Equipotential Bonding - Siemens SIMATIC RF600 Series System Manual

What interference can affect RFID?
Table 4- 16
Interference source
Switched-mode power supply Interference emitted from the
Interference injected through
the cables connected in
series
HF interference over the
antennas
4.9.5

Equipotential bonding

Potential differences between different parts of a plant can arise due to the different design
of the plant components and different voltage levels. If the plant components are connected
across signal cables, transient currents flow across the signal cables. These transient
currents can corrupt the signals.
Proper equipotential bonding is thus essential.
● The equipotential bonding conductor must have a sufficiently large cross section (at least
10 mm
● The distance between the signal cable and the associated equipotential bonding
conductor must be as small as possible (antenna effect).
● A fine-strand conductor must be used (better high-frequency conductivity).
● When connecting the equipotential bonding conductors to the centralized equipotential
bonding strip (EBS), the power components and non-power components must be
combined.
● The equipotential bonding conductors of the separate modules must lead directly to the
equipotential bonding strip.
SIMATIC RF600
System Manual, 11/2018, J31069-D0171-U001-A21-7618
Interference sources: Causes and remedies
Cause
current infeed
Cable is inadequately shield-
ed
The reader is not connected
to ground.
caused by another reader
).
2
4.9 Guidelines for electromagnetic compatibility (EMC)
Remedy
Replace the power supply
Better cable shielding
Ground the reader
Position the antennas further
•
apart.
Erect suitable damping materials
•
between the antennas.
Reduce the power of the readers.
•
Please follow the instructions in the
section
the effects of metal
RF600 system planning
Installation guidelines/reducing
91