I/O Routing Review Checklist; Decoupling/Filtering Review Checklist - Intel Quark SoC X1000 Design Manual

Table 58.

I/O Routing Review Checklist

ITEM
NO.
171-1
171-2
171-3
Table 59.

Decoupling/Filtering Review Checklist

ITEM
NO.
172-1
172-2
172-3
172-4
®
Intel Quark™ SoC X1000
PDG
126
All I/O connectors have been provided with a low impedance bond to chassis for their
shield structure.
All non-ground nets routed externally, should have a filter present.
I/O connector traces route to ESD protection before any other device.
SMT bypass capacitors are connected directly to power and ground planes with minimum
trace length between the part and via.
Bypass capacitor values have been selected to insure minimum impedance in the
frequency range(s) of interest.
Filter capacitors (line to ground) have been provided a low impedance path to chassis as
close to the capacitor as possible.
All pins on audio connectors have been filtered with both line to ground capacitors and
series inductors and/or ferrite beads with the capacitor placed between the inductor/bead
and the circuits in the system. These filter elements have been located at the I/O
connector.
®
Intel Quark™ SoC X1000—Electromagnetic Interference
DESCRIPTION
DESCRIPTION
§ §
Y/N
Y/N
June 2014
Order Number: 330258-002US