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Package characteristics
Figure 42. Recommended PCB design rules for pads (0.5 mm pitch BGA)
1. Non solder mask defined (NSMD) pads are recommended
2. 4 to 6 mils solder paste screen printing process
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Dpad
Dsm
DocID17659 Rev 10
STM32L151x6/8/B, STM32L152x6/8/B
0.5 mm
Pitch
D pad
0.27 mm
0.35 mm typ (depends on
Dsm
the soldermask registration
tolerance)
Solder paste
0.27 mm aperture diameter
ai15495
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