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BOOSTXL-CC3120MOD SimpleLink™
BoosterPack™ Plug-in Module and IoT Solution
The CC3120MODRNMMOB (CC3120MOD) module is part of the SimpleLink™ microcontroller (MCU)
platform that shares a common, easy-to-use development environment with a single core software
development kit (SDK) and rich tool set. A one-time integration of the SimpleLink platform lets you add
any combination of devices from the portfolio into your design. The ultimate goal of the SimpleLink
platform is to achieve 100 percent code reuse when your design requirements change. For more
information, visit www.ti.com/simplelink.
The BOOSTXL-CC3120MOD is a 2.4 GHz Wi-Fi® SimpleLink™ BoosterPack™ with the TI CC3120MOD
module. The CC3120MOD is FCC, IC, CE, MIC, and SRRC certified. The purpose of this document is to
provide the end integrator with the information necessary to incorporate the CC3120MOD module into
their final product. It also provided information how to run the BOOSTXL-CC3120MOD SimpleLink
BoosterPack to evaluate the CC3120MOD module.
Contents
1. Overview ............................................................................................................................................... 3
1.1
General Features . .......................................................................................................................... 7
1.2
Key Benefits .................................................................................................................................. 8
1.3
Key Benefits ................................................................................................................................ 10
2.
Connectors and Jumpers . ............................................................................................................ 10
2.1
Connectors and Jumpers . ............................................................................................................ 11
2.2
Jumper Settings . .......................................................................................................................... 12
2.3
2x20 Pin connector assignment .................................................................................................. 12
3. Electrical Characteristics ..................................................................................................................... 13
4. Antenna Characteristics ...................................................................................................................... 13
5. Circuit Design ...................................................................................................................................... 13
5.1
CC3120MOD Reference schematic ............................................................................................. 13
5.2 Bill of Materials (BOM) . ....................................................................................................................... 14
6. Layout Guidelines . ............................................................................................................................... 15
6.1
Board Layout ............................................................................................................................... 15
6.2
General Layout Recommendations . ............................................................................................ 16
6.3
RF Layout Recommendations ..................................................................................................... 17
6.4
Antenna Placement and Routing ................................................................................................ 18
6.5
Transmission Line Considerations . .............................................................................................. 18
7. BOOSTXL-CC3120MOD Operational Setup and Testing ..................................................................... 19
7.1
Power .......................................................................................................................................... 20
7.1.1 Power from the LaunchPad kit or the CC31XXEMUBOOST ........................................................ 20
7.1.2 Onboard LDO Power ................................................................................................................... 22
7.2
Measuring the CC3120MOD Current Draw ................................................................................ 22
7.2.1 Low-Current Measurements (Hibernate and LPDS) ................................................................... 22
7.2.2 Active Current Measurements . ................................................................................................... 23
7.3
Clocking ....................................................................................................................................... 24
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Table of Contents
Related Manuals for Texas Instruments SimpleLink BoosterPack BOOSTXL-CC3120MOD
Summary of Contents for Texas Instruments SimpleLink BoosterPack BOOSTXL-CC3120MOD
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Page 1: Table Of Contents
BOOSTXL‐CC3120MOD SimpleLink™ BoosterPack™ Plug‐in Module and IoT Solution The CC3120MODRNMMOB (CC3120MOD) module is part of the SimpleLink™ microcontroller (MCU) platform that shares a common, easy‐to‐use development environment with a single core software development kit (SDK) and rich tool set. A one‐time integration of the SimpleLink platform lets you add any combination of devices from the portfolio into your design. The ultimate goal of the SimpleLink platform is to achieve 100 percent code reuse when your design requirements change. For more information, visit www.ti.com/simplelink. The BOOSTXL‐CC3120MOD is a 2.4 GHz Wi‐Fi® SimpleLink™ BoosterPack™ with the TI CC3120MOD module. The CC3120MOD is FCC, IC, CE, MIC, and SRRC certified. The purpose of this document is to provide the end integrator with the information necessary to incorporate the CC3120MOD module into their final product. It also provided information how to run the BOOSTXL‐CC3120MOD SimpleLink BoosterPack to evaluate the CC3120MOD module. Contents 1. Overview ............................... 3 1.1 General Features ........................... 7 1.2 Key Benefits .......................... 8 1.3 Key Benefits .......................... 10 2. Connectors and Jumpers ...................... 10 2.1 Connectors and Jumpers ...................... 11 2.2 Jumper Settings ........................... 12 2.3 2x20 Pin connector assignment .................... 12 3. Electrical Characteristics ........................ 13 4. ... - Page 2 3.3 Waste Electrical and Electronic Equipment (WEEE) .............. 36 3.4 OEM / Host manufacturer responsibilities ................. 36 3.5 Antenna specifications ........................ 36 Trademarks SimpleLink, BoosterPack, Internet-on-a chip, Texas Instruments, LaunchPad, MSP432 are trademarks of Texas Instruments. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Wi-Fi is a trademark of Wi-Fi Alliance. ...
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Page 3: Overview
Overview Figure 1‐1 shows a functional block diagram of the CC3120MOD module. CC3X20 40Mhz 32.768 kHz RF_ANT1 UART nReset 2.3 – 3.6V VBAT 32Mbit SFlash Figure 1‐1: CC3120MOD Functional Block Diagram Figure 1‐2 shows a functional block diagram of the BOOSTXL‐CC3120MOD SimpleLink BoosterPack ... - Page 4 CC3120MODRNMMOB Figure 1‐2: Functional block diagram of the BOOSTXL‐CC3120MOD Figure 1‐3 shows the hardware implementation of the BOOSTXL‐CC3120MOD ...
- Page 5 Figure 1‐3: Hardware implementation of the BOOSTXL‐CC3120MOD Figure 1‐4 shows the Top Overlay of the BOOSTXL‐CC3210MOD SimpleLink BoosterPack. ...
- Page 6 Figure 1‐4: BOOSTXL‐CC3120MOD Top Overlay Figure 1‐5 shows the Top Solder of the BOOSTXL‐CC3210MOD SimpleLink BoosterPack. ...
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Page 7: General Features
Figure 1‐5: BOOSTXL‐CC3120MOD Top Solder General Features The BOOSTXL‐CC3120MOD SimpleLink BoostPack includes the following features: Two 20‐pin stackable connectors compatible with the TI SimpleLink Launchpad™ and BoosterPack architecture. Built‐in chip antenna Optional U.FL connector for external antennas or conducted based testing. Power from an onboard LDO by using the USB or 3.3‐Vconnector form the LaunchPad MCU Three push‐buttons Two LEDs Jumper for current measurements with provisions to mount a 0.1‐ohm resistor for measurement with a voltmeter 32‐Mbit serial Flash Two‐layer PCB ... -
Page 8: Key Benefits
Dimensions: 58.52 mm (L) x 43.18 (W) Key Benefits The CC3120MOD module offers the following benefits: The CC3120MOD (CC3120MODRNMMOB) is a Wi‐Fi® Module Which Includes the CC3120RNMARGK Wi‐Fi Network Processor (NWP). The Fully Integrated, Industrial Temperature Grade, Green Module, Includes All Required Clocks, Serial Peripheral Interface (SPI) Flash, and Passives. FCC, IC, CE, MIC, and SRRC Certified Wi‐Fi CERTIFIED™ Modules, With Ability to Request Certificate Transfer for Wi‐Fi Alliance Members Featuring a Dedicated Internet‐on‐a chip™ Wi‐Fi NWP Which Completely Offloads Wi‐Fi and Internet Protocols from the Application MCU Wi‐Fi Modes o 802.11b/g/n Station o 802.11b/g/n Access Point (AP) Supporting up to Four Stations o Wi‐Fi Direct® Client/Group Owner o WPA2 Personal and Enterprise Security: WEP, WPA/WPA2 PSK, WPA2 Enterprise (802.1x) IPv4 and IPv6 TCP/IP Stack o Industry‐Standard BSD Socket Application Programming Interfaces (APIs) 16 Simultaneous TCP or UDP Sockets 6 Simultaneous TLS and SSL Sockets IP Addressing: Static IP, LLA, DHCPv4, and DHCPv6 With Duplicate Address Detection (DAD) ... - Page 9 Secure Key Storage File System Security Software Tamper Detection Cloning Protection Embedded Network Applications Running on a Dedicated NWP o HTTP/HTTPS Web Server With Dynamic User Callbacks o mDNS, DNS‐SD, DHCP Server o Ping Recovery Mechanism – Ability to Recover to Factory Defaults Wi‐Fi TX Power o 17 dBm at 1 DSSS o 16.5 dBm at MCS0 Wi‐Fi RX Sensitivity o –95 dBm at 1 DSSS o –73.5 dBm at 54 OFDM Application Throughput o UDP: 16 Mbps o TCP: 13 Mbps Power‐Management Subsystem o Integrated DC‐DC Converters Support a Wide Range of Supply Voltage: ...
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Page 10: Key Benefits
Key Benefits The CC3120MOD module is designed for the following internet of Things (IoT) applications, including: Cloud Connectivity Internet Gateway Home and Building Automation Appliances Access Control Security Systems Smart Energy Industrial Control Smart Plug and Metering ... -
Page 11: Connectors And Jumpers
Figure 2‐2: BOOSTXL‐CC3120MOD Bottom View Connectors and Jumpers Table 2‐1 lists the push‐buttons on the BOOSTXL‐CC3120MOD Reference Usage Comments Factory Reset This is used to restore the serial flash to the factory default image. Hold the button pressed and then toggle the RESET push button. RESET This can be used to Reset the device. Holding the button down sets the device to the shutdown state. -
Page 12: Jumper Settings
Jumper Settings Table 2‐3 lists the jumper settings on the BOOSTXL‐CC3120MD Reference Usage Comments USB connector For powering the BoosterPack when connected with a LaunchPad which cannot source enough current. Power selection Choose the power supply from the LauchPad kit or the on- board USB. J8 (1-2) power from MCU LaunchPad J8 (2-3) power from on-board USB using 3.3 V LDO Current For Hibernate and LPDS currents, connect an ammeter across J6 : Range (<... -
Page 13: Electrical Characteristics
Table 2‐5 lists the inner row connectors of the two 20‐pin headers. Pin No Signal Name Direction Pin No Signal Name Direction P3.1 +5 V P4.1 UNUSED P3.2 P4.2 UNUSED P3.3 UNUSED P4.3 UNUSED P3.4 UNUSED P4.4 UART1_CTS P3.5 UNUSED P4.5 UART1_RTS P3.6 UNUSED P4.6 UNUSED P3.7 UNUSED P4.7 NWP_LOG_TX P3.8 UNUSED P4.8... -
Page 14: Bill Of Materials (Bom)
Figure 5‐1: CC3120MOD Engine area reference schematic Bill of Materials (BOM) The CC3120MOD main engine area reference BOM is show in Table 5‐1 below. The full BOOSTXL‐ CC3120MOD reference BOM can be found at: http://www.ti.com/lit/zip/swrc339. Table 5‐1: CC3120MOD Engine area reference BOM ... -
Page 15: Layout Guidelines
Layout Guidelines The integrator of the CC3120MOD module must comply with the PCB layout recommendations described in the following subsections to preserve/minimize the risk with regulatory certifications for FCC, IC, CE, MIC, and SRRC. Moreover, TI recommends customers follow the guidelines described in this section to achieve similar performance. Board Layout The reference layout consists of a 2 layer design. Figure 6‐1 shows BOOSTXL‐CC3120MOD Top layer. Figure 6‐1: BOOTXL‐CC3120MOD Top Layer Figure 6‐2 shows the BOOSTXL‐CC3120MOD Bottom layer. ... -
Page 16: General Layout Recommendations
Figure 6‐2: BOOSTXL‐CC3120MOD Bottom Layer General Layout Recommendations Ensure that the following general layout recommendations are followed: Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. Do not run signal traces underneath the module on a layer where the module is mounted. ... -
Page 17: Rf Layout Recommendations
RF Layout Recommendations The RF section of this wireless device gets top priority in terms of layout. It is very important for the RF section to be laid out correctly to ensure optimum performance from the device. A poor layout can cause low‐output power, EVM degradation, sensitivity degradation, and mask violations. Figure 6‐3 shows the RF placement and routing of the CC3120MOD module. Figure 6‐3: RF Section Layout For optimal RF performance, ensure the copper cut out on the top layer under the RF‐BG‐pin (pin 31), is as shown in Figure 6‐4 below: Figure 6‐4: Top layer copper pull back on RF pads ... -
Page 18: Antenna Placement And Routing
Antenna Placement and Routing The antenna is the element used to convert the guided waves on the PCB traces to the free space electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and data rates. Table 6‐2 provides a summary of the antenna guidelines. Item Guidelines 1 Place the antenna on an edge or corner of the PCB. 2 Ensure that no signals are routed across the antenna elements on all the layers of the PCB. 3 Most antennas, including the chip antenna used on the booster pack, require ground clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers as well. 4 Ensure that there is provision to place matching components for the antenna. These must be tuned for best return loss when the complete board is assembled. Any plastics or casing must also be mounted while tuning the antenna because this can impact the impedance. 5 Ensure that the antenna impedance is 50 Ω because the device is rated to work only with a 50‐Ω system. 6 In case of printed antenna, ensure that the simulation is performed with the solder mask in consideration. 7 Ensure that the antenna has a near omni‐directional pattern. 8 The feed point of the antenna is required to be grounded. This is only for the antenna type used on the CC3120MOD BoosterPack. Refer to the specific antenna data sheets for the recommendations. Table 6‐2: Antenna Guidelines Transmission Line Considerations The RF signal from the device is routed to the antenna using a Coplanar Waveguide with ground (CPW‐ G) structure. The CPW‐G structure offers the maximum amount of isolation and the best possible shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding. Figure 6‐5 shows a cross section of the coplanar waveguide with the critical dimensions. Figure 6‐5: Coplanar Waveguide (Cross Section) ... -
Page 19: Boostxl-Cc3120Mod Operational Setup And Testing
Figure 6‐6 shows the top view of the coplanar waveguide with GND and via stitching. Figure 6‐6: CPW with GND and via stitching (Top view) The recommended values for the PCB are provided for 2‐layer boards it Table 6‐3 and 4‐layer boards in Table 6‐4. Table 6‐3: Recommended PCB Values for 2‐Layer Board (L1 to L2 =42.1 mils) Table 6‐4: Recommended PCB Values for 4‐layer Board (L1 to L2 = 16 mils) BOOSTXL‐CC3120MOD Operational Setup and Testing The SimpleLink Wi‐Fi CC3120MOD wireless network processor provides the flexibility to add Wi‐Fi to any microcontroller (MCU). This user guide explains the various configurations of the CC3120MOD ... -
Page 20: Power
BoosterPack™ plug‐in module. This Internet‐on‐a chip™ solution contains all that is needed to easily create Internet‐of‐things solutions – enhanced security features, quick connection establishment, cloud support and more. The CC3120MOD module BoosterPack can be used in several ways. It can be connected to a Texas Instruments™ MCU Launchpad™ development kit (software examples provided for MSP‐EXP430F5529LP). It can also be plugged into a CC31XXEMUBOOST board and connected to a PC for MCU emulation. Finally, the device can be connected onto an adapter board (BOOST‐CCEMADAPTER), allowing customers to use the BOOSTXL‐CC3120MOD device with additional platforms beyond TI Launchpad kits. Note: The CC31XXEMUBOOST device is an advanced emulation board that is required for flashing the BOOSTXL‐CC3120MOD, using the radio tool (radio performance testing or putting into certification modules), capturing network processor logs, and using SL studio. This kit comes in three configurations: BOOSTXL‐CC3120MOD which contains the following: o One BOOSTXL‐CC3120MOD board o One micro USB cable o One quick start guide BOOSTXL‐CC3120MOD + MSP432P401R which contains the following: o SimpleLink Wi‐Fi CC3120MOD BoosterPack o MSP‐EXP432P401R LaunchPad BOOSTXL‐CC3120MOD + CC31XXEMUBOOST which contains the following: o SimpleLink Wi‐Fi CC3120 BoosterPack o Advanced Emulation BoosterPack Power The board is designed to accept power from a connected LaunchPad kit or through the CC31XXEMUBOOST board. Some of the LaunchPad kits are not capable of sourcing the peak current requirements of Wi‐Fi, which may be as high as 400 mA. If the LaunchPad kit cannot source the peak ... - Page 21 example, the LaunchPad kit with only 20 pins), the USB connector on the BOOSTXL‐CC3120MOD should be used to provide the LDO input as shown in Figure 7‐1. Figure 7‐1: 3.3‐V Power from MCU LaunchPad Kit Figure 7‐2: USB Location on BoosterPack Module ...
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Page 22: Onboard Ldo Power
7.1.2 Onboard LDO Power On some LaunchPad kits, the 3.3 V is not capable of sourcing the 350‐mA peak current required for the BOOSTXL‐CC3120MOD module. If the 350‐mA peak current cannot be sourced, the onboard 3.3‐V LDO can be used (see Figure 7‐3). This LDO must be sourced from the USB connector on the BOOSTXL‐ CC3120MOD and the LaunchPad kit in a shared‐load manner. Figure 7‐3: 3‐3‐V Power From LDO Measuring the CC3120MOD Current Draw 7.2.1 Low‐Current Measurements (Hibernate and LPDS) To measure the current draw of the CC3120RM and the serial flash, a jumper is provided on the board labeled J6. By removing this jumper, one can place an ammeter into this path and the current can be observed. This method is recommended for measuring LPDS and hibernate currents that are of the order of few 10s of micro amps. The jumper is removed and an ammeter is added in series to measure the hibernate and LPDS currents (see Figure 7‐4). ... -
Page 23: Active Current Measurements
Figure 7‐4: Low‐Current Measurement 7.2.2 Active Current Measurements To measure active current in a profile form, it is recommended to use a 0.1‐Ω, 1% resistor on the board and measure the differential voltage across it (see Figure 7‐4). This can be done using a voltmeter or an oscilloscope for measuring the current profile. ... -
Page 24: Clocking
Figure 7‐4: Active Current Measurement Clocking All of the required clocks are inside the module. There is no need to supply any external clock. Performing Conducted Tests The BoosterPack board by default ships with the RF signal connected to the onboard chip antenna. Figure 7‐5 shows that there is a U.FL connector on the board that can be used for conducting testing or to connect an external antenna. This requires a board modification (mounting C4 and depopulating C5) as shown in Figure 7‐5. ... -
Page 25: Connecting To Pc Using The Cc31Xxemuboost
Figure 7‐5: U.FL Connector Connecting to PC Using the CC31XXEMUBOOST 7.5.1 CC31XXEMUBOOST 7.5.1.1 Overview The CC31XXEMUBOOST is designed to connect the BoosterPack module to a PC using a USB connection. This updates the firmware patches, which are stored in the serial flash, on the BoosterPack; and in software development using SimpleLink Studio. The board is also used for measuring the RF performance using a software tool named RadioTool. 7.5.1.2 Hardware details Figure 7‐6 shows the CC31XXEMUBOOST board. ... - Page 26 Figure 7‐6: CC31XXEMUBOOST board The board has two FTDI ICs to enumerate multiple COM and D2XX ports. The details of the ports are given in Table 7‐1 below. Port Number Port Type Usage Comments D2XX SPI port for SL Studio D2XX GPIO for SL Studio Control the nRESET, nHIB, IRQ COM port for Flash programming Network processor logger output. Used with specific tools to analyze the network processor logs.
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Page 27: Driver Requirements
Figure 7‐7: COM port list Table 7‐2 lists the available ports on J5. Port Number Port Type Usage Comments Used for TI internal debug only. MAC logger Used for TI internal debug only. Table7‐2: Ports on J5 7.5.1.3 Driver Requirements The FTDI Debug board requires you to install the associated drivers on a PC. This package is available as part of the SDK release and is located at: [Install-Path]\CC3120- sdk\tools\cc31xx_board_drivers\. The install path is usually C:\ti\CC3120SDK. 7.5.2 Connecting to Board Figure 7‐8 shows the connection of the CC3120 BoosterPack module to the EMUBOOST board. The connectors should be aligned carefully as it does not have polarity protection and the Flash can be ... -
Page 28: Boostxl-Cc3120Mod Jumper Settings
Figure 7‐8: BOOSTXL‐CC3120MOD Connected to CC31XXEMUBOOST CAUTION Align pin 1 of the boards together using the triangle marking on the PCB. An incorrect connection can permanently destroy the boards. Ensure that none of the header pins are bent before connecting the boards. 7.5.3 BOOSTXL‐CC3120MOD Jumper Settings Table 7‐3 specifies the jumpers to be installed on the BOOSTXL‐CC3120RM before pairing with the EMUBOOST board Jumper Notes Settings J8 (1-2) Power the BoosterPack from the EMU BOOST. The jumper shall be placed so that it is nearer to the edge of the PCB. -
Page 29: Cc31Xxemuboost Jumper Settings
7.5.4 CC31XXEMUBOOST Jumper Settings Table 7‐4 specifies the jumpers to be installed while pairing with the FTDI board. Note that jumpers not listed in Table 7‐4 remain open. Jumper Settings Notes J4 (short) Provide 3.3 V to the BoosterPack J22 (short) Provide 5.0 V to the BoosterPack J3 (1-2) Route the NWP logs to the Dual port also Table 7‐4: CC31XXEMUBOOST Jumper Settings 7.5.5 Connecting to a LaunchPad Kit The CC3120RM BoosterPack module can be directly connected to a compatible LaunchPad development kit using the standard 2x20 pin connectors. The jumper settings needed for this connection are the same ... - Page 30 separately. For this, a USB connector is provided on the BoosterPack module to provide the 3.3 V separately The power supply jumpers should be configured as shown in Figure 7‐9 when the power is supplied from the on‐board USB connector. Connect USB Figure 7‐9: Jumper Configuration when working with Launchpad kit NOTE: Since there are two power sources in this setup, it is important to follow the power‐up sequence. Always power the BoosterPack module before powering the LaunchPad kit. ...
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Page 31: Manual Information To The End User
Manual Information to the End User The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual must include all required regulatory information/warning as shown in this manual. RF Function and Frequency Range The CC3120MODRNMMOB is design to operate in the WLAN 2.4GHz band. The CC3120MODRNMMOB supports the following channels dependent on the region of operation: FCC / IC: Channels 1 through 11 (2142 MHz to 2462 MHz) EU: Channels 1 through 13 (2142 MHz to 2472 MHz) JP: Channels 1 through 13 (2142 MHz to 2472 MHz) Note that the CC3220MODx and CC3220MODAx do not support determination of its region thru any external mechanism. The region is set by the application SW or at the time of programming of the device. The end user is unable to change the region of operation at any time. NOTE: The maximum RF power transmitted in each WLAN 2.4GHz band is 18 dBm. FCC /IC Certification and Statement This device is intended for OEM integrators under the following conditions: The antenna must be installed such that 20 cm is maintained between the antenna and users, The transmitter module may not be co‐located with any other transmitter or antenna. To comply with FCC / IC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile exposure condition must not exceed: 2.5 dBi in WLAN 2.4G In the event that these conditions cannot be met (for example certain laptop configurations or co‐ location with another transmitter), then the FCC / IC authorization is no longer considered valid and the FCC / IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re‐evaluating the end product (including the transmitter) and obtaining a separate FCC / IC authorization. ... -
Page 32: Fcc
FCC The TI CC3120MOD module is certified for FCC as a single‐modular transmitter. The module is an FCC‐ certified radio module that carries a modular grant. You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: This device may not cause harmful interference. This device must accept any interference received, including interference that may cause undesired operation of the device. CAUTION FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from the one the receiver is connected too. Consult the dealer or an experienced radio or TV technician for help. The antenna listing in Section 3.5 of this document were verified in the compliance testing. Use only the antennas on this list. A separate approval is required for all other operating configurations, including different antenna configurations. CAN ICES‐3(B)/NMB‐3(B) Certification and Statement The TI CC3120MOD module is certified for IC as a single‐modular transmitter. The TI CC3120MOD ... -
Page 33: End Product Labeling
Operation is subject to the following two conditions: This device may not cause interference. This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: L'appareil ne doit pas produire de brouillage L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. CAUTION IC RF Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body. Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This radio transmitter (451I‐CC3120MOD) has been approved by Industry Canada to operate with the antenna types listed in Section 3.5 of this document with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. The antenna listing in Section 3.5 of this document were verified in the compliance testing. Use only the antennas on this list. A separate approval is required for all other operating configurations, including different antenna configurations. End Product Labeling This module is designed to comply with the FCC statement, FCC ID: Z64‐CC3120MOD. The host system using this module must display a visible label indicating the following text: Contains FCC ID: Z64‐CC3120MOD This module is designed to comply with the IC statement, IC: 451I‐CC3120MOD. The host system using ... -
Page 34: Device Classifications
Contains IC: 451I‐CC3120MOD This module is designed to comply with the JP statement, 201‐170387. The host system using this module must display a visible label indicating the following text: Contains transmitter module with certificate number 201‐170387 Device Classifications Since host devices vary widely with design features and configurations module integrators shall follow the guidelines below regarding device classification and simultaneous transmission, and seek guidance from their preferred regulatory test lab to determine how regulatory guidelines will impact the device compliance. Proactive management of the regulatory process will minimize unexpected schedule delays and costs due to unplanned testing activities. The module integrator must determine the minimum distance required between their host device and the user’s body. The FCC provides device classification definitions to assist in making the correct determination. Note that these classifications are guidelines only; strict adherence to a device classification may not satisfy the regulatory requirement as near‐body device design details may vary widely. Your preferred test lab will be able to assist in determining the appropriate device category for your host product and if a KDB or PBA must be submitted to the FCC. Note, the module you are using has been granted modular approval for mobile applications. Portable applications may require further RF exposure (SAR) evaluations. It is also likely that the host / module combination will need to undergo testing for FCC Part 15 regardless of the device classification. Your preferred test lab will be able to assist in determining the exact tests which are required on the host / module combination. FCC Definitions Portable: (§2.1093) — A portable device is defined as a transmitting device designed to be used so that the radiating structure(s) of the device is / are within 20 centimeters of the body of the user. Mobile: (§2.1091) (b) — A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter’s radiating structure(s) and the body of the user or nearby persons. Per §2.1091d(d)(4) In some cases (for example, modular or desktop transmitters), the potential conditions of use of a device may not allow easy classification of that device as either Mobile or Portable. In these cases, applicants are responsible for determining minimum ... -
Page 35: Simultaneous Transmission Evaluation
distances for compliance for the intended use and installation of the device based on evaluation of either specific absorption rate (SAR), field strength, or power density, whichever is most appropriate. Simultaneous Transmission Evaluation This module has not been evaluated or approved for simultaneous transmission as it is impossible to determine the exact multi‐transmission scenario that a host manufacturer may choose. Any simultaneous transmission condition established through module integration into a host product must be evaluated per the requirements in KDB447498D01(8) and KDB616217D01,D03 (for laptop, notebook, netbook, and tablet applications). These requirements include, but are not limited to: Transmitters and modules certified for mobile or portable exposure conditions can be incorporated in mobile host devices without further testing or certification when: The closest separation among all simultaneous transmitting antennas is >20 cm, Or Antenna separation distance and MPE compliance requirements for ALL simultaneous transmitting antennas have been specified in the application filing of at least one of the certified transmitters within the host device. In addition, when transmitters certified for portable use are incorporated in a mobile host device, the antenna(s) must be >5 cm from all other simultaneous transmitting antennas. All antennas in the final product must be at least 20 cm from users and nearby persons. EU Certification and Statement RF Exposure Information (MPE) This device has been tested and meets applicable limits for Radio Frequency (RF) exposure. To comply with the RF exposure requirements, this module must be installed in a host platform that is intended to be operated in a minimum of 20 cm separation distance to the user. Simplified DoC statement Hereby, Texas Instruments declares that the radio equipment type CC3120MODRNMMOB is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.ti.com/lit/pdf/SSZQ060. ... -
Page 36: Waste Electrical And Electronic Equipment (Weee)
Waste Electrical and Electronic Equipment (WEEE) Waste Electrical and Electronic Equipment (WEEE) This symbol means that according to local laws and regulations your product and/or battery shall be disposed of separately from household waste. When this product reaches its end of life, take it to a collection point designated by local authorities. Proper recycling of your product will protect human health and the environment. OEM / Host manufacturer responsibilities OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the RED before it can be placed on the EU market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the RED. This module must not be incorporated into any other device or system without retesting for compliance as multi‐radio and combined equipment. Antenna specifications In all cases, assessment of the final product must be met against the Essential requirements of RE Directive Article 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements. 1. The following antennas were verified in the conformity testing, and for compliance the antenna shall not be modified. A separate approval is required for all other operating configurations, including different antenna configurations. ... - Page 37 2. If any other simultaneous transmission radio is installed in the host platform together with this module, or above restrictions cannot be kept, a separate RF exposure assessment and CE equipment certification is required. ...