Signal Terminology Descriptions - ADLINK Technology arm AMPERE COM-HPC-ALT User Manual

COM-HPC-ALT User's Guide

4.2 Signal Terminology Descriptions

Definitions of the terms used for signal description tables
Term Description
I Input to the module
O Output from the module
I/O Bi-directional Input / Output
OD Open drain output from the module
I 3.3V Input 3.3V tolerant
I 5V Input 5V tolerant
O 3.3V Output 3.3V signal level
O 5V Output 5V signal level
I/O 3.3V Bi-directional signal 3.3V tolerant
I/O 5V Bi-directional signal 5V tolerant
I/O 3.3V Input or output 3.3V tolerant active in standby state
SB
DDC Display Data Channel
PCIE PCI Express compatible differential signal
PEG PCI Express Graphics
SATA Serial ATA specification Revision 2.6 and 3
LVDS Low Voltage Differential Signal - 330 mV nominal; 450 mV maximum differential signal
P Power Input / Output
REF Reference voltage output. May be sourced from a Module power plane.
PDS Pull-down strap. A Module output pin that is either tied to GND or is not connected.
Used to signal Module capabilities to the Carrier Board.
PU PU (pull-up) resistor on module
PD PD (pull-down) resistor on module
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