COM-HPC-ALT User's Guide
PICMG COM-HPC R1.0
Trusted Platform Module (TPM)
Chipset: Infineon solution
Type: TPM 2.0 (SPI bus based) (located on GP_SPI)
2.7 Module Management Controller (MMC)
A Module Management Controller (MMC) is supported by default, which offers power sequence management and IPMB that can be connected to
Carrier BMC for voltage, current, temperature, and other system information through IPMI protocol
The selected MMC is ATMEGA128A-MU (Microchip) (-40 to 85°C) solution.
MMC connects to SOC through UART interface
MMC connects to a HW monitor through I2C bus to monitor module's voltage, current and temperature
MMC only offers two I2C, one is used for USB_PD_I2C, the other used for IPMB.
Overview
COM-HPC Module and Carrier boards may support out-of-band (OOB) management features. These features may be implemented on COM-HPC
Server or Client systems. Traditionally OOB management is more of a server class feature, but the option is there for both COM-HPC Clients and Servers.
There is a separate PICMG document that describes COM-HPC OOB management features in details — PICMG COM-HPC Platform Management
Interface Specification. The management architecture is divided into BMC (Board Management Controller) and MMC (Module Management
Controller), which are explained in the following sections.
BMC (Board Management Controller) (Located on Carrier board if deployed)
This is a microcontroller subsystem, usually based on the Carrier, that performs system out-of-band management functions such as firmware updates,
power and reset control, performance monitoring and more. For COM-HPC module, which are hosted on the carrier, it may be a full subsystem with
CPU / SOC, DRAM memory, an internal display controller and more. It may be ARM based. It may run a Linux or other OS. A popular vendor for this
sort of BMC part is Aspeed, and in particular the Aspeed AST2510 and successor parts. Many other vendors and parts are possible.
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