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Intel® i960® RM/RN I/O Processor
Thermal Solutions
14.2
3-Dimensional View: Processor with Heat Sink
Attached
To assist the board designer in component placement, hole placement and dimensions,
Figure 14-33
requiring a Passive Heat Sink.
Figure 14-32. Conceptual 3-D View of Processor with a Heat Sink
Single-fan Active
54
and
Figure 14-34
detail specifics.
Heatsink
Figure 14-33
details dimensions for board designs
*
Push Pins
Heatsink Flange
Heat Slug
BGA Package
Customer's Board
Design Guide
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