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Summary of Contents for Texas Instruments CC3000
- Page 1 TI CC3000 BoosterPack Evaluation Module Board User's Guide Literature Number: SWRU331A November 2012 – Revised August 2014...
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Page 2: Table Of Contents
Preface ........................... Revision History ......................... Introduction ................... CC3000 BoosterPack EVM Board ..................BoosterPack EVM Board Top View ................. CC3000 BoosterPack EVM Board Bottom View ........................Antenna ......................Hardware Setup ..................CC3000 BoosterPack Schematic ..................... Bill of Materials (BOM) ..................2.6.1 PCB Design Guidelines ...................... - Page 3 CC3000 BoosterPack EVM Board (Bottom View) ................2-3. Antenna Location and RF Trace Routing ......2-4. Matching Circuit Between the Antenna and the CC3000 BoosterPack EVM Board ............2-5. Return Loss From the ACX Antenna and Matching Circuit ....................2-6.
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Page 4: Preface
SWRU331A – November 2012 – Revised August 2014 Read This First About This Manual This user guide describes how to use the TI CC3000 BoosterPack evaluation module (EVM) board to evaluate the performance of the TI CC3000 module. Related Documentation From Texas Instruments •... -
Page 5: Revision History
Changed link name in Chapter 3 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. SWRU331A – November 2012 – Revised August 2014 Revision History Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated... -
Page 6: Introduction
Internet connectivity for a wide variety of embedded applications. This document details the key parts and features of the CC3000 BoosterPack EVM board along with the different options available for the user and includes layout guidelines to assist in PCB development. -
Page 7: Cc3000 Boosterpack Evm Board
CC3000 BoosterPack EVM board. SWRU331-001 Figure 2-1. BoosterPack EVM Board (Top View) Table 2-1 describes the key parts and jumpers mounted on top of the CC3000 BoosterPack EVM board. Table 2-1. Key Parts of CC3000 BoosterPack EVM Board Top View Part Name Description CC3000MOD Core module for performance evaluation. -
Page 8: J2 Configuration Of The Cc3000 Evm Board
Mode Description Test mode: CC3000 radio Connect pins 1 and 2. Test mode is used with the CC3000 radio tool to operate, test, and tool calibrate the CC3000 chipset designs during development. This tool uses the RS232/UART pins to run radio frequency (RF) RX and TX tests on the CC3000 module. For more information, see CC3000 wiki. -
Page 9: Cc3000 Boosterpack Evm Board Bottom View
Figure 2-2. SWRU331-002 Figure 2-2. CC3000 BoosterPack EVM Board (Bottom View) Table 2-5 describes the signals on J9. Table 2-5. Header J9 of the CC3000 BoosterPack EVM Board (Bottom View) Pin Name Pin Type Descriptions VBAT_IN Power In Battery voltage input to module. For the MSP430 host platform, VIO_HOST = VBAT_IN. -
Page 10: Antenna
The ACX ceramic mounts on the BoosterPack EVM board with a specific layout and matching circuit for the radiation tests conducted in FCC, CE, and IC certifications. Figure 2-3 shows the location of the ACX ceramic antenna on the BoosterPack EVM board and the RF trace routing from the CC3000 module to the antenna. AT8010-E2R9HAA SWRU331-003 Figure 2-3. -
Page 11: Matching Circuit Between The Antenna And The Cc3000 Boosterpack Evm Board
BoosterPack EVM board. AT8010-E2R9HAA 1.8 nH 1.5 pF Figure 2-4. Matching Circuit Between the Antenna and the CC3000 BoosterPack EVM Board The return loss is based on the matching circuit and RF trace routing, as shown in Figure 2-5. -
Page 12: Antenna Radiation Pattern
Antenna www.ti.com Figure 2-6 shows the antenna radiation pattern. SWRU331-006 Figure 2-6. Antenna Radiation Pattern CC3000 BoosterPack EVM Board SWRU331A – November 2012 – Revised August 2014 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated... -
Page 13: Hardware Setup
SWRU331-007 Figure 2-7. Host PCB Mating Connector Arrangement Table 2-7 compares the pins of the LaunchPad MSP-EXP430G2 board with the CC3000 BoosterPack EVM board. Table 2-7. LaunchPad to BoosterPack Pin Comparison MSP430 Port... -
Page 14: Cc3000 Boosterpack Schematic
CC3000 BoosterPack Schematic www.ti.com CC3000 BoosterPack Schematic Figure 2-8 shows the CC3000 BoosterPack schematics. Figure 2-8. CC3000 BoosterPack Schematics CC3000 BoosterPack EVM Board SWRU331A – November 2012 – Revised August 2014 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated... -
Page 15: Bill Of Materials (Bom)
Bill of Materials (BOM) 2.6.1 PCB Design Guidelines The recommendations in this document are based on a two-layer PCB with the CC3000 module. The PCB is built using standard FR4 material. Both layers are used for signal routing. TI recommends keeping the traces of the SPI signals as short as possible. -
Page 16: Antenna
BoosterPack antenna. NOTE: The antenna vendor determines the antenna guidelines. SWRU331-010 Figure 2-10. Antenna Layout Guidelines CC3000 BoosterPack EVM Board SWRU331A – November 2012 – Revised August 2014 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated... -
Page 17: Power Trace
The PCB must have a strong ground with more ground vias under the module for system stability and thermal dissipation. Ground vias must be close to the pad. Figure 2-12 shows the ground routing for the CC3000 BoosterPack EVM board. SWRU331-012 Figure 2-12. Ground Routing for the CC3000 BoosterPack EVM Board SWRU331A –... -
Page 18: Application Development
For example applications, see the CC3000 wiki. The CC3000 BoosterPack also can be used on other platforms with the same connector interface. The TI wiki also has a host driver porting guide to assist with porting to other platforms. Figure 3-1 shows the Launchpad MSP-EXP430G2 test platform and the CC3000 BoosterPack EVM board. - Page 19 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
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