Equipotential Bonding; Rf300 - Siemens SIMATIC RF300 System Manual

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Figure 4-27

Note

All coils in the cabinet should be suppressed. The valves and motor brakes are frequently

forgotten. Fluorescent lamps in the control cabinet should be tested in particular.

4.7.7

Equipotential bonding

Potential differences between different parts of a plant can arise due to the different design

of the plant components and different voltage levels. If the plant components are connected

across signal cables, transient currents flow across the signal cables. These transient

currents can corrupt the signals.

Proper equipotential bonding is thus essential.

● The equipotential bonding conductor must have a sufficiently large cross section (at least

● The distance between the signal cable and the associated equipotential bonding

● A fine-strand conductor must be used (better high-frequency conductivity).

● When connecting the equipotential bonding conductors to the centralized equipotential

● The equipotential bonding conductors of the separate modules must lead directly to the

SIMATIC RF300

System Manual, 11/2009 - Zwischenstand 17.09.2009, A5E01642529-04

Suppression of inductance

10 mm

conductor must be as small as possible (antenna effect).

bonding strip (EBS), the power components and non-power components must be

combined.

equipotential bonding strip.

RF300 system planning

4.7 EMC Directives

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