ZiLOG System 8000 Hardware Reference Manual page 167

HRM
Zilog
HRM
5.3.4. Heat Sink, Circuit Board, and Sensor Hole
Cleaning: To prevent possible overheating, dust and dirt
must be removed from the heat sink and drive assembly com-
ponents. The time period between cleanings varies widely,
depending on the operating environment. Use a soft brush
and/or low pressure compressed air for cleaning. The sensor
holes are cleaned in the same manner.
5.4. Disk Drive Assembly Cleaning
Bath the SMD and Finch disk assemblies are sealed units and
therefore do not require preventive maintenance procedures.
The major components of the FINCH drive are shown in Figure
5-2.
CAUTION
NEVER disassemble either the FINCH or SMD. This
exploded view is for information only. Servi.cing
items in the upper sealed environmental enclosure
(heads, media, actuator, etc.) requires special
facilities. Only the printed-circuit boards,
brake and motor external to the sealed area can be
replaced without special facilities.
5-4
Zilog
5-4