7
Mechanical Dimensions .................................................................................................................... 93
7.1.
7.2.
Recommended Footprint ......................................................................................................... 95
7.3.
8
8.1.
Storage .................................................................................................................................... 97
8.2.
8.3.
Packaging ................................................................................................................................ 99
9
Appendix A References ................................................................................................................... 101
EG18_Hardware_Design
LTE-A Module Series
EG18 Hardware Design
5 / 104