System reliability guidelines
To help ensure proper cooling and system reliability, make sure that the following
requirements are met:
v Each of the drive bays has a drive or a filler panel and electromagnetic
v You have followed the cabling instructions that come with optional adapters.
v You have replaced a hot-swap drive within 2 minutes of removal.
v The system-board tray battery is operational. If the battery becomes defective,
v Microprocessor socket 2 always contains either a microprocessor baffle or a
Handling static-sensitive devices
To avoid damage, keep static-sensitive devices in their static-protective packages
until you are ready to install them.
To reduce the possibility of damage from electrostatic discharge, observe the
v Limit your movement. Movement can cause static electricity to build up around
v The use of a grounding system is recommended. For example, wear an
v Handle the device carefully, holding it by its edges or its frame.
v Do not touch solder joints, pins, or exposed circuitry.
v Do not leave the device where others can handle and damage it.
v While the device is still in its static-protective package, touch it to an unpainted
v Remove the device from its package and install it directly into the system-board
v Take additional care when you handle devices during cold weather. Heating
IBM dx340 User's Guide
compatibility (EMC) shield installed in it.
replace it immediately.
microprocessor and heat sink.
Static electricity can damage the server and other electronic devices.
electrostatic-discharge wrist strap, if one is available.
metal surface on the outside of the chassis or rack for at least 2 seconds. This
drains static electricity from the package and from your body.
tray or enclosure without setting down the device. If it is necessary to set down
the device, put it back into its static-protective package. Do not place the device
on a metal surface.
reduces indoor humidity and increases static electricity.