Quectel LTE-A Series Hardware Design page 10

Hide thumbs Also See for LTE-A Series:
Table of Contents

Advertisement

FIGURE 40: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)
................................................................................................................................................................... 77
FIGURE 41: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)
................................................................................................................................................................... 78
FIGURE 42: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 79
FIGURE 43: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 80
FIGURE 44: SPACE FACTOR OF MATING PLUGS (UNIT: MM) .................................................................... 80
FIGURE 45: REFERENCE DESIGN OF HEATSINK (HEATSINK AT THE TOP OF THE MODULE) ............. 90
FIGURE 46: REFERENCE DESIGN OF HEATSINK (HEATSINK AT THE BACKSIDE OF PCB) ................... 90
FIGURE 47: RESPONSE OF AT+QTEMP ....................................................................................................... 91
FIGURE 48: TEMPERATURE SENSOR DISTRIBUTION ................................................................................ 92
FIGURE 49: MODULE TOP AND SIDE DIMENSIONS (UNIT: MM) ................................................................ 93
FIGURE 50: MODULE BOTTOM DIMENSIONS (TOP VIEW, UNIT: MM) ....................................................... 94
FIGURE 51: RECOMMENDED FOOTPRINT (TOP VIEW, UNIT: MM) ........................................................... 95
FIGURE 52: TOP VIEW OF THE MODULE ...................................................................................................... 96
FIGURE 53: BOTTOM VIEW OF THE MODULE .............................................................................................. 96
FIGURE 54: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 98
FIGURE 55: TAPE SPECIFICATIONS (UNIT: MM) .......................................................................................... 99
FIGURE 56: REEL SPECIFICATIONS (UNIT: MM) ........................................................................................ 100
EG18_Hardware_Design
LTE-A Module Series
EG18 Hardware Design
9 / 104

Advertisement

Table of Contents
loading

This manual is also suitable for:

Eg18 seriesEg18-eaEg18-na

Table of Contents