Thermal Air Restrictions; Thermal Restriction Matrix - Dell PowerEdge XE8640 Installation And Service Manual

Table 21. Maximum shock pulse specifications
Maximum shock pulse
Operating
Storage

Thermal air restrictions

● ASHRAE A3/A4 environment is not supported.
● Required to constrain the GPU fan service time to maximum 3 minutes once the environment temp is up to 32°C.
● LAAC Pump failure or absence:
○ Any one of pump failure or absence: PDB CPLD record the status for iDRAC to log the failure and drive all fans to full
speed.
○ Any two of pump failure: PDB CPLD record the status for iDRAC to log the failure and trigger pFAULT to shutdown the
system for system protection.
○ Any two of pump absence during the initial system power on process: iDRAC will check the pump presence status from
PDB CPLD MM to gate the power on process and log the message.
● LAAC Leak detected: Once the coolant leak is detected, CPLD will proceed the pFAULT process to get system shutdown.
● LAAC Coolant loss by evaporation: there's no indicator to detect the percentage of coolant loss
○ The failure symptom would be GPU throttling / overheat or pump RPM warning.
● HDD blank is required if the slot doesn't install HDD.
● DIMM blank is not require to be install if total memory populated is more or equal to16.
● Do not support net system airflow display in iDRAC WebGUI
● BCME 100G_2P FH card (FPM6F) require 85C active optics transceiver / 4WGYD. (NOT support MFS1S00-H003E cable.)
● MLNX 100G_2P FH card (8P2T2) require 85C active optics transceiver / 4WGYD. (NOT support MFS1S00-H003E cable.)
● Broadcom 25GbE_4P OCP 3.0 card (3Y64D) require 85C active optics transceiver / M14MK. (NOT support 0YR96 cable.)

Thermal restriction matrix

Table 22. Thermal restriction matrix
XE8640
Front configuration
Additional attributes
Rear configuration
Fan type
Heatsink type
CPU TDP Processor
5418Y
6448Y/6442Y
8462Y+
8460Y+
8452Y
8480+/8470/8468
Specifications
Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms.
Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
TDP Die
185W MCC
225W MCC
300W MCC
300W XCC
300W XCC
350W XCC
8x 2.5" U.2 / NVMe
4 x Nvidia H100 700W
4xFH
HPR Gold fan
Standard heatsink for CPU
and LAAC for GPU
Core count 35°C
24 35°C
32/24 35°C
32 35°C
40 35°C
36 35°C
56/52/48 35°C
Technical specifications 27