Texas Instruments SimpleLink CC3220MODSF12MOBR Manuals

Manuals and User Guides for Texas Instruments SimpleLink CC3220MODSF12MOBR. We have 1 Texas Instruments SimpleLink CC3220MODSF12MOBR manual available for free PDF download: Manual

Texas Instruments SimpleLink CC3220MODSF12MOBR Manual

Texas Instruments SimpleLink CC3220MODSF12MOBR Manual (91 pages)

Wireless MCU Modules

Brand: Texas Instruments | Category: Control Unit | Size: 3 MB

Table of Contents

Features
1
Applications
2
Description
3
Functional Block Diagrams
5
Table of Contents
8
Revision History
8
Device Comparison
9
Related Products
10
Terminal Configuration and Functions
11
Cc3220Modx and Cc3220Modax Pin Diagram
11
Pin Attributes
13
Connections for Unused Pins
14
Pin Attributes and Pin Multiplexing
15
Drive Strength and Reset States for Analog-Digital Multiplexed Pins
26
Pad State after Application of Power to Chip, but before Reset Release
26
Specifications
27
Absolute Maximum Ratings
27
ESD Ratings
27
Recommended Operating Conditions
27
Current Consumption (CC3220MODS and CC3220MODAS)
28
Current Consumption (CC3220MODSF and CC3220MODASF)
29
TX Power and IBAT Versus TX Power Level Settings
30
Brownout and Blackout Conditions
32
Electrical Characteristics
33
Cc3220Modax Antenna Characteristics
35
WLAN Receiver Characteristics
35
WLAN Transmitter Characteristics
35
Reset Requirement
35
Thermal Resistance Characteristics for MOB and MON Packages
36
Timing and Switching Characteristics
36
Detailed Description
48
Overview
48
Arm ® Cortex ® -M4 Processor Core Subsystem
48
Wi-Fi ® Network Processor Subsystem
48
Security
51
Power-Management Subsystem
53
Low-Power Operating Mode
53
Memory
55
Restoring Factory Default Configuration
57
Boot Modes
57
Device Certification and Qualification
58
Module Markings
60
End Product Labeling
62
Manual Information to the End User
62
Applications, Implementation, and Layout
63
Typical Application
64
Device Connection and Layout Fundamentals
67
PCB Layout Guidelines
67
Environmental Requirements and Specifications
73
PCB Bending
73
Handling Environment
73
Storage Condition
73
Baking Conditions
73
Soldering and Reflow Condition
74
Device and Documentation Support
75
Development Tools and Software
75
Firmware Updates
75
Device Nomenclature
76
Documentation Support
77
Trademarks
79
Mechanical, Packaging, and Orderable Information
80
Mechanical, Land, and Solder Paste Drawings
80
Package Option Addendum
80
Document
80

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