Texas Instruments SimpleLink CC3220MOD Series Manual page 81

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13.2.1 Packaging Information
(1)
Orderable Device Status
CC3220MODSM2MOBR ACTIVE
CC3220MODSF12MOBR ACTIVE
CC3220MODASM2MONR ACTIVE
CC3220MODASF12MONR ACTIVE
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
availability information and additional product content details.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1%
by weight in homogeneous material)
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(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
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(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided
by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider
certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Copyright © 2021 Texas Instruments Incorporated
Package Package
Package Drawing Pins
Type
QFM MOB 63
QFM MOB 63
QFM MON 63
QFM MON 63
Product Folder Links:
Lead/Ball
(2)
Eco Plan MSL, Peak Temp
Qty Finish
Green (RoHS
750 Ni, AU
and no Sb/Br)
Green (RoHS
750 Ni, AU
and no Sb/Br)
Green (RoHS
600 Ni, AU
and no Sb/Br)
Green (RoHS
600 Ni, AU
and no Sb/Br)
CC3220MOD CC3220MODA
CC3220MOD, CC3220MODA
SWRS206E – MARCH 2017 – REVISED MAY 2021
(3)
Op Temp (°C) Device Marking
3, 250°C –40 to 85 CC3220MODSM2MOB
3, 250°C –40 to 85 CC3220MODSF12MOB
3, 250°C –40 to 85 CC3220MODASM2MON
3, 250°C –40 to 85 CC3220MODASF12MON
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