Texas Instruments SimpleLink CC3220MOD Series Manual page 86

MON0063A
54X ( 0.81)
54
1
2
(45 X 1)
55
SOLDER MASK
OPENING
9X
56
PKG
57
(0.65)
TYP
(0.65)
TYP
(1.27) TYP
15
16
17
(R0.05)
ALL PADS
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
PATTERN
( 8.1)
0.05 MIN TYP
58
61
59
62
63
60
(1.5)
6X (3)
(8.05) (3.724)
(25)
LAND PATTERN EXAMPLE
SOLDER MASK DEFINED
SCALE:5X
0.05 MIN
ALL AROUND
EXPOSED METAL
SIGNAL PADS DETAIL
www.ti.com
EXAMPLE BOARD LAYOUT
QFM - 2.4 mm max height
SEE DETAIL
PKG
44
43
42
9X ( 2)
(19.048)
6X (3)
(1.5)
29
28
27
(4.326)
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
QUAD FLAT MODULE
( 0.2) TYP
VIA
METAL UNDER
SOLDER MASK
(20.5)
NO TRACES, VIAS, GND PLANE
OR SILK SCREEN SHOULD BE
LOCATED WITHIN THIS AREA
4223415/C 06/2019