Daughter Card; Daughter Card Design Guidelines; Usb 2.0 Stackup Guidelines; Stackup And Layer Utilization Guidelines - Intel Quark SoC X1000 Design Manual

Universal Serial Bus 2.0 Design Guidelines—Intel
5.3.3

Daughter Card

The best way to provide internal support for USB is to use a daughter card and cable
assembly. This allows the placement of the EMI/ESD suppression components right at
the USB connector where they will be the most effective.
components associated with a typical USB solution that uses a daughter card.
When designing the motherboard with internal topology support, the system integrator
should know which type of cable assembly will be used. If the system integrator plans
to use a connector card, ensure that there aren't duplicate EMI/ESD/thermistor
components placed on the motherboard, as this will usually cause drop/droop and
signal quality degradation or failure.
Figure 29.

Daughter Card

5.3.3.1

Daughter Card Design Guidelines

The following are recommended when designing a USB 2.0 daughter card:
• Place the VBUS bypass capacitor, CMC, and ESD suppression components on the
daughter card as close as possible to the connector pins.
• Follow the same layout, routing and impedance control guidelines as specified for
motherboards.
• Use the same mating connector pinout as - USB 2.0 Internal Connector Pinout
(Motherboard).
• Minimize the trace length on the daughter card - Less than a 2-inch trace length is
recommended.
• Use the same routing guidelines as described in USB 2.0 Stackup Guidelines.
• Power and ground nets should have double vias. Trace lengths should be kept as
short as possible.
5.4

USB 2.0 Stackup Guidelines

5.4.1

Stackup and Layer Utilization Guidelines

Please see the 4 Layer Stackup Chapters for all IO routing guidelines including USB 2.0.
5.5

USB 2.0 Configuration, Connectivity, Block Diagram

June 2014
Order Number: 330258-002US
®
Quark™ SoC X1000
Figure 29 shows the major
®
Intel Quark™ SoC X1000
PDG
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