Quectel LTE-A Series Hardware Design page 6

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7
Mechanical Dimensions .................................................................................................................... 93
7.1.
Mechanical Dimensions of the Module.................................................................................... 93
7.2.
Recommended Footprint ......................................................................................................... 95
7.3.
Design Effect Drawings of the Module .................................................................................... 96
8
Storage, Manufacturing and Packaging .......................................................................................... 97
8.1.
Storage .................................................................................................................................... 97
8.2.
Manufacturing and Soldering .................................................................................................. 98
8.3.
Packaging ................................................................................................................................ 99
9
Appendix A References ................................................................................................................... 101
EG18_Hardware_Design
LTE-A Module Series
EG18 Hardware Design
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