Electrostatic Discharge; Thermal Considerations - Quectel LTE-A Series Hardware Design

NOTES
1)
SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple
antennas at the receiver side, which can improve Rx performance.

6.7. Electrostatic Discharge

The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is
important to refer ESD handling precautions applying ESD sensitive components. Proper ESD handling
and packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module's electrostatic discharge characteristics (at temperature of 25° C
and relative humidity of 45%).
Table 46: Electrostatic Discharge Characteristics
Tested Points
VBAT, GND
Antenna Interfaces
Other Interfaces

6.8. Thermal Considerations

In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal considerations:

For PCB design, please keep placement of the module away from heat sources, especially high
power components such as ARM processor, audio power amplifier, power supply, etc.

Do not place components on the opposite side of the PCB area where the module is mounted and do
not fill that area with solder mask considering the need of adding heatsink when necessary.

The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.

Make sure the ground pads of the module and PCB are fully connected.

According to demands for specific applications, the heatsink can be mounted on the top of the
module, or the opposite side of the PCB area where the module is mounted, or both of them.
EG18_Hardware_Design
Contact Discharge
± 5
± 4
± 0.5
LTE-A Module Series
EG18 Hardware Design
Air Discharge
± 10
± 8
± 1
Unit
kV
kV
kV
89 / 104