Table 39. Thermal restriction for memory with liquid cooled configuration(GPU)
No
Configuration
backpl
ane
No
Rear storage
rear
drives
DIMM
Configu
Power
ration
256 GB
12.7 W
RDIMM
128 GB
8.9 W
RDIMM
64 GB
6.9 W
RDIMM
32 GB
4.1 W
RDIMM
16 GB
3 W
RDIMM
Thermal air restrictions
Table 40. Air cooling configurations thermal restriction for AHSRAE A3 and A4
ASHRAE
A3/40°C (104°F)
PSU
Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe card
Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA
Not supported
DIMM
128 GB, or greater capacity DIMMs are not supported.
PCIe SSD
Not supported
Front storage
Not supported in 12 x 3.5-inch SAS configuration.
Rear storage
Not supported
Fan
HPR SLVR fans are required.
Processor
≤ 165 W
OCP
Supported with 85°C (185°F) active optic
cable.
BOSS
BOSS-N1 is supported.
Table 41. Liquid cooling configurations thermal restriction for AHSRAE A3 and A4
ASHRAE
A3/40°C (104°F)
PSU
Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe card
Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA
Not supported
16 x
16 x
8 x 2.5-
2.5-
2.5-
inch
inch
inch
NVMe
SAS
NVMe
No
No
No rear
rear
rear
drives
drives
drives
24 x 2.5-inch SAS
2 x 2.5-
No rear
inch
drives
with rear
fan
Fan
HPR GOLD fan
A4/45°C (113°F)
≤ 125 W
Supported with 85°C (185°F) active optic cable and
cards tier ≤4.
BOS-N1 is not supported.
A4/45°C (113°F)
16 x
2.5-
inch
24 x 2.5-
SAS +
inch
8 x
NVMe
2.5-
inch
NVMe
4 x 2.5-
No
inch
No rear
rear
with
drives
drives
rear fan
Technical specifications
Ambient
tempera
ture
35°C
(95°F)
47