Migration From Xc7Z030-Sbg485 To Xc7Z015-Clg485 Devices; Introduction - Xilinx Zynq-7000 Design Manual

Migration from XC7Z030-SBG485 to
XC7Z015-CLG485 Devices

Introduction

Package migration across a device family is a common feature among Xilinx devices. The
pinout remains consistent, with the biggest difference being more available I/Os in bigger
packages. However, a unique case arises when migrating from an XC7Z030-SBG485 device
to an XC7Z015-CLG485 device, as there are more significant differences between the
devices other than pinout. The designer wishing to migrate between these two devices
needs to be aware of these differences.
Differences between XC7Z030-SBG485 and
XC7Z015-CLG485 Devices
When migrating from an XC7Z030-SBG485 device to an XC7Z015-CLG485 device, some key
differences should be noted in regards to functionality, performance, packaging,
transceivers, PCB layout, and software (see
Table 6-1: Key Differences Between XC7Z030-SBG485 and XC7Z015-CLG485 Devices
Die/Fabric
Package Type
Processor Speed
Power Supply Tolerance
Bank 34, pins H8/R8
Bank 35, pins H5/H6
Bank 34
Bank 35
Bank 112 (MGT)
Bank 112, pin V7
Zynq-7000 PCB Design Guide
UG933 (v1.8) November 7, 2014
Table 6-1).
XC7Z030-SBG485
Kintex-7
Bare/Flip Chip
1 GHz
3%
VRP/VRN (for DCI)
VRP/VRN (for DCI)
HP I/Os
HP I/Os
GTX
MGTAVTTRCAL
www.xilinx.com
Chapter 6
XC7Z015-CLG485
Artix-7
Wirebond
800 MHz
5%
No DCI
No DCI
HR I/Os
HR I/Os
GTP
Not connected
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