Texas Instruments SimpleLink CC3200MOD Manual
Texas Instruments SimpleLink CC3200MOD Manual

Texas Instruments SimpleLink CC3200MOD Manual

Wi-fi and internet-of-things module solution, a single-chip wireless mcu
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CC3200MOD SimpleLink™ Wi-Fi

1 Module Overview

1.1

Features

1
• The CC3200MOD is a Wi-Fi Module that Consists
of the CC3200R1M2RGC Single-Chip Wireless
MCU. This Fully Integrated Module Includes all
Required Clocks, SPI Flash, and Passives.
• Modular FCC, IC, and CE Certifications Save
Customer Effort, Time, and Money
• Wi-Fi CERTIFIED™ Modules, With Ability to
Request Certificate Transfer for Wi-Fi Alliance
Members
• 1.27-mm Pitch LGA Package for Easy Assembly
and Low-Cost PCB Design
• Applications Microcontroller Subsystem
– ARM Cortex-M4 Core at 80 MHz
– Embedded Memory Options
Integrated Serial
RAM (up to 256KB)
Peripheral Drivers in ROM
– Hardware Crypto Engine for Advanced
Hardware Security Including
AES, DES, and 3DES
SHA and MD5
CRC and Checksum
– 8-Bit, Fast, Parallel Camera Interface
– 1 Multichannel Audio Serial Port (McASP)
Interface With Support for I2S Format
– 1 SD (MMC) Interface
– 32-Channel Micro Direct Memory Access
(μDMA)
– 2 Universal Asynchronous
Receivers/Transmitters (UARTs)
– 2 Serial Peripheral Interfaces (SPIs)
– 1 Inter-integrated Circuit (I
– 4 General-Purpose Timers (GPTs)
– 16-Bit Pulse-Width Modulation (PWM) Mode
– 1 Watchdog Timer Module
– 4-Channel 12-Bit Analog-to-Digital Converters
(ADCs)
– Up to 25 Individually Programmable GPIO Pins
• Wi-Fi Network Processor Subsystem
– 802.11b/g/n Radio, Baseband, and Medium
Access Control
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Sample &
Product
Buy
Folder
®
and Internet-of-Things Module Solution, a Single-Chip
Wireless MCU
2
C)
Tools &
Technical
Software
Documents
– TCP/IP Stack
8 Simultaneous TCP, UDP, or RAW Sockets
2 Simultaneous TLS v1.2 or SSL 3.0
Sockets
– Powerful Crypto Engine for Fast, Secured
WLAN Connections With 256-Bit Encryption
– Station, Access Point, and Wi-Fi Direct™ Modes
– WPA2 Personal and Enterprise Security
– SimpleLink Connection Manager for Managing
Wi-Fi Security States
– TX Power
17 dBm at 1 DSSS
17.25 dBm at 11 CCK
13.5 dBm at 54 OFDM
– RX Sensitivity
–94.7 dBm at 1 DSSS
–87 dBm at 11 CCK
–73 dBm at 54 OFDM
– Application Throughput
UDP: 16 Mbps
TCP: 13 Mbps
• Power-Management Subsystem
– Integrated DC-DC Converter With a Wide-
Supply Voltage:
VBAT: 2.3 to 3.6 V
– Low-Power Consumption at 3.6 V
Hibernate With Real-Time Clock (RTC):
7 μA
Low-Power Deep Sleep: <275 μA
RX Traffic: 59 mA at 54 OFDM
TX Traffic: 229 mA at 54 OFDM
– Additional Integrated Components
40.0-MHz Crystal
32.768-kHz Crystal (RTC)
8-Mbit SPI Serial Flash RF Filter and
Passive Components
– Package and Operating Conditions
1.27-mm Pitch, 63-Pin, 20.5-mm ×
17.5 mm LGA Package for Easy Assembly
and Low-Cost PCB Design
Operating Temperature Range: –20°C to
70°C
Support &
Community
CC3200MOD
SWRS166 – DECEMBER 2014

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Summary of Contents for Texas Instruments SimpleLink CC3200MOD

  • Page 1: Module Overview

    Sample & Support & Product Tools & Technical Community Folder Software Documents CC3200MOD SWRS166 – DECEMBER 2014 ® CC3200MOD SimpleLink™ Wi-Fi and Internet-of-Things Module Solution, a Single-Chip Wireless MCU 1 Module Overview Features – TCP/IP Stack • The CC3200MOD is a Wi-Fi Module that Consists of the CC3200R1M2RGC Single-Chip Wireless •...
  • Page 2: Applications

    (MCU) module with built-in Wi-Fi connectivity. Created for the Internet of Things (IoT), the SimpleLink CC3200MOD is a wireless MCU module that integrates an ARM Cortex-M4 MCU, allowing customers to develop an entire application with a single device. With on-chip Wi-Fi, Internet, and robust security protocols, no prior Wi-Fi experience is required for faster development.
  • Page 3: Functional Block Diagram

    RF Filter Power Pull-up Inductors resistors Caps CC3200MOD (1) For 3200MOD module pin multiplexing details, refer to CC3200R device datasheet (literature number: SWAS032) Figure 1-1. CC3200MOD Module Functional Block Diagram Module Overview Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 4 ARM Cortex-M4 80 MHz Processor Internet Protocols TLS/SSL Embedded Internet TCP/IP Supplicant Wi-Fi Driver Wi-Fi MAC Embedded Wi-Fi Wi-Fi Baseband Wi-Fi Radio ARM Processor (Wi-Fi Network Processor) Figure 1-3. CC3200 Software Overview Module Overview Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 5: Table Of Contents

    4.10 WLAN RF Characteristics Mechanical Packaging and Orderable ....... 4.11 Timing Characteristics ..........Information ........Detailed Description ......... Mechanical Drawing ..........Overview ........Package Option ......Functional Block Diagram Table of Contents Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 6: Revision History

    CC3200MOD SWRS166 – DECEMBER 2014 www.ti.com 2 Revision History DATE REVISION NOTES November 2014 Initial release. Revision History Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 7: Terminal Configuration And Functions

    Figure 3-1. CC3200MOD Pin Diagram (Bottom View) NOTE Figure 3-1 shows the approximate location of pins on the module. For the actual mechanical diagram refer to Section Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 8: Pin Attributes

    Power supply for the device, can be connected to battery (2.3 V to 3.6 V) Ground (1) For pin multiplexing details, refer to CC3200R device data sheet Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 9 GPIO GPIO6 GPIO GPIO7 GPIO GPIO8 GPIO GPIO9 GPIO Thermal Ground Thermal Ground Thermal Ground Thermal Ground Thermal Ground Thermal Ground Thermal Ground Thermal Ground Thermal Ground Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 10: Pin Attributes And Pin Multiplexing

    Use level-shifters between the module and any external devices fed from other independent rails. • The nRESET pin of the CC3200MOD must be held low until the VBAT supply to the module is driven and stable Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 11 Parallel Camera (0x4402 E0CC) SDCARD_CMD SD Card Hi-Z Command Line UART1_RX UART RX Data Hi-Z GT_CCP02 Timer Capture Port Hi-Z McAFSX I2S Audio Port Hi-Z Frame Sync Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 12 I2C_SCL I2C Clock (Open GPIO_PAD_CONFIG_1 Drain) GPIO14 Hi-Z Hi-Z Hi-Z (0x4402 E0D8) GSPI_CLK General SPI Clock pDATA8 Parallel Camera (CAM_D4) Data Bit 4 GT_CCP05 Timer Capture Port Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 13 UART1 RX Data Hi-Z Hi-Z GPIO_PAD_CONFIG_1 GSPI_CS General SPI Chip Wake-Up GPIO17 Select Hi-Z Source (0x4402 E0E4) pDATA11 Parallel Camera (CAM_D7) Data Bit 7 SDCARD_ SD Card Command Line Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 14 Frame Sync GPIO_PAD_CONFIG_ General-Purpose GPIO28 GPIO28 Hi-Z Hi-Z Hi-Z (0x4402 E110) JTAG/SWD TCK MUXed Reset Default with Pinout JTAG/ Hi-Z Hi-Z Hi-Z SWD- GT_PWM03 Pulse Width Modulated O/P Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 15 ANTSEL2 O Only ANTSEL2 Hi-Z Hi-Z Hi-Z required Control (0x4402 E10C) Config SOP1 SOP1 Sense On Power 1 Sense Config SOP0 SOP0 Sense On Power 0 Sense Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 16 Hi-Z UART0_TX UART0 TX Data GPIO_PAD_CONFIG_1 pCLK (PIXCLK) Pixel Clock From Hi-Z GPIO1 (0x4402 E0A4) Parallel Camera Sensor UART1_TX UART1 TX Data GT_CCP01 Timer Capture Port Hi-Z Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 17 Parallel Camera Hi-Z Hi-Z Hi-Z 1.8 V)/ (0x4402 E0B4) (CAM_D1) Data Bit 1 Digital McAXR1 I2S Audio Port Hi-Z Data 1 (RX/TX) GT_CCP05 Timer Capture Port Hi-Z Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 18 UART0 TX Data General-Purpose GPIO8 SDCARD_IRQ Interrupt from SD Card (Future GPIO_PAD_CONFIG_8 GPIO8 Hi-Z Hi-Z Hi-Z support) (0x4402 E0C0) McAFSX I2S Audio Port Frame Sync GT_CCP06 Timer Capture Port Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 19: Recommended Pin Multiplexing Configurations

    (10) Requires user configuration to enable the ADC channel analog switch. (The switch is off by default.) The digital I/O is always connected and must be made Hi-Z before enabling the ADC switch. Recommended Pin Multiplexing Configurations Table 3-3 lists the recommended pin multiplexing configurations. Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 20 LPDS. The core digital wakeup monitor use a mux to select one of these pins to monitor. (2) The device supports the feeding of an external 32.768-kHz clock. This configuration frees one pin (32K_XTAL_N) to use in output-only mode with a 100K pullup. Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 21 SWD-TMS GPIO_28 GPIO_28 GPIO_28 GPIO_28 GPIO_28 GPIO_28 GPIO_28 GPIO_28 GPIO_28 GPIO_28 GPIO_28 GPIO_28 GPIO_25 GT_PWM2 GT_PWM2 GT_PWM2 GT_PWM2 GT_PWM2 GT_PWM2 GT_PWM2 TCXO_EN GT_PWM2 GT_PWM2 GPIO_25 out only Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 22: Drive Strength And Reset States For Analog-Digital 7 Multiplexed Pins

    If a certain set of pins are required to have a definite value during this pre-reset period, an appropriate pullup or pulldown must be used at the board level. The recommended value of this external pull is 2.7 KΩ. Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 23: Specifications

    Ambient thermal slew –20 °C/minute (1) Operating temperature is limited by crystal frequency variation. (2) To ensure WLAN performance, the ripple on the power supply must be less than ±300 mV. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 24: Brown-Out And Black-Out

    (including the 32-kHz RTC clock), which remains on. The current in this state can reach approximately 400 µA. The black-out condition is equivalent to a hardware reset event in which all states within the module are lost. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 25: Electrical Characteristics (3.3 V, 25°C)

    WLAN radio and mitigates any potential degradation of RF sensitivity and performance. The default drive strength setting is 6 mA. (2) The nRESET pin must be held below 0.6 V to ensure the device is reset properly. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 26: Thermal Resistance Characteristics For Mob Package

    Minimum time for nReset low for resetting the module Rise/fall times Tr/Tf µs (1) The nRESET pin must be held below 0.6 V for the module to register a reset. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 27: Current Consumption

    (5) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms . Calibration is performed sparingly, typically when coming out of Hibernate and only if temperature has changed by more than 20°C or the time elapsed from prior calibration is greater than 24 hours. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 28 Figure 4-3. TX Power and IBAT vs TX Power Level Settings (1 DSSS) Figure 4-4. TX Power and IBAT vs TX Power Level Settings (6 OFDM) Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 29 CC3200MOD www.ti.com SWRS166 – DECEMBER 2014 Figure 4-5. TX Power and IBAT vs TX Power Level Settings (54 OFDM) Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 30: Wlan Rf Characteristics

    MCS7 (Mixed Mode) Transmit center frequency accuracy –20 (1) Channel-to-channel variation is up to 2 dB. The edge channels (2412 and 2472 MHz) have reduced TX power to meet FCC emission limits. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 31: Timing Characteristics

    Depends on application board power supply, decap, and Supply settling time 3 ms so on Hardware wakeup 25 ms time Time taken by ROM firmware to initialize Includes 32.768-kHz XOSC settling time 1.1 s hardware Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 32 Depends on application board power supply, decap, and Supply settling time 3 ms so on Hardware wakeup 25 ms time Time taken by ROM firmware to initialize Time taken by ROM firmware 3 ms hardware Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 33 (2) Wake-up time can extend to 75 ms if a patch is downloaded from the serial flash. 4.11.2 Peripherals This section describes the peripherals that are supported by the CC3200 module: • • McASP • GPIO • • IEEE 1149.1 JTAG • Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 34 Clock high period Duty cycle RX data setup time RX data hold time TX data output delay TX data hold time (1) Timing parameter assumes a maximum load of 20 pF. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 35 A fractional divider is available for bit-clock generation. 4.11.2.2.1 I2S Transmit Mode Figure 4-11 shows the timing diagram for the I2S transmit mode. McACLKX McAFSX McAXR0/1 SWAS032-015 Figure 4-11. I2S Transmit Mode Timing Diagram Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 36 GPIO pins, depending on the peripheral used. Each GPIO has configurable pullup and pulldown strength (weak 10 µA), configurable drive strength (2, 4, and 6 mA), and open-drain enable. Figure 4-13 shows the GPIO timing diagram. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 37 = 1.8 V, T = 25°C, total pin load = 30 pF supply (2) The transition data applies to the pins other than the multiplexed analog-digital pins 29, 30, 45, 50, 52, and 53. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 38 C is an open-drain interface, the controller can drive logic 0 only. Logic is the result of external pullup. Rise time depends on the external signal capacitance and external pullup register value. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 39 Integral nonlinearity Worst-case deviation from –2.5 histogram method over full scale (not including first and last three LSB levels) Differential nonlinearity Worst-case deviation of any step –1 from ideal Input range Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 40 FIFO, and generates DMA requests. The camera parallel port supports 8 bits. Figure 4-17 shows the timing diagram for the camera parallel port. Figure 4-17. Camera Parallel Port Timing Diagram Table 4-14 lists the timing parameters for the camera parallel port. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 41 FIFO level – Transmit single request asserted when there is space in the FIFO; burst request asserted at programmed FIFO level • System clock is used to generate the baud clock. Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 42: Detailed Description

    – A 32-bit ARM Cortex Thumb® instruction set optimized for embedded applications – Handler and thread modes – Low-latency interrupt handling by automatic processor state saving and restoration during entry and exit – Support for ARMv6 unaligned accesses Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 43: Cc3200 Device Encryption

    Network certificates are encrypted using a device-specific key. Serial Flash CC3200 Boot loader Application Image Application Code Application Data Files Data Encrypted Network 128bit Network Processor Certificates SWAS032-030 Figure 5-2. CC3200 Standard MCU Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 44: Wi-Fi Network Processor Subsystem

    Security STA-Enterprise EAP-PEAPv0/TLS WLAN Security STA-Enterprise EAP-PEAPv1/TLS WLAN Security STA-Enterprise EAP-PEAPv0/MSCHAPv2 WLAN Security STA-Enterprise EAP-PEAPv1/MSCHAPv2 WLAN Security STA-Enterprise EAP-TTLS/EAP-TLS WLAN Security STA-Enterprise EAP-TTLS/MSCHAPv2 WLAN Security AP-Personal WPA2 personal security Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 45: Power-Management Subsystem

    LPDS mode at about 15 ms plus the time to load the application from serial flash, which varies according to code size. In this mode, the MCU can be configured to wake up using the RTC timer or external event on a GPIO (GPIO0–GPIO6). Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 46: Memory

    (μDMA) controller can transfer data to and from SRAM and various peripherals. The CC3200 ROM holds the rich set of peripheral drivers, which saves SRAM space. For more information on drivers, see the CC3200 API list. Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 47 Configuration registers 0x400F E000 0x400F EFFF System control 0x400F F000 0x400F FFFF µDMA 0x4200 0000 0x43FF FFFF Bit band alias of 0x4000.0000 through 0x400F.FFFF 0x4401 C000 0x4401 EFFF McASP Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 48: Boot Modes

    In the second phase, the application processor executes user-specific code. Figure 5-3 shows the bootloader flow chart. Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 49 Fn2WJ: Functional mode with a 2-wire SWD mapped to fixed pins. • LDfrUART: UART load mode to flash the system during development and in OEM assembly line (for example, serial flash connected to the CC3200R device). Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 50 SOP values from being sensed at power-up, TI strongly recommends that the SOP2 pin be used only for output signals. On the other hand, the SOP0 and SOP1 pins are multiplexed with WLAN analog test pins and are not available for other functions. Detailed Description Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 51: Applications, Implementation, And Layout

    GPIO8 JTAG_TDI GPIO9 GPIO10 GPIO11 GPIO12 100K GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO22 GPIO28 GPIO30 SOP0 SOP1 TCXO_EN/SOP2 2.7 K CC3200MOD Figure 6-1. CC3200MOD Module Reference Schematic Applications, Implementation, and Layout Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 52: Bill Of Materials

    A poor layout can cause low output power, EVM degradation, sensitivity degradation and mask violations. Applications, Implementation, and Layout Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 53 NOTES AH316M245001-T Taiyo Yuden Can be placed on edge of the PCB and uses very less PCB space RFANT5220110A2T Walsim Need to place on the corner of Applications, Implementation, and Layout Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 54 RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding Figure 6-3. Coplanar Waveguide (Cross Section) with GND and Via Stitching Figure 6-4. CPW with GND (Top View) Applications, Implementation, and Layout Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 55 8. RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. Applications, Implementation, and Layout Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 56: Environmental Requirements And Specifications

    4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile (see Figure 7-1). 5. Temperature profile: Reflow soldering shall be done according to the following temperature profile (see Figure 7-1). 6. Peak temp: 245°C Environmental Requirements and Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 57 CC3200MOD www.ti.com SWRS166 – DECEMBER 2014 Figure 7-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder Joint) Environmental Requirements and Specifications Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 58: Product And Documentation Support

    For orderable part numbers of CC3200MOD devices in the MOB package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative. Product and Documentation Support Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 59: Community Resources

    ZigBee is a registered trademark of ZigBee Alliance. Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
  • Page 60: Mechanical Packaging And Orderable Information

    This data is subject to change without notice and revision of this document. Figure 9-1 shows the CC3200MOD module. Mechanical Drawing Figure 9-1. Mechanical Drawing Mechanical Packaging and Orderable Information Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 61: Package Option

    In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Mechanical Packaging and Orderable Information Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 62 Diameter (mm) (mm) (mm) (mm) (mm) (mm) Quadrant (mm) CC3200MODR1M2AMOBR 1000 330.0±2.0 44.0 17.85±0.10 20.85±0.10 2.50±0.10 24.00±0.10 44.00±0.30 CC3200MODR1M2AMOBT 330.0±2.0 44.0 17.85±0.10 20.85±0.10 2.50±0.10 24.00±0.10 44.00±0.30 Mechanical Packaging and Orderable Information Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 63 TAPE AND REEL BOX DIMENSIONS Width (mm) Device Package Drawing Pins Length (mm) Width (mm) Height (mm) CC3200MODR1M2AMOBR 1000 354.0 354.0 55.0 CC3200MODR1M2AMOBT 354.0 354.0 55.0 Mechanical Packaging and Orderable Information Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 64 PACKAGE OPTION ADDENDUM www.ti.com 30-Jul-2015 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples Drawing (4/5) CC3200MODR1M2AMOBR ACTIVE 1000 Call TI Call TI -20 to 70 CC3200MODR1M2AMOBT ACTIVE Call TI...
  • Page 65 PACKAGE OPTION ADDENDUM www.ti.com 30-Jul-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2...
  • Page 66 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.

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