lcm Interfaces

    SC66 Hardware Design 3.18. LCM Interfaces SC66 video output interface (LCM interface) is based on MIPI_DSI standard and supports 8 groups of high-speed differential data transmission and WQXGA display (resolution: 2560 × 1600), Support dual display, default DSI+DP (Type-C), optional DSI0+DSI1. Note that DSI1 does not support screens with command mode.
  • Page 71 Smart LTE Module Series SC66 Hardware Design signal (-) LCD0 MIPI lane 2 data DSI0_LN2_P signal (+) LCD0 MIPI lane 3 data DSI0_LN3_N signal (-) LCD0 MIPI lane 3 data DSI0_LN3_P signal (+) DSI1_CLK_N LCD1 MIPI clock signal (-) LCD1 MIPI clock signal...
  • Page 72 Smart LTE Module Series SC66 Hardware Design GPIO_40 LCD1 PWM output Used as a GPIO by default The following are the reference designs for LCM interfaces. LCM can use external backlight drive circuit according to customer requirement. The reference design of the external backlight drive circuit is shown in the figure below, in which pins PWM (Pin 152 &...
  • Page 73 Smart LTE Module Series SC66 Hardware Design LDO3B_2P8 LDO11A_1P8 LEDA LCM0 _ LED+ LCM0 _LED- LEDK LPTE LCD0_TE RESET LCD0_ RST LCD_ID ADC0 NC (SDA-TP) NC (SCL-TP) NC (RST-TP) 4.7uF 100nF NC (EINT-TP) VIO18 VCC28 NC (VTP-TP) DSI0_LN3_P MIPI_TDP3 MIPI_TDN3...
  • Page 74 OTP register to distinguish different screens. Customers can also select the LCD_ID pin of LCM to connect the ADC pin of the SC66 module, but it should be noted that the output voltage of LCD_ID should not exceed the voltage range of the ADC pin.

  • Page 75: Touch Panel Interfaces

    Smart LTE Module Series SC66 Hardware Design 3.19. Touch Panel Interfaces SC66 provides two I2C interfaces for connection with Touch Panel (TP), and also provides the corresponding power supply and interrupt pins. The pin definition of touch panel interfaces is illustrated below.

  • Page 76: Camera Interfaces

    Based on standard MIPI CSI input interface, SC66 module supports 3 cameras (4-lane + 4-lane + 4-lane) or 4 cameras (4-lane + 4-lane + 2-lane + 1-lane), with maximum pixels up to 24MP for SC66. The video and photo quality are determined by various factors such as camera sensor, camera lens quality, etc.
  • Page 77 Smart LTE Module Series SC66 Hardware Design Camera AVDD power GPIO_04B LDO enable pin CSI0_CLK_N MIPI clock signal of front camera (-) CSI0_CLK_P MIPI clock signal of front camera (+) MIPI lane 0 data signal of front camera CSI0_LN0_N MIPI lane 0 data signal of front camera...
  • Page 78 Smart LTE Module Series SC66 Hardware Design CSI2_LN0_N MIPI data 0 signal of depth camera (-) CSI2_LN0_P MIPI data 0 signal of depth camera (+) MIPI lane 1 data signal of depth camera CSI2_LN1_N MIPI lane 1 data signal of depth camera...
  • Page 79 Smart LTE Module Series SC66 Hardware Design VPH_PWR VPH_PWR DVDD_REAR DVDD_FRONT LDO_IC LDO_IC GPIO_08B GPIO_5B Module Module 2.2uF 2.2uF 100K 100K VPH_PWR AVDD LDO_IC GPIO_04B Module 2.2uF 100K Figure 27: Reference Circuit Design for Dual Camera Applications The following is a reference circuit design for dual camera applications.
  • Page 80 Smart LTE Module Series SC66 Hardware Design LDO3B_2P8 AFVDD AVDD AVDD DVDD DVDD_REAR DOVDD LDO11A_1P8 M CAM_ RST MCAM_PWDN 2.2K 2.2K MCAM_MCLK CAM_I2C_ SDA0 CAM_ I2C_ SCL0 CSI1_LN3_P CSI1_LN3_N CSI1_LN2_P CSI1_LN2_N CSI1_LN1_P CSI1_LN1_N CSI1_LN0_P CSI1_LN0_N AVDD 4.7uF CSI1_ CLK_P CSI1_ CLK_N...
  • Page 81 Smart LTE Module Series SC66 Hardware Design The following is a reference circuit design for three-camera applications. LDO3B_1P8 AVDD DVDD_REAR LDO11A_1P8 M CAM_ RST MCAM_PWDN MCAM_MCLK CAM_I2C_SDA0 CAM_I2C_SCL0 CSI1_LN3_P CSI1_LN3_N CSI1_LN2_P CSI1_LN2_N CSI1_LN1_P CSI1_LN1_N CSI1_LN0_P CSI1_LN0_N DVDD_FRONT CSI1_ CLK_P DOVDD...

  • Page 82: Design Considerations

    Reset and PWDN signals are configured by using general-purpose GPIOs. 3.20.1. Design Considerations  Special attention should be paid to the pin definition of LCM/camera connectors. Assure the SC66 and the connectors are correctly connected.  MIPI are high speed signal lines, supporting maximum data rate up to 2.1Gbps. The differential impedance should be controlled to 85Ω.
  • Page 83 Smart LTE Module Series SC66 Hardware Design DSI0_LN2_N 26.55 0.00 DSI0_LN2_P 26.55 27.30 DSI0_LN3_N 0.00 27.30 DSI0_LN3_P DSI1_CLK_N 23.20 0.30 DSI1_CLK_P 23.50 DSI1_LN0_N 28.00 0.00 DSI1_LN0_P 28.00 DSI1_LN1_N 30.00 0.00 30.00 DSI1_LN1_P DSI1_LN2_N 33.50 0.00 DSI1_LN2_P 33.50 DSI1_LN3_N 37.50 0.00 DSI1_LN3_P 37.50...

  • Page 84: Sensor Interfaces

    -0.30 18.05 CSI0_LN3_P 3.21. Sensor Interfaces SC66 module supports communication with sensors via I2C interfaces, and it supports various sensors such as acceleration sensor, gyroscopic sensor, compass, optical sensor, temperature sensor. Table 29: Pin Definition of Sensor Interfaces Pin Name Pin No.

  • Page 85: Audio Interfaces

    Interrupt signal of gyroscopic sensor HALL_INT Interrupt signal of Hall sensor 3.22. Audio Interfaces SC66 module provides three analog input channels and three analog output channels. The following table shows the pin definition. Table 30: Pin Definition of Audio Interfaces Pin Name Pin No.

  • Page 86: Reference Circuit Design For Microphone Interface

    Smart LTE Module Series SC66 Hardware Design EAR_P Earpiece output (+) EAR_M Earpiece output (-) SPK_P Speaker output (+) SPK_M Speaker output (-) HPH_R Headphone right channel output It should be connected HPH_REF Headphone reference ground to main GND HPH_L...

  • Page 87: Reference Circuit Design For Earpiece Interface

    Smart LTE Module Series SC66 Hardware Design 100nF MIC_ BIAS MIC_GND MIC3_P MEMS- type Module 33pF Figure 31: Reference Circuit Design for MEMS-type Microphone 3.22.2. Reference Circuit Design for Earpiece Interface 33pF EAR_P 33pF EAR_M 33pF Module Figure 32: Reference Circuit Design for Earpiece Interface...

  • Page 88: Reference Circuit Design For Headphone Interface

    Smart LTE Module Series SC66 Hardware Design 3.22.3. Reference Circuit Design for Headphone Interface MIC_GND MIC2_P HPH_L HS_DET HPH_R HPH_REF D1 D2 D3 D4 33pF 33pF 33pF Module Figure 33: Reference Circuit Design for Headphone Interface 3.22.4. Reference Circuit Design for Loudspeaker Interface...

  • Page 89: Emergency Download Interface

    Smart LTE Module Series SC66 Hardware Design capacitor for filtering out high-frequency noises. The severity degree of the RF interference in the voice channel during GSM transmitting largely depends on the application design. In some cases, EGSM900 TDD noise is more severe; while in other cases, DCS1800 TDD noise is more obvious.

  • Page 90: Wi-Fi And Bt

    SC66 Hardware Design Wi-Fi and BT SC66 module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth (BT) functions. The interface impedance is 50Ω. External antennas such as PCB antenna, sucker antenna and ceramic antenna can be connected to the module via these interfaces, so as to achieve Wi-Fi and BT functions. In addition, SC66-A*, SC66-J*, SC66-E* and SC66-MW* also support ANT_WIFI_MIMO antenna interface to achieve higher Wi-Fi performance.
  • Page 91 Smart LTE Module Series SC66 Hardware Design 802.11n HT20 MCS0 15dBm±2.5dB 802.11n HT20 MCS7 13dBm±2.5dB 802.11n HT40 MCS0 14dBm±2.5dB 802.11n HT40 MCS7 13dBm±2.5dB 802.11a 6Mbps 15dBm±2.5dB 802.11a 54Mbps 13dBm±2.5dB 802.11n HT20 MCS0 15dBm±2.5dB 802.11n HT20 MCS7 13dBm±2.5dB 802.11n HT40 MCS0 15dBm±2.5dB...

  • Page 92: Wi-Fi Mimo Design Guidelines

    Maximize the distance between Wi-Fi MIMO antenna and DSI trace (including trace routing and antenna layout) to avoid mutual interference.  Space for locating EMI filter should be reserved in DSI trace. 4.2. BT Overview SC66 module supports BT5.0 (BR/EDR+BLE) specifications, as well as GFSK, 8-DPSK, π/4-DQPSK modulation modes. SC66_Hardware_Design 91 / 139...

  • Page 93: Bt Performance

    Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009  Bluetooth 5.0 RF-PHY Cover Standard: RF-PHY.TS.5.0.0, December 06, 2016 4.2.1. BT Performance The following table lists the BT transmitting and receiving performance of SC66 module. Table 34: BT Transmitting and Receiving Performance Transmitter Performance Packet Types 2-DH5 3-DH5 Transmitting Power 10dBm±2.5dB...

  • Page 94: Gnss

    Smart LTE Module Series SC66 Hardware Design GNSS SC66 module integrates a Qualcomm IZat™ GNSS engine (Gen 9) which supports multiple positioning and navigation systems including GPS, GLONASS and BeiDou. With an embedded LNA, the module provides greatly improved positioning accuracy.

  • Page 95: Gnss Rf Design Guidelines

    Smart LTE Module Series SC66 Hardware Design 5.2. GNSS RF Design Guidelines Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid these, please follow the design rules listed below: ...

  • Page 96: Antenna Interfaces

    Smart LTE Module Series SC66 Hardware Design Antenna Interfaces SC66 provides six antenna interfaces for main antenna, Rx-diversity/MIMO antenna, GNSS antenna, Wi-Fi/BT antenna, FM antenna and Wi-Fi MIMO antenna, respectively. The antenna interfaces have an impedance of 50Ω. 6.1. Main/Rx-diversity Antenna Interfaces The pin definition of main/Rx-diversity antenna interfaces is shown below.
  • Page 97 2010~2025 2010~2025 LTE-TDD B38 2570~2620 2570~2620 LTE-TDD B39 1880~1920 1880~1920 LTE-TDD B40 2300~2400 2300~2400 LTE-TDD B41 2555~2655 2555~2655 Table 38: SC66-A* Operating Frequencies 3GPP Band Receive Transmit Unit WCDMA B2 1930~1990 1850~1910 WCDMA B4 2110~2155 1710~1755 WCDMA B5 869~894 824~849...
  • Page 98 SC66 Hardware Design LTE-FDD B26 859~894 814~849 LTE-FDD B66 2110~2200 1710~1780 LTE-FDD B71 617~652 663~698 LTE-TDD B41 2496~2690 2496~2690 Table 39: SC66-J* Operating Frequencies 3GPP Band Receive Transmit Unit WCDMA B1 2110~2170 1920~1980 WCDMA B6 875~885 830~840 WCDMA B8 925~960...
  • Page 99 Smart LTE Module Series SC66 Hardware Design Table 40: SC66-E* Operating Frequencies 3GPP Band Receive Transmit Unit GSM850 869~894 824~849 EGSM900 925~960 880~915 DCS1800 1805~1880 1710~1785 PCS1900 1930~1990 1850~1910 WCDMA B1 2110~2170 1920~1980 WCDMA B2 1930~1990 1850~1910 WCDMA B4 2110~2155...

  • Page 100: Main And Rx-Diversity Antenna Interfaces Reference Design

    Smart LTE Module Series SC66 Hardware Design NOTES The bandwidth of LTE-TDD B41 for SC66-CE* and SC66-J* is 120MHz (2535MHz~2655MHz), and the corresponding channel ranges from 40040 to 41240. The bandwidth of LTE-TDD B41 for SC66-A and SC66-E is 200MHz (2496MHZ~2690MHz), and the corresponding channel ranges from 39650 to 41589.
  • Page 101 Smart LTE Module Series SC66 Hardware Design impedance. The following are reference designs of microstrip line or coplanar waveguide with different PCB structures. Figure 37: Microstrip Design on a 2-layer PCB Figure 38: Coplanar Waveguide Design on a 2-layer PCB...

  • Page 102: Wi-Fi/Bt Antenna Interface

    Smart LTE Module Series SC66 Hardware Design Figure 40: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ...
  • Page 103 Smart LTE Module Series SC66 Hardware Design MIMO NOTE SC66-CE and SC66-W do not support Wi-Fi MIMO function. Table 42: Wi-Fi/BT Frequency Type Frequency Unit 2402~2482 802.11a/b/g/n/ac 5180~5825 BT5.0 2402~2480 A reference circuit design for Wi-Fi/BT antenna interface is shown below. A π-type matching circuit is recommended to be reserved for better RF performance.

  • Page 104: Gnss Antenna Interface

    Smart LTE Module Series SC66 Hardware Design ANT_WIFI_MIMO Module Figure 42: Reference Circuit Design for Wi-Fi MINO Antenna Interface 6.3. GNSS Antenna Interface Table 43: Pin Definition of GNSS Antenna Pin Name Pin No. Description Comment ANT_GNSS GNSS antenna Interface 50Ω...

  • Page 105: Recommended Circuit For Passive Antenna

    Smart LTE Module Series SC66 Hardware Design 6.3.1. Recommended Circuit for Passive Antenna GNSS antenna interface supports passive ceramic antennas and other types of passive antennas. A reference circuit design is given below. Passive Antenna ANT_GNSS Module Figure 43: Reference Circuit Design for GNSS Passive Antenna...
  • Page 106 Smart LTE Module Series SC66 Hardware Design Active Antenna 100pF 56nH ANT_GNSS 100pF Module Figure 44: Reference Circuit Design for GNSS Active Antenna SC66_Hardware_Design 105 / 139...

  • Page 107: Antenna Installation

    Smart LTE Module Series SC66 Hardware Design 6.4. Antenna Installation 6.4.1. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity, Wi-Fi/BT antenna and GNSS antenna. Table 45: Antenna Requirements Antenna Type Requirements VSWR: ≤ 2 Gain (dBi): 1 Max Input Power (W): 50 Input Impedance (Ω): 50...

  • Page 108: Recommended Rf Connector For Antenna Installation

    Smart LTE Module Series SC66 Hardware Design 6.4.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by HIROSE. Figure 45: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.
  • Page 109 Smart LTE Module Series SC66 Hardware Design The following figure describes the space factor of mated connector. Figure 47: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. SC66_Hardware_Design 108 / 139...

  • Page 110: Electrical, Reliability And Radio Characteristics

    VBAT -0.5 USB_VBUS -0.5 Current on VBAT Voltage on Digital Pins -0.3 2.093 7.2. Power Supply Ratings Table 47: SC66 Module Power Supply Ratings Parameter Description Conditions Typ. Unit The actual input voltages must VBAT stay between the minimum and 3.55...

  • Page 111: Operation And Storage Temperatures

    Smart LTE Module Series SC66 Hardware Design Peak supply Maximum power control level current (during VBAT at EGSM900 transmission slot) USB_VBUS Power supply VRTC voltage of backup 3.25 battery 7.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table.

  • Page 112: Current Consumption

    Smart LTE Module Series SC66 Hardware Design 7.4. Current Consumption Table 49: SC66-CE* Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down Sleep (USB disconnected) @DRX=2 GSM/GPRS supply Sleep (USB disconnected) current @DRX=5 Sleep (USB disconnected) @DRX=9 Sleep (USB disconnected)
  • Page 113 Smart LTE Module Series SC66 Hardware Design Sleep (USB disconnected) @DRX=9 EGSM900 @PCL 5 EGSM900 @PCL 12 EGSM900 @PCL 19 GSM voice call DCS1800 @PCL 0 DCS1800 @PCL 7 DCS1800 @PCL 15 B1 @max power WCDMA voice call B8 @max power...
  • Page 114 LTE-FDD B8 @max power LTE data transfer LTE-TDD B34 @max power LTE-TDD B38 @max power LTE-TDD B39 @max power LTE-TDD B40 @max power LTE-TDD B41 @max power Table 50: SC66-A* Current Consumption Parameter Description Conditions Typ. Unit Power down OFF state...
  • Page 115 Smart LTE Module Series SC66 Hardware Design Sleep (USB disconnected) @DRX=8 Sleep (USB disconnected) @DRX=9 Sleep (USB disconnected) @DRX=6 LTE-TDD supply Sleep (USB disconnected) current @DRX=8 Sleep (USB disconnected) @DRX=9 B2 @max power WCDMA voice call B4 @max power B5 @max power...
  • Page 116 Smart LTE Module Series SC66 Hardware Design LTE-FDD B66 @max power LTE-TDD B71 @max power LTE-TDD B41 @max power Table 51: SC66-J* Current Consumption Parameter Description Conditions Typ. Unit Power down OFF state Sleep (USB disconnected) @DRX=6 WCDMA supply Sleep (USB disconnected)
  • Page 117 LTE-FDD B18 @max power transfer LTE-FDD B19 @max power LTE-FDD B21 @max power LTE-FDD B26 @max power LTE-FDD B28 (A+B) @max power LTE-TDD B41 @max power Table 52: SC66-E* Current Consumption Parameter Description Conditions Typ. Unit Power down OFF state...
  • Page 118 Smart LTE Module Series SC66 Hardware Design Sleep (USB disconnected) @DRX=8 Sleep (USB disconnected) @DRX=9 Sleep (USB disconnected) @DRX=6 LTE-FDD supply Sleep (USB disconnected) current @DRX=8 Sleep (USB disconnected) @DRX=9 Sleep (USB disconnected) @DRX=6 LTE-TDD supply Sleep (USB disconnected) current...
  • Page 119 Smart LTE Module Series SC66 Hardware Design B8 @max power GSM850 (1UL/4DL) @PCL 5 GSM850 (2UL/3DL) @PCL 5 GSM850 (3UL/2DL) @PCL 5 GSM850 (4UL/1DL) @PCL 5 EGSM900 (1UL/4DL) @PCL 5 EGSM900 (2UL/3DL) @PCL 5 EGSM900 (3UL/2DL) @PCL 5 EGSM900 (4UL/1DL) @PCL 5...
  • Page 120 Smart LTE Module Series SC66 Hardware Design DCS1800 (1UL/4DL) @PCL 2 DCS1800 (2UL/3DL) @PCL 2 DCS1800 (3UL/2DL) @PCL 2 DCS1800 (4UL/1DL) @PCL 2 PCS1900 (1UL/4DL) @PCL 2 PCS1900 (2UL/3DL) @PCL 2 PCS1900 (3UL/2DL) @PCL 2 PCS1900 (4UL/1DL) @PCL 2 B1 (HSDPA) @max power...

  • Page 121: Rf Output Power

    LTE-FDD B28 (A+B) @max power LTE-TDD B41 @max power NOTE “*” means under development. 7.5. RF Output Power The following table shows the RF output power of SC66 module. Table 53: SC66-CE* RF Output Power Frequency EGSM900 33dBm±2dB 5dBm±5dB DCS1800 30dBm±2dB...
  • Page 122 SC66 Hardware Design LTE-TDD B38 23dBm±2dB <-39dBm LTE-TDD B39 23dBm±2dB <-39dBm LTE-TDD B40 23dBm±2dB <-39dBm LTE-TDD B41 23dBm±2dB <-39dBm Table 54: SC66-A* RF Output Power Frequency WCDMA B2 24dBm+1/-3dB <-49dBm WCDMA B4 24dBm+1/-3dB <-49dBm WCDMA B5 24dBm+1/-3dB <-49dBm LTE-FDD B2 23dBm±2dB <-39dBm...
  • Page 123 Smart LTE Module Series SC66 Hardware Design Table 55: SC66-J* RF Output Power Frequency WCDMA B1 24dBm+1/-3dB <-49dBm WCDMA B6 24dBm+1/-3dB <-49dBm WCDMA B8 24dBm+1/-3dB <-49dBm WCDMA B19 24dBm+1/-3dB <-49dBm LTE-FDD B1 23dBm±2dB <-39dBm LTE-FDD B3 23dBm±2dB <-39dBm LTE-FDD B5 23dBm±2dB...
  • Page 124 Smart LTE Module Series SC66 Hardware Design WCDMA B2 24dBm+1/-3dB <-49dBm WCDMA B4 24dBm+1/-3dB <-49dBm WCDMA B5 24dBm+1/-3dB <-49dBm WCDMA B8 24dBm+1/-3dB <-49dBm LTE-FDD B1 23dBm±2dB <-39dBm LTE-FDD B2 23dBm±2dB <-39dBm LTE-FDD B3 23dBm±2dB <-39dBm LTE-FDD B4 23dBm±2dB <-39dBm LTE-FDD B5 23dBm±2dB...

  • Page 125: Rf Receiving Sensitivity

    Smart LTE Module Series SC66 Hardware Design 7.6. RF Receiving Sensitivity The following table shows the conducted RF receiving sensitivity of SC66 module. Table 57: SC66-CE* RF Receiving Sensitivity Receive Sensitivity (Typ.) Frequency 3GPP (SIMO) Primary Diversity SIMO EGSM900 -109dBm -102.4dBm...
  • Page 126 Smart LTE Module Series SC66 Hardware Design Table 58: SC66-A* RF Receiving Sensitivity Receive Sensitivity (Typ.) Frequency 3GPP (SIMO) Primary Diversity SIMO WCDMA B2 -104.7dBm WCDMA B4 -106.7dBm WCDMA B5 -104.7dBm LTE-FDD B2 (10M) -94.3dBm LTE-FDD B4 (10M) -96.3dBm LTE-FDD B5 (10M) -94.3dBm...
  • Page 127 LTE-FDD B19 (10M) -96.3dBm LTE-FDD B21 (10M) -96.3dBm LTE-FDD B26 (10M) -93.8dBm LTE-FDD B28 (A+B) -94.8dBm (10M) LTE-TDD B41 (10M) -94.3dBm Table 60: SC66-E* RF Receiving Sensitivity Receive Sensitivity (Typ.) Frequency 3GPP (SIMO) Primary Diversity SIMO GSM850 -102.4dBm EGSM900 -102.4dBm DCS1800 -102.4dBm...
  • Page 128 Smart LTE Module Series SC66 Hardware Design LTE-FDD B3 (10M) -93.3dBm LTE-FDD B4 (10M) -96.3dBm LTE-FDD B5 (10M) -94.3dBm LTE-FDD B7 (10M) -94.3dBm LTE-FDD B8 (10M) -93.3dBm LTE-FDD B20 (10M) -93.3dBm LTE-FDD B28 (A+B) -94.8dBm (10M) LTE-TDD B38 (10M) -96.3dBm LTE-TDD B39 (10M) -96.3dBm...

  • Page 129: Electrostatic Discharge

    The following table shows the electrostatic discharge characteristics of SC66 module. Table 61: ESD Characteristics (Temperature: 25°C, Humidity: 45%) Test Points...

  • Page 130: Mechanical Dimensions

    Smart LTE Module Series SC66 Hardware Design Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05mm unless otherwise specified. 8.1. Mechanical Dimensions of the Module...
  • Page 131 Smart LTE Module Series SC66 Hardware Design Figure 49: Module Bottom Dimensions (Top View) SC66_Hardware_Design 130 / 139...

  • Page 132: Recommended Footprint

    Smart LTE Module Series SC66 Hardware Design 8.2. Recommended Footprint Figure 50: Recommended Footprint (Top View) NOTES For easy maintenance of the module, keep about 3mm between the module and other components on host PCB. All RESERVED pins should be kept open and MUST NOT be connected to ground.

  • Page 133: Top And Bottom View Of The Module

    Figure 51: Top View of the Module Figure 52: Bottom View of the Module NOTE These are renderings of SC66 module. For authentic dimension and appearance, please refer to the module that you receive from Quectel. SC66_Hardware_Design 132 / 139...

  • Page 134: Storage, Manufacturing And Packaging

    Packaging 9.1. Storage SC66 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are shown below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.

  • Page 135: Manufacturing And Soldering

    Smart LTE Module Series SC66 Hardware Design 9.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass.

  • Page 136: Packaging

    Reflow Cycle Max reflow cycle 9.3. Packaging SC66 is packaged in tape and reel carriers. Each reel is 330mm in diameter and contains 200 modules. The following figures show the package details, measured in mm. Figure 54: Tape Dimensions SC66_Hardware_Design...
  • Page 137 Smart LTE Module Series SC66 Hardware Design Figure 55: Reel Dimensions Table 63: Reel Packaging Model Name MOQ for MP Minimum Package: 200pcs Minimum Package×4=800pcs Size: 398mm × 383mm × 83mm Size: 420mm × 350mm × 405mm SC66 N.W: 1.92kg N.W: 8.18kg...

  • Page 138: Appendix A References

    Smart LTE Module Series SC66 Hardware Design Appendix A References Table 64: Related Documents Document Name Remark Quectel_Smart_EVB-G2_User_Guide EVB User Guide for SC66 Quectel_SC66_GPIO_Configuration GPIO Configuration of SC66 Quectel_RF_Layout_Application_Note RF Layout Application Note Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide Quectel_SC66_Reference_Design...
  • Page 139 Smart LTE Module Series SC66 Hardware Design Electrostatic Discharge Frequency Division Duplex Full Rate GMSK Gaussian Minimum Shift Keying Global Positioning System Graphics Processing Unit Global System for Mobile Communications Half Rate HSDPA High Speed Down Link Packet Access HSPA...
  • Page 140 Smart LTE Module Series SC66 Hardware Design QPSK Quadrature Phase Shift Keying Radio Frequency Relative Humidity RHCP Right Hand Circularly Polarized Real Time Clock Receive Short Message Service Time Division Distortion Terminal Equipment Transmitting Direction UART Universal Asynchronous Receiver & Transmitter...

  • Page 141: Appendix B Gprs Coding Schemes

    Smart LTE Module Series SC66 Hardware Design Appendix B GPRS Coding Schemes Table 66: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits Data Rate Kb/s 9.05...

  • Page 142: Appendix C Gprs Multi-Slot Classes

    Smart LTE Module Series SC66 Hardware Design Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions.
  • Page 143 Smart LTE Module Series SC66 Hardware Design SC66_Hardware_Design 142 / 139...

  • Page 144: Appendix D Edge Modulation And Coding Schemes

    Smart LTE Module Series SC66 Hardware Design Appendix D EDGE Modulation and Coding Schemes Table 68: EDGE Modulation and Coding Schemes Coding Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot Schemes CS-1: GMSK 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK 13.4kbps 26.8kbps...
  • Page 145 Smart LTE Module Series SC66 Hardware Design Formatted: Heading 1 IC & FCC Requirement FCC Certification Requirements. Formatted: Justified, No widow/orphan control According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device.
  • Page 146 Smart LTE Module Series SC66 Hardware Design LTE BAND 2 LTE BAND 4 LTE BAND 5 LTE BAND 7 LTE BAND 12 LTE BAND 13 LTE BAND 14 LTE BAND 17 LTE BAND 25 LTE BAND 26(814-824) LTE BAND 26(824-849)
  • Page 147 Smart LTE Module Series SC66 Hardware Design when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;...
  • Page 148 Smart LTE Module Series SC66 Hardware Design de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product.

Table of Contents