Figure 38. Ufqfpn48 7 X 7 Mm 0.5 Mm Pitch, Ultra Thin Fine-Pitch Quad Flat No-Lead; Package Outline - STMicroelectronics STM32L151CB Manual

Package characteristics

Figure 38. UFQFPN48 7 x 7 mm 0.5 mm pitch, ultra thin fine-pitch quad flat no-lead

1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
112/129

package outline

DocID17659 Rev 10
STM32L151x6/8/B, STM32L152x6/8/B