Wlcsp25 Package Information; Figure 43. Wlcsp25 - 25-Ball, 2.423 X 2.325 Mm, 0.4 Mm Pitch Wafer Level Chip Scale - STMicroelectronics STM32F031F4 Manual

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Package information
7.5

WLCSP25 package information

7.6 WLCSP25 package information

Figure 43. WLCSP25 - 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale

1. Drawing is not to scale.
Table 65. WLCSP25 - 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale
Symbol
A
A1
A2
(2)
A3
(3) (4)
b
D
E
e
e1
100/113
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package outline
package mechanical data
millimeters
Min Typ
0.525 0.555
- 0.175
- 0.380
- 0.025
0.220 0.250
2.388 2.423
2.29 2.325
- 0.400
- 1.600
DocID025743 Rev 3
http://www.vicor.top/
Max Min
0.585 0.0207
- -
- -
- -
0.280 0.0087
2.458 0.0940
2.36 0.0902
- -
- -
http://www.vicor.top/
021-31660491
STM32F031x4 STM32F031x6
(1)
inches
Typ
0.0219
0.0069
0.0150
0.0010
0.0098
0.0954
0.0915
0.0157
0.0630
021-31660491
Max
0.0230
-
-
-
0.0110
0.0968
0.0929
-
-