Manufacturing And Soldering - Quectel L76 Hardware Design

5. If needed, the pre-baking should follow the requirements below:
⚫
The modules should be baked for 8 hours at 120 ± 5 ° C;
⚫
All the modules must be soldered to the PCB within 24 hours after the baking, otherwise they
should be put in a dry environment such as a drying oven.
NOTE
1. To avoid blistering, layer separation and other soldering issues, extended exposure of the modules
to the air is forbidden.
2. Take out the modules from the package and put them on high-temperature-resistant fixtures before
baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in
the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking
procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

8.3. Manufacturing and Soldering

Push the squeegee to apply solder paste on the surface of stencil, thus making the paste fill the stencil
openings and then penetrate the PCB. Apply proper force on the squeegee to produce a clean stencil
surface on a single pass. For more information about the stencil thickness for the modules, see
document [4].
The peak reflow temperature should be 235–246 º C, with 246 º C as the absolute maximum reflow
temperature. To avoid module damage caused by repeated heating, it is strongly recommended that the
modules should be mounted to the PCB only after reflow soldering of the other side of PCB has been
completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related
parameters are shown in the figure and table below.
L76&L76-L_Hardware_Design
GNSS Module Series
52 / 59