Thermal Resistance Characteristics For Mob And Mon Packages; Timing And Switching Characteristics - Texas Instruments SimpleLink CC3220MOD Series Manual

CC3220MOD, CC3220MODA
SWRS206E – MARCH 2017 – REVISED MAY 2021

8.13 Thermal Resistance Characteristics for MOB and MON Packages

NAME DESCRIPTION
RΘ Junction-to-case
JC
RΘ Junction-to-board
JB
RΘ Junction-to-free air
JA
Psi Junction-to-package top
JT
Psi Junction-to-board
JB
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ
a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70°C is assumed.
(3) m/s = meters per second.

8.14 Timing and Switching Characteristics

8.14.1 Power-Up Sequencing
For proper start-up of the CC3220MODx and CC3220MODAx modules, perform the recommended power-up
sequencing as follows:
1. Tie V (pin 37) and V
BAT1
2. Hold the nRESET pin low while the supplies are ramping up.
Figure 8-6 shows the reset timing diagram for the first-time power-up and reset removal.
Figure 8-6. First-Time Power-Up and Reset Removal Timing Diagram
36 Submit Document Feedback
(pin 40) together on the board.
BAT2
T1 T2
VBAT
nRESET
POWER
RESET HW INIT
STATE
OFF
32-kHz
RTC CLK
Product Folder Links:
T3 T4
APP CODE
FW INIT
LOAD
CC3220MOD CC3220MODA
(1) (2)
°C/W AIR FLOW (m/s)
11.4
8.0
18.7
5.3
7.7
] value, which is based on
JC
APP CODE
EXECUTION
Copyright © 2021 Texas Instruments Incorporated
www.ti.com
(3)
0.00
0.00
0.00
0.00
0.00