In addition, DDR signals also require matched trace delays, which include package delays.
Table 5-9
shows the recommended delay matching for DDR. Differential traces should be
delay matched such that the signal crossing point occurs in the linear region of the rising
and falling edges.
The skew limits can be increased if the memory interface is not operated at the maximum
frequency, and/or if a faster memory device is utilized. If running a DDR2 interface at
800 MHz, using a 1,066 MHz memory relaxes the skew from 20 pS to 82 pS. If running a
DDR3 interface at 1,066 MHz, using a 1,333 MHz memory device relaxes the skew from
10 pS to 45 pS.
Table 5-9: DDR Delay Match
Signal Group
DQ/DM to DQS_P/N in data group
Address/Control to CK_P/N
To ensure proper write leveling for DQS to clock delays, route the CK trace to be equal to or
longer than the DQS trace per byte lane.
DDR Trace Impedance
All DDR signals except DDR_DRST_B require controlled impedance. DDR_CKE also requires
controlled impedance in DDR3/3L.
signals.
Table 5-10: DDR Trace Impedance
Signal Group
Single-ended
Differential
DDR3 and LPDDR2 memory also require an additional resistor connected to the ZQ pin to
calibrate the device's output impedance.
Ω
Table 5-11: DDR ZQ
ZQ
LPDDR2
Rzq
240Ω
DDR Routing Topology
Based on the chosen memory type, the number of memory devices and layout
requirements, different routing topologies can be used for DDR memory.
two different topologies.
Zynq-7000 PCB Design Guide
UG933 (v1.8) November 7, 2014
Chapter 5: Processing System (PS) Power and Signaling
LPDDR2
±10 ps
±10 ps
Table 5-10
LPDDR2
DDR2
40Ω
50Ω
Ω
80
100Ω
DDR2
DDR3/3L
N/A
240Ω
www.xilinx.com
DDR2
DDR3/3L
±20 ps
±10 ps
±25 ps
±10 ps
shows the required trace impedance for DDR
DDR3/3L
Comments
40Ω
±10% tolerance
80Ω
±10% tolerance
Table 5-11
shows the required RZQ values.
Comments
Figure 5-8
shows
63
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