Figure 11-1. Micro Sd Card Socket Connection Example; Table 11-3. Sdcard Interface Signal Routing Requirements - Nvidia Jetson AGX Xavier Series Design Manual

Figure 11-1. Micro SD Card Socket Connection Example
Jetson AGX Xavier
SoC
SDMMC1
SDMMC1_CLK
SDMMC1_CMD
SDMMC1_DAT0
SDMMC1_DAT1
SDMMC1_DAT2
SDMMC1_DAT3
CAM
UART1_RX
CONN
SOC_GPIO11
Notes:
1. If EMI and/or ESD devices are necessary, they must be tuned to minimize the impact to signal
quality, which must meet the timing and Vil/Vih requirements at the receiver and maintain
signal quality and meet requirements for the frequencies supported by the design.
2. Supply (load switch, etc) used to provide power to the SD Card must be current limited if the
supply is shorted to GND.
Table 11-3. SDCARD Interface Signal Routing Requirements
Parameter
Max Frequency 3.3V Signaling
DS
HS
Max Frequency 1.8V Signaling
SDR12
SDR25
SDR50
SDR104
DDR50
Topology
Reference plane
Trace Impedance
Max Via Count
PTH
HDI
Via proximity (Signal to reference)
Trace spacing – Microstrip / Stripline
Trace length
SDR50 / SDR25 / SDR12 / HS / DS
Jetson AGX Xavier Series Product
VDD_3V3
4.7kΩ
D
G
S
SDCARD_CLK
B6
SDCARD_CMD
A5
SDCARD_D0
E8
SDCARD_D1
F8
SDCARD_D2
A4
SDCARD_D3
D6
SDMMC_VDD_EN
GPIO21
B5 8
SDMMC1_ CD*
GPIO02
L6
Requirement
25 (12.5)
50 (25)
25 (12.5)
50 (25)
100 (50)
208 (104)
50 (50)
Point to point
GND or PWR
50
4
10
< 3.8 (24)
4x / 3x
Load Switch
VIN VOUT
ON
10Ω
10Ω
10Ω
0Ω
10Ω
10Ω
ESD
Units
See Note 1
MHz (MB/s)
See Note 2
Ω ±15%. 45Ω optional depending on stack-up
Independand of stackup layers
Depends on stackup layers
mm (ps) Up to 4 signal Vias can share 1 GND return
Via
dielectric
SDIO and SD Card
DATA2
DATA3
CMD
GND
VDD
CLK
GND
DATA0
DATA1
C_DETECT
COMMON
Notes
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