Figure 6-3. Il/Next Plot (Gen1) - Nvidia Jetson Xavier NX Design Manual

Parameter
AC Cap
Value: Min/Max
Location (max length to adjacent
discontinuity)
Voiding
ESD (On-chip protection diode can withstand 2kV HMM. External ESD is optional. Designs should include ESD footprint as a
stuffing option)
Max Junction capacitance (IO to GND)
GEN1
GEN2
Footprint
Location (max length to adjacent
discontinuity)
Common-mode Choke
(Not recommended – only used if absolutely required for EMI issues). See Chapter 18 for details on CMC if implemented.
FPC (Additional length of Flexible Printed Circuit Board)
The FPC routing should be included for PCB trace calculations (max length, etc.)
Characteristic Impedance
Loss characteristic
Connector
SMT Connector GND Voiding
Connector used must be USB-IF certified
General: See Chapter 18 for guidelines related to serpentine routing, routing over voids and noise coupling
The following figures show the USB 3.2. Interface signal routing requirements.
Figure 6-3. IL/NEXT Plot (GEN1)
NVIDIA Jetson Xavier NX
Requirement Units
See Figure 6-6.
0.075 / 0.2 uF
8 mm
GND/PWR void under/above cap is
preferred
pF
0.8
0.35
Pad should be on the net – not trace
stub
8 mm
Same as PCB
Strongly recommend being the same
as the PCB or better
GND plane under signal pad should be voided. Size of void should be the same
size as the pad.
USB and PCIe
Notes
See Figure 6-7.
0.1uF recommended. Only required for TX
pair when routed to connector
Discontinuity is connector, via, or
component pad
Voiding is required if AC cap size is 0603
or larger
GEN1: SEMTECH RClamp0524p
GEN2: TPD4E02B04DQA
Figure 6-8
See .
Discontinuity is connector, via, or
component pad
If worse than PCB, the PCB and FPC
length must be re-estimated
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