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® ® Intel i960 RM/RN I/O Processor Design Guide April 2002 Order Number: 273139-004...
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The i960 RN I/O Processor is an Intel I/O processor supporting both 64-bit and 32-bit PCI operation. The i960 RM I/O Processor is an Intel I/O processor only supporting 32-bit PCI operation.
Intel® i960® RM/RN I/O Processor Routing Guidelines Routing Guidelines The order in which signals are routed first and last varies from designer to designer. Some prefer to route all clock signals first, while others prefer to route all high speed bus signals first. Either order can be used, provided the guidelines listed here are followed.
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem ® Intel 80960RM/RN Processor Memory Subsystem RM/RN I/O processor integrates a memory controller to provide a direct interface between the RM/RN I/O processor and its local memory subsystem. The memory controller supports: •...
DQ[7:0] Flash signal loading should not exceed 50 pF. If the system conforms to I O specification, then a minimum 16 Mbit Flash such as Intel’s 28F016SA is suggested. All traces between the RM/RN I/O processor and Flash/SRAM should not exceed 8 inches.
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem 4.2.1 Layout Guidelines The SDRAM subsystem may be implemented with: • up to two banks directly connected on the printed circuit board (32, 64, or 72 bits wide) •...
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem The drive strengths for the SDRAM signals are independently programmable using the SDCR register. Table 4-4 lists some example SDRAM configurations and how the SDCR should be programmed. The...
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem Figure 4-5. SDRAM DIMM Layout Topology #1 D IM M D IM M 1 to 8 in ches 0 to 0 .6 in ches Inte l® A dd ress, D ata and C on tro l...
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem Figure 4-7. Address and Control Topology for Two Discrete SDRAM Devices SDRAM 0 Signals m ust be 3 to 9.5 inches from the processor and each SDRAM device Intel®...
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem Figure 4-9. Data and DQM Topology for Discrete SDRAM Devices D a t a s ig n a ls m u s t b e 3 t o 8...
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem 4.2.2 SDRAM Clocking and Clock Buffer Specifications The MCU provides one clock (DCLKOUT) to the SDRAM memory subsystem with a 66 MHz frequency. The 72-bit, 2-bank SDRAM DIMM specification requires four clocks to distribute the loading across eighteen x8 SDRAM components.
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem DCLKOUT and the clock buffer outputs may be between 1 and 8 inches. Each of the four clock buffer outputs must be equal in length. Refer to Table 4-5 for the DCLKIN trace length and capacitance requirements.
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem Any memory configuration using four or more discrete SDRAM components directly on the board must adhere to the same routing requirements specified in the 4-Clock 66 MHz 72-bit ECC Unbuffered SDRAM DIMM Specification.
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem 4.2.3 SDRAM Power Failure Guidelines SDRAM technology provides a simple way of enabling data preservation through the self-refresh command. When the memory controller issues this command, the SDRAM refreshes itself autonomously with internal logic and timers.
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Memory Subsystem Figure 4-13. External Power Failure Logic in the System Address, Data, and Control Memory SCKE SDRAM Controller SCKE[0] Subsystem External PLD PULLCKE P_RST# The implementation illustrated in Figure 4-13...
Intel® i960® RM/RN I/O Processor Interrupt Routing Interrupt Routing As stated in the PCI Local Bus Specification, Revision 2.1 and the PCI-to-PCI Bridge Architecture Specification, Revision 1.0, interrupt routing is system-specific. In general, the BIOS maps the device’s interrupt line to the RM/RN I/O processor’s secondary bus INTx line.
Intel® i960® RM/RN I/O Processor Interrupt Routing ® Intel 80960RM/RN Processor Implementation on an Add-in Card When designing the RM/RN I/O processor into an add-in card, refer to Figure 5-14 for Device ID address and interrupt routing. Figure 5-14. Example Secondary PCI Connector Interrupt Routing Intel®...
Intel® i960® RM/RN I/O Processor Clocking Guidelines Clocking Guidelines RM/RN I/O processor uses P_CLK (synchronous clock) input for clocking. All AC timings on the primary PCI bus and the secondary PCI bus are referenced to the P_CLK input. The system must provide clocks for any devices on the secondary PCI bus and ensure that system level goals for clock skew and jitter are met.
Intel® i960® RM/RN I/O Processor Clocking Guidelines Layout Guidelines for Motherboards For motherboard implementations, the designer has much more flexibility with PCI clocking, primarily related to controlling the central clock resources. Skew requirements for the motherboard are more stringent due to the uncertainty of having PCI edge connectors on the secondary bus.
Intel® i960® RM/RN I/O Processor Clocking Guidelines Clock Vendors The low-skew clock buffer components in Table 6-8 are suggested. This is neither an endorsement nor a warranty of the performance of the listed product and/or company. Table 6-8. Low Skew Clock Buffer Information...
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor 5 V and 3.3 V Design Considerations ® Intel 80960RM/RN Processor 5 V and 3.3 V Design Considerations Providing 3.3 V in a 5 V System In most system board designs, the 5 V system power supply is routed to board components through a dedicated board layer.
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor 5 V and 3.3 V Design Considerations Figure 9-17. Creating a Power “Island” 3.3V island Gap in Plane Connection Point for 3.3V Source 5V Plane Design Guide...
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor 5 V and 3.3 V Design Considerations Choosing a Power Source The primary concern that must be addressed when selecting a power source is the maximum load current requirement. The processor power supply must maintain correct voltage regulation at a current of 5.0 A for the...
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor 5 V and 3.3 V Design Considerations PCI Adapter Card Power Source Currently, PCI Adapter card vendors cannot rely on the PCI connector to provide 3.3V. Hence, any adapter card designed with the RM/RN I/O processor must design an on-board 3.3V regulator for...
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor 5 V and 3.3 V Design Considerations Pins Requirement CCPLL To reduce clock skew on the processor, the V pin for the Phase Lock Loop (PLL) circuit is C C P L L isolated on the pinout.
FAIL# pin is high (inactive) at 3.3 V, the LED can still be forward biased enough to glow. To ensure the LED extinguishes when FAIL# goes high, Intel recommends the circuit shown in Figure 9-22.
Intel® i960® RM/RN I/O Processor Processor Power Supply Decoupling 10.0 Processor Power Supply Decoupling Processor power supply decoupling is critical for reliable operation. With the 3.3 V ready system, two areas of concern are described in Section 10.1 Section 10.2: •...
Intel® i960® RM/RN I/O Processor Processor Power Supply Decoupling Figure 10-23. High-Frequency Capacitor Values and Layout Legend: µ = 0.1 F Capacitor 10.2 Bulk Decoupling Capacitance Bulk, or low-frequency decoupling is needed on the RM/RN I/O processor. If the processor is on a separate power plane “island”, it is necessary to place capacitance on the processor “island.”...
Intel® i960® RM/RN I/O Processor ® Intel 80960RM/RN Processor Based Reference Design ® 11.0 Intel 80960RM/RN Processor Based Reference Design Appendix A through Appendix D for schematics and bill of material. OrCAD libraries for the RM/RN I/O processor are available and can be supplied upon request.
Intel® i960® RM/RN I/O Processor Debug Connector Recommendations 12.0 Debug Connector Recommendations This section describes debug hardware and connectors developed for the RM/RN I/O processor. This includes sockets, headers, logic analyzer interposer, Mictor* signal cross reference lists and JTAG emulator debug connector/pin assignments.
Intel® i960® RM/RN I/O Processor Debug Connector Recommendations Figure 12-25. 540L PBGA Socket .340 inch .125 inch .05 inch Chamfer .812 inch .667 inch .312 inch .062 inch .193 inch .050 inch .062 inch 1.674 inch Side View Top View...
Intel® i960® RM/RN I/O Processor Debug Connector Recommendations 12.2 Logic Analyzer Connectivity The Mictor connector is the common connector used by the RM/RN I/O processor for logic analysis connectivity. The Cyclone evaluation board developed for the 80960RM/RN integrates five Mictor connectors to route the appropriate signals for logic analysis and probing. See Table 12-16.
Intel® i960® RM/RN I/O Processor Debug Connector Recommendations Figure 12-26. Packard-Hughes Direct Mount (Flex Tape) Interposer - Top View Packard-Hughes Interconnect Direct Mount Interposer 4.59 inch Mictor* Connectors 1.91 inch Flex Tape Socket Pin #1 * Other brands and names are the property of their respective owners.
RM/RN I/O Processor Target Debug Interface Connector The i960 microprocessor target should have a 16-pin, two row header connector. Use 3M part number 2516-6002UG or equivalent. The header is made from a keyed plastic shroud with two rows of 8 pins and the spacing between adjacent pins and between the two rows is 0.100”. The...
The emulation software uses the first Test Access Port (TAP) on the PC-1149.1/100F boundary-scan controller card to control the i960 RM/RN I/O processor. A cable should be connected from the boundary-scan controller to the i960 RM/RN I/O processor target debug interface connector as shown in the following tables.
12.3.4 Other Tools Other tools are available that are designed to complement the i960 family of JTAG emulators. These include a full complement of boundary-scan hardware and software for testing the 80960RM/RN for opens, shorts, and other manufacturing defects once it has been installed onto the target board.
Intel® i960® RM/RN I/O Processor Design for Manufacturability 13.0 Design for Manufacturability RM/RN I/O processor is offered in a high-thermal BGA (H-PBGA) package. PBGA ® packaging is explained extensively in the Intel Packaging Databook (Order Number 240800). Design Guide...
Refer to the thermal sections of the Intel 80960 RM I/O Processor Datasheet (273156), the Intel ® 80960 RN I/O Processor Datasheet (273157), and the Intel 80960 RS I/O Processor Datasheet (273328) and to the thermal section of the Thermal Data for the 540-Lead PBGA Package Application Note (273390).
Intel® i960® RM/RN I/O Processor Thermal Solutions Figure 14-34. Board Level Keep Out Areas Trace Keep-Out Areas Heat Sink Area Pin Keep-Out Area = 3.81 mm (Top and Bottom View) Clip Keep-Out Area = 9.2 mm (Bottom View) Mounting hole diameter 3.175 ± 0.0508 mm...
Intel® i960® RM/RN I/O Processor Thermal Solutions 14.4 Clearances of PCI Board and Components Figure 14-35. Clearances of PCI Board and Components Add-in card #1 Heat sink mounted on the package Maximum Add-in card #2 allowable component dimension on the backside...
Intel® i960® RM/RN I/O Processor Thermal Solutions 14.5 Heat Sink Information Table 14-21 provides a list of suggested sources for heat sinks. This is neither an endorsement nor a warranty of the performance of any of the listed products and/or companies.
Intel® i960® RM/RN I/O Processor References 15.0 References 15.1 Related Documents Intel documentation is available from your local Intel Sales Representative or Intel Literature Sales. To obtain Intel literature: call 1-800-548-4725 or visit Intel’s website at http://www.intel.com Table 15-27. Related Documentation...
Intel® i960® RM/RN I/O Processor ® Intel IQ80960RM Board Bill of Material ® Intel IQ80960RM Board Bill of MaterialB This appendix identifies all components on the IQ80960RM Evaluation Platform (Table B-1). ® Table B-1. Intel IQ80960RM Bill of Materials (Sheet 1 of 4)
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Intel® i960® RM/RN I/O Processor ® Intel IQ80960RM Board Bill of Material ® Table B-1. Intel IQ80960RM Bill of Materials (Sheet 2 of 4) Item Location Part Description Manufacturer Manufacturer Part # C1, C4, C5, C6, C7, C8, C9, C12,...
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Intel® i960® RM/RN I/O Processor ® Intel IQ80960RM Board Bill of Material ® Table B-1. Intel IQ80960RM Bill of Materials (Sheet 3 of 4) Item Location Part Description Manufacturer Manufacturer Part # R/SM 1/10 W 5% 24 ohm (0805) Dale CRCW0805240JT R/SM 1/10 W 5% 2.4 Kohm (0805)
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Intel® i960® RM/RN I/O Processor ® Intel IQ80960RM Board Bill of Material ® Table B-1. Intel IQ80960RM Bill of Materials (Sheet 4 of 4) Item Location Part Description Manufacturer Manufacturer Part # BT1, BT2, BT3, BT4, Battery AA NiCd @ 600 mA/Hour...
Intel® i960® RM/RN I/O Processor ® Intel IQ80960RN Board Bill of Material ® Intel IQ80960RN Board Bill of MaterialD This appendix identifies all components on the IQ80960RN Evaluation Platform (Table D-1). ® Table D-1. Intel IQ80960RN Bill of Materials (Sheet 1 of 4)
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Intel® i960® RM/RN I/O Processor ® Intel IQ80960RN Board Bill of Material ® Table D-1. Intel IQ80960RN Bill of Materials (Sheet 2 of 4) Item Location Part Description Manufacturer Manufacturer Part # C1, C4, C5, C6, C7, C8, C9, C12,...
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Intel® i960® RM/RN I/O Processor ® Intel IQ80960RN Board Bill of Material ® Table D-1. Intel IQ80960RN Bill of Materials (Sheet 3 of 4) Item Location Part Description Manufacturer Manufacturer Part # R/SM 1/10 W 5% 330 ohm (0805) Dale...
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Intel® i960® RM/RN I/O Processor ® Intel IQ80960RN Board Bill of Material ® Table D-1. Intel IQ80960RN Bill of Materials (Sheet 4 of 4) Item Location Part Description Manufacturer Manufacturer Part # CAP SM, 0.22 µF (1206) Philips 12062E224M9BB2 C60, C75, CAP TANT SM 220 µF, 10 V (7343)