Texas Instruments SimpleLink CC3235MODS Manuals

Texas Instruments SimpleLink CC3235MODS Manuals

Manuals and User Guides for Texas Instruments SimpleLink CC3235MODS. We have 1 Texas Instruments SimpleLink CC3235MODS manual available for free PDF download: Manual

Texas Instruments SimpleLink CC3235MODS Manual

Texas Instruments SimpleLink CC3235MODS Manual (106 pages)

Dual-band Wireless MCU Module

Brand: Texas Instruments | Category: Control Unit | Size: 2.55 MB

Table of Contents

Module Overview
1
Features
1
Applications
2
Description
2
Functional Block Diagrams
3
Table of Contents
6
Revision History
7
Device Comparison
8
Related Products
10
Terminal Configuration and Functions
11
Cc3235Modx Pin Diagram
11
Pin Attributes and Pin Multiplexing
12
Signal Descriptions
29
Drive Strength and Reset States for Analog-Digital Multiplexed Pins
35
Pad State after Application of Power to Chip, but before Reset Release
35
Connections for Unused Pins
36
Specifications
37
Absolute Maximum Ratings
37
ESD Ratings
37
Recommended Operating Conditions
37
Current Consumption (CC3235MODS)
38
Current Consumption (CC3235MODSF)
40
TX Power Control for 2.4 Ghz Band
42
TX Power Control for 5 Ghz
44
Brownout and Blackout Conditions
44
Electrical Characteristics for GPIO Pins
46
GPIO Pins Except 25, 26, 42, and 44 (25°C)
46
GPIO Pins 25, 26, 42, and 44 (25°C)
47
Pin Internal Pullup and Pulldown (25°C)
47
WLAN Receiver Characteristics
48
WLAN Transmitter Characteristics
49
BLE and WLAN Coexistence Requirements
50
Reset Requirement
50
Thermal Resistance Characteristics for MOB Packages
50
Timing and Switching Characteristics
51
Detailed Description
63
Overview
63
Functional Block Diagram
63
Arm ® Cortex ® -M4 Processor Core Subsystem
64
Wi-Fi ® Network Processor Subsystem
65
Security
67
FIPS 140-2 Level 1 Certification
70
Power-Management Subsystem
70
Low-Power Operating Mode
70
Memory
72
Restoring Factory Default Configuration
74
Boot Modes
74
Hostless Mode
75
Device Certification and Qualification
76
Module Markings
78
End Product Labeling
79
Manual Information to the End User
79
Applications, Implementation, and Layout
79
Typical Application
79
Device Connection and Layout Fundamentals
83
PCB Layout Guidelines
84
Environmental Requirements and SMT Specifications
90
PCB Bending
90
Handling Environment
90
Storage Condition
90
PCB Assembly Guide
90
Baking Conditions
91
Soldering and Reflow Condition
92
Device and Documentation Support
93
Third-Party Products Disclaimer
93
Development Tools and Software
93
Firmware Updates
95
Device Nomenclature
95
Documentation Support
96
Information
96
Related Links
98
Trademarks
98
Electrostatic Discharge Caution
98
Export Control Notice
98
Glossary
98
Mechanical, Land, and Solder Paste Drawings
99
Package Option Addendum
100

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