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Quectel EG21-G Hardware Design

Quectel EG21-G Hardware Design

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EG21-G
Hardware Design
LTE Module Series
Rev. EG21-G_Hardware_Design_V1.0
Date: 2019-03-12
Status: Released
www.quectel.com

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Summary of Contents for Quectel EG21-G

  • Page 1 EG21-G Hardware Design LTE Module Series Rev. EG21-G_Hardware_Design_V1.0 Date: 2019-03-12 Status: Released www.quectel.com...
  • Page 2 QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION.

  • Page 3: About The Document

    LTE Module Series EG21-G Hardware Design About the Document History Revision Date Author Description Lorry XU/ 2019-03-11 Initial Harry HUANG EG21-G_Hardware_Design 2 / 100...

  • Page 4: Table Of Contents

    LTE Module Series EG21-G Hardware Design Contents About the Document ..........................2 Contents ..............................3 Table Index ............................... 5 Figure Index .............................. 7 Introduction ............................9 Safety Information ......................... 10 1.1. Product Concept ..........................11 General Description .......................11 2.1. Key Features ......................... 12 2.2.
  • Page 5 LTE Module Series EG21-G Hardware Design Behaviors of RI ........................51 3.17. USB_BOOT Interface ......................51 3.18. GNSS Receiver ..........................54 General Description ......................54 4.1. GNSS Performance ......................54 4.2. Layout Guidelines ......................... 55 4.3. Antenna Interfaces .......................... 56 Main/Rx-diversity Antenna Interfaces ..................
  • Page 6 TABLE 33: OPERATION AND STORAGE TEMPERATURES ................66 TABLE 34: EG21-G CURRENT CONSUMPTION ..................... 67 TABLE 35: GNSS CURRENT CONSUMPTION OF EG21-G MODULE ............71 TABLE 36: RF OUTPUT POWER ........................72 TABLE 37: EG21-G CONDUCTED RF RECEIVING SENSITIVITY ..............72 TABLE 38: ELECTROSTATICS DISCHARGE CHARACTERISTICS (25ºC, 45% RELATIVE HUMIDITY) ..
  • Page 7 LTE Module Series EG21-G Hardware Design TABLE 44: EDGE MODULATION AND CODING SCHEMES ................92 EG21-G_Hardware_Design 6 / 100...
  • Page 8 LTE Module Series EG21-G Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ....................... 15 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) ....................17 FIGURE 3: SLEEP MODE APPLICATION VIA UART ..................28 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP ............ 29 FIGURE 5: SLEEP MODE APPLICATION WITH RI ..................
  • Page 9 LTE Module Series EG21-G Hardware Design FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ....75 FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB) ................................... 75 FIGURE 43: MODULE TOP AND SIDE DIMENSIONS ..................77 FIGURE 44: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ..............

  • Page 10: Introduction

    This document can help customers quickly understand module interface specifications, electrical and mechanical details as well as other related information of EG21-G module. To facilitate its application in different fields, relevant reference design is also provided for customers’ reference. Associated with application note and user guide, customers can use the module to design and set up mobile applications easily.

  • Page 11: Safety Information

    EG21-G module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 12: Product Concept

    EG21-G module includes Data-only and Telematics versions. Data-only version does not support voice function, while Telematics version supports it. With a compact profile of 29.0mm × 32.0mm × 2.4mm, EG21-G can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc.

  • Page 13: Key Features

    LTE Module Series EG21-G Hardware Design 2.2. Key Features The following table describes the detailed features of EG21-G module. Table 2: Key Features of EG21-G Module Feature Details Supply voltage: 3.3V~4.3V Power Supply Typical supply voltage: 3.8V Class 4 (33dBm±2dB) for GSM850 Class 4 (33dBm±2dB) for EGSM900...
  • Page 14 SD Card Interface Rx-diversity Support LTE/WCDMA Rx-diversity Gen8C Lite of Qualcomm GNSS Features Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT AT Commands commands Two pins including NET_MODE and NET_STATUS to indicate network Network Indication connectivity status...

  • Page 15: Functional Diagram

    When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. 3. “*” means under development. 2.3. Functional Diagram The following figure shows a block diagram of EG21-G and illustrates the major functional parts.  Power management ...

  • Page 16: Evaluation Board

    NOTE “*” means under development. 2.4. Evaluation Board In order to help customers develop applications with EG21-G, Quectel supplies an evaluation board (EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. EG21-G_Hardware_Design...

  • Page 17: Application Interfaces

    LTE Module Series EG21-G Hardware Design Application Interfaces 3.1. General Description EG21-G is equipped with 144 LGA pads that can be connected to cellular application platform. Sub-interfaces included in these pads are described in detail in the following chapters:  Power supply ...

  • Page 18: Pin Assignment

    LTE Module Series EG21-G Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EG21-G module. WAKEUP_IN AP_READY RESERVED W_DISABLE# NET_MODE NET_STATUS ANT_MAIN VDD_EXT 14 1 14 4 RESERVED RESERVED 14 2 14 3 RESERVED RESERVED ANT_GNSS...

  • Page 19: Pin Description

    LTE Module Series EG21-G Hardware Design 3.3. Pin Description The following tables show the pin definition of EG21-G modules. Table 3: I/O Parameters Definition Type Description Analog input Analog output Digital input Digital output Bidirectional Open drain Power input Power output...
  • Page 20 LTE Module Series EG21-G Hardware Design 56, 72, 85~112 Turn on/off Pin Name Pin No. Description DC Characteristics Comment The output voltage is max=2.1V Turn on/off the 0.8V because of the PWRKEY min=1.3V module diode drop in the max=0.5V Qualcomm chipset.
  • Page 21 LTE Module Series EG21-G Hardware Design Pin Name Pin No. Description DC Characteristics Comment Specified ground for Connect (U)SIM card USIM_GND (U)SIM card connector GND. For 1.8V (U)SIM: Vmax=1.9V Vmin=1.7V Either 1.8V or 3.0V is Power supply for USIM_VDD For 3.0V (U)SIM:...
  • Page 22 LTE Module Series EG21-G Hardware Design Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain. max=0.45V Ring indicator If unused, keep it min=1.35V open. 1.8V power domain. Data carrier max=0.45V If unused, keep it detection min=1.35V open. 1.8V power domain.
  • Page 23 LTE Module Series EG21-G Hardware Design analog to digital 0.3V to VBAT_BB open. converter General purpose Voltage range: If unused, keep it ADC1 analog to digital 0.3V to VBAT_BB open. converter PCM Interface Pin Name Pin No. Description DC Characteristics Comment min=-0.3V...
  • Page 24 LTE Module Series EG21-G Hardware Design min=1.4V according to SD card min=-0.3V supported level, max=0.58V please refer to SD 3.0 min=1.27V protocol for more max=2.0V details. If unused, keep it 3.0V signaling: open. max=0.38V min=2.01V min=-0.3V max=0.76V min=1.72V max=3.34V 1.8V signaling: max=0.45V...
  • Page 25 LTE Module Series EG21-G Hardware Design 1.8V signaling: max=0.45V min=1.4V min=-0.3V SDIO signal level can max=0.58V be selected min=1.27V according to SD card max=2.0V supported level, SD card SDIO bus SDC2_ please refer to SD 3.0 DATA0 DATA0 3.0V signaling: protocol for more max=0.38V...
  • Page 26 LTE Module Series EG21-G Hardware Design 1.8V/2.85V configurable. SD card SDIO bus Cannot be used for max=50mA VDD_SDIO pull-up power SD card power. If unused, keep it open. BT UART Interface* min=-0.3V 1.8V power domain. BT UART request to max=0.6V...

  • Page 27: Operating Modes

    118~138, 140~144 NOTES 1. Pads 24~27 are multiplexing pins used for audio design on EG21-G module and BT function on FC20 module. 2. “*” means under development. 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters.

  • Page 28: Power Saving

    VBAT_RF and VBAT_BB) remains applied. 3.5. Power Saving 3.5.1. Sleep Mode EG21-G is able to reduce its current consumption to a minimum value during the sleep mode. The following section describes power saving procedures of EG21-G module. 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter into sleep mode.

  • Page 29: Usb Application With Usb Remote Wakeup Function

     Driving the host DTR to low level will wake up the module.  When EG21-G has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.19 for details about RI behaviors.  AP_READY will detect the sleep state of the host (can be configured to high level or low level detection).

  • Page 30: Usb Application With Usb Suspension/Resume And Ri Function

    Sending data to EG21-G through USB will wake up the module.  When EG21-G has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspension/Resume and RI Function If the host supports USB suspension and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host.

  • Page 31: Usb Application Without Usb Suspension Function

    Sending data to EG21-G through USB will wake up the module.  When EG21-G has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspension Function If the host does not support USB suspension function, USB_VBUS should be disconnected via an additional control circuit to let the module enter into sleep mode.

  • Page 32: Power Supply

    2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EG21-G provides four VBAT pins to connect with the external power supply, and there are two separate voltage domains for VBAT. ...

  • Page 33: Decrease Voltage Drop

    LTE Module Series EG21-G Hardware Design 56, 72, 85~112 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network.

  • Page 34: Reference Design For Power Supply

    LTE Module Series EG21-G Hardware Design Figure 8: Star Structure of the Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module.

  • Page 35: Power-On And Off Scenarios

    Qualcomm chipset. When EG21-G is in power-down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms. It is recommended to use an open drain/collector driver to control the PWRKEY.

  • Page 36: Turn Off Module

    LTE Module Series EG21-G Hardware Design Figure 11: Turn on the Module by Using Keystroke The power-on scenario is illustrated in the following figure. NOTE VBA T ≥500ms ≥1.3V PWRKEY ≤0.5V Abo ut 100ms VDD_EXT ≥100ms. Ater thi s time, the BOOT_CONFIG pin can be se t high level by external circu it.

  • Page 37: Turn Off Module Using The Pwrkey Pin

    LTE Module Series EG21-G Hardware Design 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-down procedure after the PWRKEY is released. The power-off scenario is illustrated in the following figure.
  • Page 38 LTE Module Series EG21-G Hardware Design Table 8: RESET_N Pin Description Pin Name Pin No. Description Comment RESET_N Reset the module 1.8V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N.

  • Page 39: U)Sim Interface

    Reset signal of (U)SIM card USIM_ 1.8V power domain. (U)SIM card insertion detection PRESENCE If unused, keep it open. Specified ground for (U)SIM USIM_GND card EG21-G supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level EG21-G_Hardware_Design 38 / 100...
  • Page 40 LTE Module Series EG21-G Hardware Design and high level detections, and is disabled by default. Please refer to document [2] for more details about AT+QSIMDET command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.

  • Page 41: Usb Interface

    (U)SIM card connector. 3.10. USB Interface EG21-G contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB*.
  • Page 42 LTE Module Series EG21-G Hardware Design For more details about the USB 2.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers’ designs. The following figure shows a reference circuit of USB interface.

  • Page 43: Uart Interfaces

    LTE Module Series EG21-G Hardware Design EG21-G module can only be used as a slave device. “*” means under development. 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features.
  • Page 44 LTE Module Series EG21-G Hardware Design The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Parameter Min. Max. Unit -0.3 0.45 1.35 The module provides 1.8V UART interface. A level translator should be used if customers’ application is equipped with a 3.3V UART interface.

  • Page 45: Pcm And I2C Interfaces

    Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EG21-G provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface: ...
  • Page 46 LTE Module Series EG21-G Hardware Design 125us PCM_CLK PCM_SYNC PCM_OUT PCM_IN Figure 22: Primary Mode Timing 125us PCM_CLK PCM_SYNC PCM_OUT PCM_IN Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design.

  • Page 47: Sd Card Interface

    NOTES It is recommended to reserve an RC (R=22Ω, C=22pF) circuits on the PCM lines, especially for PCM_CLK. EG21-G works as a master device pertaining to I2C interface. 3.13. SD Card Interface EG21-G supports SDIO 3.0 interface for SD card.
  • Page 48 LTE Module Series EG21-G Hardware Design Table 15: Pin Definition of SD Card Interface Pin Name Pin No. Description Comment SDC2_DATA3 SD card SDIO bus DATA3 SDC2_DATA2 SD card SDIO bus DATA2 SDIO signal level can be selected according to SD...

  • Page 49: Adc Interfaces

    LTE Module Series EG21-G Hardware Design should be provided. As the maximum output current of VDD_SDIO is 50mA which can only be used for SDIO pull-up resistors, an externally power supply is needed for SD card.  To avoid jitter of bus, resistors R7~R11 are needed to pull up the SDIO to VDD_SDIO. Value of these resistors is among 10KΩ~100KΩ...

  • Page 50: Network Status Indication

    LTE Module Series EG21-G Hardware Design Table 17: Characteristic of ADC Parameter Min. Typ. Max. Unit VBAT_BB ADC0 Voltage Range VBAT_BB ADC1 Voltage Range ADC Resolution Bits NOTES ADC input voltage must not exceed VBAT_BB. It is prohibited to supply any voltage to ADC pins when VBAT is removed.

  • Page 51: Status

    LTE Module Series EG21-G Hardware Design Flicker slowly (1800ms High/200ms Low) Idle Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. Module VBAT 2.2K 4.7K Network Indicator Figure 26: Reference Circuit of the Network Indicator 3.16.

  • Page 52: Behaviors Of Ri

    LTE Module Series EG21-G Hardware Design Module Module VBAT VDD_MCU 2.2K STATUS MCU_GPIO STATUS Figure 27: Reference Circuits of STATUS 3.17. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port a URC is presented, the URC will trigger the behavior of RI pin.
  • Page 53 LTE Module Series EG21-G Hardware Design EG21-G provides a USB_BOOT pin. Customers can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter into emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface.
  • Page 54 LTE Module Series EG21-G Hardware Design Figure 29: Timing Sequence for Entering into Emergency Download Mode NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. 2. When using MCU to control module to enter into the forced download mode, follow the above timing sequence.

  • Page 55: Gnss Receiver

    EG21-G supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EG21-G GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3].

  • Page 56: Layout Guidelines

    LTE Module Series EG21-G Hardware Design @open sky XTRA enabled Accuracy Autonomous CEP-50 <4 (GNSS) @open sky NOTES Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes.

  • Page 57: Antenna Interfaces

    EG21-G Hardware Design Antenna Interfaces EG21-G antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The impedance of the antenna port is 50Ω.
  • Page 58 LTE Module Series EG21-G Hardware Design WCDMA B2 1850~1910 1930~1990 WCDMA B4 1710~1755 2110~2155 WCDMA B5 824~849 869~894 WCDMA B6 830~840 875~885 WCDMA B8 880~915 925~960 WCDMA B19 830~845 875~890 LTE-FDD B1 1920~1980 2110~2170 LTE-FDD B2 1850~1910 1930~1990 LTE-FDD B3...

  • Page 59: Reference Design Of Rf Antenna Interface

    LTE Module Series EG21-G Hardware Design 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default.
  • Page 60 LTE Module Series EG21-G Hardware Design Figure 31: Microstrip Design on a 2-layer PCB Figure 32: Coplanar Waveguide Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EG21-G_Hardware_Design 59 / 100...

  • Page 61: Gnss Antenna Interface

    LTE Module Series EG21-G Hardware Design Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, the following principles should be complied with in RF layout design:  Use an impedance simulation tool to control the characteristic impedance of RF traces as 50Ω.

  • Page 62: Antenna Installation

    LTE Module Series EG21-G Hardware Design Table 27: GNSS Frequency Type Frequency Unit GPS/Galileo/QZSS 1575.42±1.023 GLONASS 1597.5~1605.8 BeiDou 1561.098±2.046 A reference design of GNSS antenna is shown as below. GNSS 0.1uF Antenna Module 47nH 100pF ANT_GNSS Figure 35: Reference Circuit of GNSS Antenna NOTES An external LDO can be selected to supply power according to the active antenna requirement.

  • Page 63: Recommended Rf Connector For Antenna Installation

    LTE Module Series EG21-G Hardware Design Table 28: Antenna Requirements Type Requirements Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: <2 (Typ.) Passive antenna gain: >0dBi GNSS Active antenna noise figure: <1.5dB Active antenna gain: >-2dBi Active antenna embedded LNA gain: 20dB (Typ.) Active antenna total gain: >18dBi (Typ.)
  • Page 64 LTE Module Series EG21-G Hardware Design Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 37: Mechanicals of U.FL-LP Connectors EG21-G_Hardware_Design 63 / 100...
  • Page 65 LTE Module Series EG21-G Hardware Design The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com. EG21-G_Hardware_Design 64 / 100...

  • Page 66: Electrical, Reliability And Radio Characteristics

    LTE Module Series EG21-G Hardware Design Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 29: Absolute Maximum Ratings Parameter Min.

  • Page 67: Power Supply Ratings

    LTE Module Series EG21-G Hardware Design 6.2. Power Supply Ratings Table 30: The Module Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit The actual input voltages VBAT_BB and must stay between the VBAT_RF minimum and maximum VBAT values.

  • Page 68: Current Consumption

    LTE Module Series EG21-G Hardware Design 6.4. Current Consumption Table 32: EG21-G Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM @DRX=2 (USB disconnected) GSM @DRX=5 (USB disconnected) GSM @DRX=5 (USB suspended) GSM @DRX=9 (USB disconnected)
  • Page 69 LTE Module Series EG21-G Hardware Design LTE-TDD @PF=64 (USB suspended) LTE-TDD @PF=128 (USB disconnected) LTE-TDD @PF=256 (USB disconnected) EGSM @DRX=5 (USB disconnected) EGSM @DRX=5 (USB connected) WCDMA @PF=64 (USB disconnected) WCDMA @PF=64 (USB connected) Idle state LTE-FDD @PF=64 (USB disconnected)
  • Page 70 LTE Module Series EG21-G Hardware Design GSM900 4DL/1UL @27dBm GSM900 3DL/2UL @26dBm GSM900 2DL/3UL @24dBm GSM900 1DL/4UL @23dBm GSM850 4DL/1UL @27dBm GSM850 3DL/2UL @26dBm GSM850 2DL/3UL @24dBm EDGE data GSM850 1DL/4UL @23dBm transfer DCS1800 4DL/1UL @26dBm (GNSS OFF) DCS1800 3DL/2UL @25dBm...
  • Page 71 LTE Module Series EG21-G Hardware Design WCDMA B8 HSUPA @20.5dBm WCDMA B19 HSDPA @21dBm WCDMA B19 HSUPA @20.5dBm LTE-FDD B1 @22.3dBm LTE-FDD B2 @22.3dBm LTE-FDD B3 @22.3dBm LTE-FDD B4 @22.3dBm LTE-FDD B5 @22.3dBm LTE-FDD B7 @22.3dBm LTE-FDD B8 @22.3dBm LTE-FDD B12 @22.3dBm LTE-FDD B13 @22.3dBm...
  • Page 72 WCDMA B2 @22.5dBm WCDMA B4 @22.5dBm WCDMA WCDMA B5 @22.5dBm voice call WCDMA B6 @22.5dBm WCDMA B8 @22.5dBm WCDMA B19 @22.5dBm Table 33: GNSS Current Consumption of EG21-G Module Parameter Description Conditions Typ. Unit Cold start @Passive Antenna Searching (AT+CFUN=0)

  • Page 73: Rf Output Power

    LTE Module Series EG21-G Hardware Design 6.5. RF Output Power The following table shows the RF output power of EG21-G module. Table 34: RF Output Power Frequency Max. Min. GSM850/EGSM900 33dBm±2dB 5dBm±5dB DCS1800/PCS1900 30dBm±2dB 0dBm±5dB DCS1800/PCS1900 (8-PSK) 26dBm±3dB 0dBm±5dB GSM850/EGSM900 33dBm±2dB...
  • Page 74 LTE Module Series EG21-G Hardware Design PCS1900MHz -107.5dBm -102dBm WCDMA B1 -108.2dBm -108.5dBm -109.2dBm -106.7dBm WCDMA B2 -109.5dBm -109dBm -110dBm -104.7dBm WCDMA B4 -109.5dBm -106.7dBm WCDMA B5 -109.2dBm -109.5dBm -110.4dBm -104.7dBm WCDMA B6 -109dBm -109.5dBm -110.5dBm -106.7dBm WCDMA B8 -109.5dBm -103.7dBm...

  • Page 75: Electrostatic Discharge

    LTE Module Series EG21-G Hardware Design LTE-TDD B40 (10M) -97.8dBm -97.5dBm -99.2dBm -96.3dBm LTE-TDD B41 (10M) -97.3dBm -97.4dBm -99dBm -94.3dBm 6.7. Electrostatic Discharge The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module.
  • Page 76 LTE Module Series EG21-G Hardware Design  The heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure.
  • Page 77 LTE Module Series EG21-G Hardware Design NOTES The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will...

  • Page 78: Mechanical Dimensions

    LTE Module Series EG21-G Hardware Design Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ±0.05mm. 7.1. Mechanical Dimensions of the Module (32+/-0.15) 2.4+/-0.2...
  • Page 79 LTE Module Series EG21-G Hardware Design 32㊣ 0.15 1.90 1.30 3.85 3.35 5.96 1.30 1.30 0.82 1.15 2.15 4.88 1.10 1.10 1.05 6.75 0.80 1.25 2.49 1.50 2.40 3.45 1.30 Figure 42: Module Bottom Dimensions (Bottom View) EG21-G_Hardware_Design 78 / 100...

  • Page 80: Recommended Footprint

    For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. EG21-G share the same recommended footprint with EC25, but different recommended stencil. Refer to document [4] for more information. EG21-G_Hardware_Design...

  • Page 81: Design Effect Drawings Of The Module

    Figure 44: Top View of the Module Figure 45: Bottom View of the Module NOTE These are design effect drawings of EG21-G module. For more accurate pictures, please refer to the module that you get from Quectel. EG21-G_Hardware_Design 80 / 100...

  • Page 82: Storage, Manufacturing And Packaging

    Storage, Manufacturing and Packaging 8.1. Storage EG21-G is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: ...

  • Page 83: Manufacturing And Soldering

    LTE Module Series EG21-G Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass.

  • Page 84: Packaging

    2D barcode is still readable, although white rust may be found. 8.3. Packaging EG21-G is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250pcs modules. The figure below shows the package details, measured in mm.
  • Page 85 LTE Module Series EG21-G Hardware Design 48.5 Cover tape Direction of feed +0.20 44.5 -0.00 Figure 47: Tape and Reel Specifications 1083 Carrier tape Carrier tape packing module unfolding Figure 48: Tape and Reel Directions EG21-G_Hardware_Design 84 / 100...

  • Page 86: Appendix A References

    LTE Module Series EG21-G Hardware Design Appendix A References Table 38: Related Documents Document Name Remark Power management application note Quectel_EC2x&EGxx&EM05_Power_Management_ for EC25, EC21, EC20 R2.0, EC20 Application_Note R2.1, EG95, EG91, EG25-G and EM05 modules Quectel_EG25-G _AT_Commands_Manual EG25-G AT Commands Manual GNSS AT Commands Manual for Quectel_EC2x&EGxx&EM05_GNSS_AT_Commands_...
  • Page 87 LTE Module Series EG21-G Hardware Design Circuit Switched Data Clear To Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over The Air Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate...
  • Page 88 LTE Module Series EG21-G Hardware Design MIMO Multiple Input Multiple Output Mobile Originated Mobile Station (GSM engine) Mobile Terminated Password Authentication Protocol Printed Circuit Board Protocol Data Unit Paging Frame Point-to-Point Protocol Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying...
  • Page 89 LTE Module Series EG21-G Hardware Design (U)SIM (Universal )Subscriber Identity Module Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value...

  • Page 90: Appendix B Gprs Coding Schemes

    LTE Module Series EG21-G Hardware Design Appendix B GPRS Coding Schemes Table 40: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits Data Rate Kb/s 9.05...

  • Page 91: Appendix C Gprs Multi-Slot Classes

    LTE Module Series EG21-G Hardware Design Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions.
  • Page 92 LTE Module Series EG21-G Hardware Design EG21-G_Hardware_Design 91 / 100...

  • Page 93: Appendix D Edge Modulation And Coding Schemes

    LTE Module Series EG21-G Hardware Design Appendix D EDGE Modulation and Coding Schemes Table 42: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK 13.4kbps 26.8kbps 53.6kbps...
  • Page 94 LTE Module Series EG21-G Hardware Design IC & FCC Requirement FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1.
  • Page 95 LTE Module Series EG21-G Hardware Design conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna...
  • Page 96 LTE Module Series EG21-G Hardware Design IC Statement IRSS-GEN "This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.

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