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Quectel SC690A Series Hardware Design

Quectel SC690A Series Hardware Design

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SC690A Series
Hardware Design
Smart Module Series
Version: 1.0.0
Date: 2021-12-07
Status: Preliminary

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Summary of Contents for Quectel SC690A Series

  • Page 1 SC690A Series Hardware Design Smart Module Series Version: 1.0.0 Date: 2021-12-07 Status: Preliminary...
  • Page 2 Smart Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District,...
  • Page 3 Privacy Policy To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Smart Module Series About the Document Revision History Revision Date Author Description 2021-12-07 Mary SHEN/Kevin ZHOU Creation of the document 1.0.0 2021-12-07 Mary SHEN/Kevin ZHOU Preliminary SC690A_Series_Hardware_Design 4 / 105...

  • Page 6: Table Of Contents

    Smart Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 5 Table Index ..............................8 Figure Index ............................... 10 Introduction ............................12 1.1. Special Marks .......................... 15 Product Overview ..........................16 2.1. Frequency Bands and Functions .................... 16 2.2.
  • Page 7 Smart Module Series 4.16. JTAG Interface ........................69 4.17. LED Driver Interface ........................ 70 4.18. Audio Interfaces ........................70 4.18.1. Reference Circuit Design for Microphone Interfaces ..........72 4.18.2. Reference Circuit Design for Receiver Interface ............ 73 4.18.3. Reference Circuit Design for Headset Interface ............. 73 4.18.4.
  • Page 8 Smart Module Series 8.3.1. Carrier Tape ........................102 8.3.2. Plastic Reel ........................102 8.3.3. Packaging Process ...................... 103 Appendix References ........................104 SC690A_Series_Hardware_Design 7 / 105...
  • Page 9 Smart Module Series Table Index Table 1: Special Marks ..........................15 Table 2: Brief Introduction of the Module ....................16 Table 3: Wireless Network Type ......................... 16 Table 4: Key Features ..........................17 Table 5: I/O Parameters Definition ......................22 Table 6: Pin Description ..........................
  • Page 10 Smart Module Series Table 42: Bluetooth Data Rate and Version ....................83 Table 43: Bluetooth Transmitting and Receiving Performance ..............84 Table 44: Requirements for Antenna Design ..................... 86 Table 45: Absolute Maximum Ratings ......................90 Table 46: The Module’s Power Supply Ratings ..................91 Table 47: SC690A-NA Power Consumption ....................
  • Page 11 Smart Module Series Figure Index Figure 1: Functional Diagram ........................21 Figure 2: Pin Assignment (Top View) ......................21 Figure 3: Reference Design for Battery Charging Circuit ................37 Figure 4: Reference Circuit of Power Supply ..................... 38 Figure 5: Voltage Drop Sample ........................39 Figure 6: Structure of Power Supply ......................
  • Page 12 Smart Module Series Figure 42: Module Bottom Dimensions (TOP View, Unit: mm) ..............96 Figure 43: Recommended Footprint (TOP View) ..................97 Figure 44: Top & Bottom Views of the Module ................... 98 Figure 45: Recommended Reflow Soldering Thermal Profile ..............100 Figure 46: Carrier Tape Dimension Drawing ....................

  • Page 13: Introduction

    Smart Module Series Introduction This document defines the SC690A series and describes its air interfaces and hardware interfaces which relate to your applications. It can help you quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, you can use this module to design and to set up mobile applications easily.
  • Page 14 Smart Module Series then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC ID: XMR2022SC690ANA” or “Contains FCC ID: XMR2022SC690ANA” must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID.
  • Page 15 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate; iv. Omnidirectional antenna is recommended CE Statement Regulatory Conformance Hereby, we (Quectel Wireless Solutions Co., Ltd.) declares that the radio equipment type SC690A series are in compliance with Directive 2014/53/EU. RF exposure This equipment complies with CE radiation exposure limits set forth for an uncontrolled environment.

  • Page 16: Special Marks

    Regulations 2017 (SI 2017/1206) Declaration of Conformity Quectel Wireless Solutions Co., Ltd. hereby declares that this WCDMA / LTE with Bluetooth, Wi-Fi and GNSS functions, SC690A series are in compliance with the essential requirements and other relevant provisions of the UK Radio Equipment Regulations 2017 (SI 2017/1206).

  • Page 17: Product Overview

    Smart Module Series Product Overview The module is a series of smart LTE modules based on Android operating system and provides industrial grade performance. It supports multiple audio and video codecs, built-in high performance Adreno GPU 610 graphics processing unit and multiple audio and video input/output interfaces as well as abundant GPIO interfaces.

  • Page 18: Key Features

    Smart Module Series GPS: 1575.42 ± 1.023 MHz GPS: 1575.42 ± 1.023 MHz GLONASS: 1597.5–1605.8 MHz GLONASS: 1597.5–1605.8 MHz GNSS BeiDou: 1561.098 ± 2.046 MHz BeiDou: 1561.098 ± 2.046 MHz Galileo: 1573.5–1577.5MHz Galileo: 1573.5–1577.5MHz Wi-Fi 2402–2482 MHz; 5180–5825 MHz 2402–2482 MHz; 5180–5825 MHz Bluetooth 2402–2480 MHz 2402–2480 MHz...
  • Page 19 Smart Module Series Audio Inputs 3 analog microphone inputs 2 digital microphone inputs Audio Interfaces Audio Outputs Class AB stereo headphone output Class AB earpiece differential output Class AB LINE_OUT output Audio Codec Supports MP3; AAC; HE AAC v1, v2; FLAC; APE; ALAC; AIFF ⚫...
  • Page 20 Smart Module Series ⚫ ANT_DRX ⚫ ANT_WIFI/BT ⚫ ANT_GNSS ⚫ WCDMA: Class 3 (24 dBm + 1/ -3 dB) Transmitting Power ⚫ LTE-FDD: Class 3 (23 dBm ± 2 dB) ⚫ Supports 3GPP Rel-10 Cat 4 FDD ⚫ Supports 1.4 to 20 MHz RF bandwidth ⚫...

  • Page 21: Functional Diagram

    Smart Module Series 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. ⚫ Power management ⚫ Baseband ⚫ LPDDR4X + EMMC flash ⚫ Radio frequency ⚫ Peripheral interface -- USB interfaces -- (U)SIM interfaces -- UART interfaces -- SD card interface...

  • Page 22: Pin Assignment

    Smart Module Series Figure 1: Functional Diagram 2.4. Pin Assignment The following figure illustrates the pin assignment of the module. RESERVED LCD_TE RESERVED LCD_RST DSI_LN3_N DBG_TXD DSI_LN3_P DBG_RXD DSI_LN2_N GPIO_31 UART5_TXD DSI_LN2_P UART5_RXD DSI_LN1_N DCAM_MCL GPIO_62 LDO9_1V8 DSI_LN1_P OPTION RESERVED GPIO_25 DSI_LN0_N LPI_MI2S1_...

  • Page 23: Pin Description

    Smart Module Series Keep all RESERVED and unused pins open. 2.5. Pin Description The following table shows the DC characteristics and pin descriptions. Table 5: I/O Parameters Definition Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input...
  • Page 24 Smart Module Series It is suggested to use a TVS to increase voltage surge withstand capability. Power supply for external GPIO’s Vnom = 1.8 V LDO9_1V8 1.8 V output max = 300 mA pull up circuits and level shift circuit. Vmax = 4.4 V Power supply for VPH_PWR...
  • Page 25 Smart Module Series Aux amplifier output LINE_OUT_M Headphone right HPH_R channel output Headphone left HPH_L channel output Headphone HPH_GND reference ground Headset hot-plug Pulled up HS_DET detect internally. DMIC Interface* Pin Name Pin No. Description Comment Characteristics Digital microphone DMIC1_DATA 1 data Digital microphone DMIC1_CLK...
  • Page 26 Smart Module Series USB 3.1 Channel 1 USB_SS1_RX_P super-speed receive (+) USB 3.1 Channel 1 USB_SS1_RX_M super-speed receive (-) USB 3.1 Channel 1 USB_SS1_TX_P super-speed transmit (+) USB 3.1 Channel 1 USB 3.1 Gen1 USB_SS1_TX_M super-speed standard transmit (-) compliant. USB 3.1 Channel 2 90 Ω...
  • Page 27 Smart Module Series USIM1_CLK (U)SIM1 card clock USIM1_RST (U)SIM1 card reset Active Low. Require external pull-up to 1.8 V. If unused, keep (U)SIM1 card hot- this pin open. USIM1_DET plug detect Disabled by default, and can be enabled through software configuration.
  • Page 28 Smart Module Series SD card hot-plug SD_DET Active low. detect SD card power Vnom = 2.95 V SD_LDO22 supply max = 600 mA 1.8/2.95 V output Vnom = 1.8/2.95 V SD_LDO5 power for SD card max = 50 mA pull-up circuits Touch Panel Interfaces Pin Name Pin No.
  • Page 29 Smart Module Series LCD MIPI lane 1 DSI_LN1_P data (+) LCD MIPI lane 1 DSI_LN1_N data (-) LCD MIPI lane 2 DSI_LN2_P data (+) LCD MIPI lane 2 DSI_LN2_N data (-) LCD MIPI lane 3 DSI_LN3_P data (+) LCD MIPI lane 3 DSI_LN3_N data (-) Camera Interface...
  • Page 30 Smart Module Series MIPI lane 1 data of CSI1_LN1_P front camera (+) MIPI lane 1 data of CSI1_LN1_N front camera (-) MIPI lane 2 data of CSI1_LN2_P front camera (+) MIPI lane 2 data of CSI1_LN2_N front camera (-) MIPI lane 3 data of CSI1_LN3_P front camera (+) MIPI lane 3 data of...
  • Page 31 Smart Module Series Master clock of DCAM_MCLK depth camera Reset of depth DCAM_RST camera Power down of DCAM_PWDN depth camera Master clock of CAM4_MCLK fourth camera I2C clock of front 1.8 V power CAM_I2C_SCL and rear cameras domain. CAM_I2C_ I2C data of front 1.8 V power and rear cameras domain.
  • Page 32 Smart Module Series UART5_TXD UART5 transmit UART5_RXD UART5 receive UART1_TXD UART1 transmit UART1_RXD UART1 receive I2C Interfaces Pin Name Pin No. Description Comment Characteristics SENSOR_I2C_ I2C clock for external sensor SENSOR_I2C_ I2C data for external sensor 1.8 V power domain. I2C clock for I2C0_SCL external device...
  • Page 33 Smart Module Series Antenna Tuner Control Interface Pin Name Pin No. Description Comment Characteristics Generic RF GRFC_10 controller Generic RF GRFC_9 controller ADC Interface Pin Name Pin No. Description Comment Characteristics General-purpose Maximum input ADC interface voltage: 1.875 V. Charging Interface Pin Name Pin No.
  • Page 34 Smart Module Series Pulled up to LDO9_1V8 during Force the module power-up will USB_BOOT into emergency force the module download mode into emergency download mode. GNSS LNA enable If unused, keep GNSS_LNA_EN control this pin open. JTAG Interface Pin Name Pin No.
  • Page 35 Smart Module Series General-purpose GPIO_15 input/output General-purpose GPIO_25 input/output General-purpose GPIO_26 input/output General-purpose GPIO_31 input/output General-purpose GPIO_32 input/output General-purpose GPIO_33 input/output General-purpose GPIO_34 input/output General-purpose GPIO_35 input/output General-purpose GPIO_55 input/output General-purpose GPIO_56 input/output General-purpose GPIO_60 input/output General-purpose GPIO_62 input/output General-purpose GPIO_64 input/output General-purpose...

  • Page 36: Evb

    VPH_PWR 2.6. EVB To help you to develop applications with the module conveniently, Quectel supplies an evaluation board (EVB), USB data cable, earphone, antenna, and other peripherals to control or to test the module. For more details, see document [1].

  • Page 37: Operating Characteristics

    Smart Module Series Operating Characteristics 3.1. Power Supply 3.1.1. Power Supply Pins The module provides 3 VBAT pins, and 2 VPH_PWR pins. VBAT pins must be connected to an external power supply to power the module. VPH_PWR pins are used to power other devices. 3.1.2.
  • Page 38 Smart Module Series It must be able to provide sufficient current up to 3.0 A. 36, 37, Power supply for the VBAT It is suggested to use a TVS to module increase voltage surge withstand capability. BAT_P Battery voltage detect (+) Cannot be kept open.

  • Page 39: Reference Design For Power Supply

    Smart Module Series the battery temperature is abnormal, which will cause battery charging failure. To avoid this, BAT_THERM should be connected to GND via a 10 kΩ resistor. If BAT_THERM is unconnected, the system will be unable to detect the battery, and the battery will not be charged. BAT_P/M must be connected.
  • Page 40 Smart Module Series up to 3 A. If the power supply capability is not sufficient, there will be voltage drops, and if the voltage drops below 3.1 V, the module will power off automatically. Therefore, ensure that the input voltage never drops below 3.1 V.

  • Page 41: Turn On

    Smart Module Series 3.2. Turn on Table 8: Pin Definition of PWRKEY Pin Name Pin No. Description Comment Pull up to 1.8 V internally. PWRKEY Turn on/off the module Active low. The module can be turned on by driving the PWRKEY pin to a low level for at least 1.6 s. PWRKEY pin is pulled to 1.8 V internally.

  • Page 42: Turn Off

    Smart Module Series The turning on the scenario is illustrated in the following figure. Note2 VBAT(Typ:3.8 V) PWRKEY > 1.6 s 165.4 ms LDO9_1V8 Software controlled Software controlled LDO5_2V96 38 s Others Active Figure 9: Timing of Turning on Module NOTE 1.

  • Page 43: Vrtc Interface

    Smart Module Series VBAT > 8 s PWRKEY Others Power down Figure 10: Timing of Turning off Module 3.4. VRTC Interface The RTC (Real Time Clock) can be powered by an external power source through VRTC when the module is powered down and there is no power supply for the VBAT. The external power source can be a capacitor according to application demands.

  • Page 44: Power Output

    Smart Module Series 3.5. Power Output The module supports output of regulated voltages for peripheral circuits. During application, it is recommended to connect a 33 pF and a 10 pF capacitor in parallel to suppress high-frequency noise. Table 9: Power Description Pin Name Default Voltage (V) Drive Current (mA)

  • Page 45: Application Interfaces

    Smart Module Series Application Interfaces 4.1. USB Interfaces The module provides one USB interface(s): USB Type-C. The USB interface complies with the USB 3.1 Gen1 and USB 2.0 specifications, and supports SuperSpeed (5 Gbps) for USB 3.1 Gen1, High- Speed (480 Mbps), Full-Speed (12 Mbps) and Low-Speed (1.5 Mbps) for USB 2.0. The USB interface supports USB OTG function, and is used for AT command communication, data transmission, software debugging and firmware upgrade.
  • Page 46 Smart Module Series Table 11: Pin Definition of USB Interface Pin Name Pin No. Description Comment Charging power input. Power supply for OTG device. USB On-The-Go (OTG) USB_VBUS 41, 42 USB/adaptor insertion supports up to 1.0 A. detection. USB 2.0 standard USB_DM USB 2.0 differential data (-) compliant.
  • Page 47 Smart Module Series Module USB Type-C USB_VBUS VBUS USB_HS_DP USB_HS_DM USB_CC1 USB_CC2 SS_DIR_OUT NM_10 K 220 K SS_DIR_IN 330 nF USB_SS1_RX_P RX1+ 220 K 330 nF USB_SS1_RX_M RX1- 220 nF USB_SS1_TX_P TX1+ 220 nF USB_SS1_TX_M TX1- 220 K 330 nF USB_SS2_RX_P RX2+ 220 K...

  • Page 48: Uart Interfaces

    Smart Module Series USB_SS1_RX_P 26.12 0.32 USB_SS1_RX_M 25.80 USB_SS1_TX_P 25.53 0.02 USB_SS1_TX_M 25.51 USB_SS2_RX_M 30.25 -0.33 USB_SS2_RX_P 30.58 USB_SS2_TX_M 35.50 0.25 USB_SS2_TX_P 35.25 4.2. UART Interfaces The module provides 3 UART interfaces: ⚫ UART5: 4-wire UART interface, hardware flow control supported. ⚫...
  • Page 49 Smart Module Series UART1_RXD UART1 receive General-purpose Can be multiplexed into GPIO_4 input/output UART1_CTS. General-purpose Can be multiplexed into GPIO_5 input/output UART1_RTS. UART5 is a 4-wire UART interface with 1.8 V power domain. A level translator chip should be used if your application is equipped with a 3.3 V UART interface.

  • Page 50: U)Sim Interfaces

    Smart Module Series 4.3. (U)SIM Interfaces The module provides two (U)SIM interfaces which meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Either 1.8 V or 2.95 V (U)SIM card is supported, and the (U)SIM interfaces are powered by the dedicated low dropout regulators in the module. Table 14: Pin Definition of (U)SIM Interface Pin Name Pin No.
  • Page 51 Smart Module Series The module supports (U)SIM card hot-plug via the USIM_DET pin, which is disabled by default and can be enabled through software configuration. A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below. USIM_VDD LDO9_1V8 (U)SIM Card Connector...

  • Page 52: Sd Card Interface

    Smart Module Series 4.4. SD Card Interface The module supports SD 3.0 specifications. The pin definition of the SD card interface is shown below. Table 15: Pin Definition of SD Card Interface Pin Name Pin No. Description Comment SD_CLK SD card clock SD_CMD SD card command SD_DATA0...

  • Page 53: Gpio Interfaces

    Smart Module Series SD_LDO22 is a peripheral driver power supply for SD card. The maximum drive current is 600 mA. Because of the high drive current, it is recommended that the trace width is 0.5 mm or above. To ensure the stability of drive power, add a 4.7 μF and a 33 pF capacitor in parallel near the SD card connector.
  • Page 54 Smart Module Series General-purpose GPIO_3 input/output General-purpose GPIO_4 input/output General-purpose GPIO_5 input/output General-purpose GPIO_14 input/output 1.8 V power domain. General-purpose GPIO_15 input/output General-purpose GPIO_25 input/output General-purpose GPIO_26 input/output General-purpose GPIO_31 input/output General-purpose GPIO_32 input/output General-purpose GPIO_33 input/output General-purpose GPIO_34 input/output General-purpose GPIO_35 input/output...

  • Page 55: I2C Interfaces

    Smart Module Series General-purpose GPIO_84 input/output General-purpose GPIO_85 input/output General-purpose GPIO_86 input/output General-purpose GPIO_93 input/output General-purpose GPIO_96 input/output General-purpose GPIO_97 input/output General-purpose GPIO_106 input/output General-purpose GPIO_107 input/output General-purpose GPIO_111 input/output General-purpose GPIO_112 input/output General-purpose LPI_GPIO_21 input/output Only used for audio and sensor.

  • Page 56: I2S Interfaces

    Smart Module Series Table 18: Pin Definition of I2C Interfaces Pin Name Pin No. Description Comment SENSOR_I2C_SCL I2C clock for external sensor SENSOR_I2C_SDA I2C data for external sensor I2C0_SCL I2C clock for external device I2C0_SDA I2C data for external device I2C clock of front and rear CAM_I2C_SCL cameras...

  • Page 57: Adc Interface

    Smart Module Series LPI_MI2S0_WS LPI I2S0 word select LPI_MI2S0_DATA0 LPI I2S0 data channel 0 LPI_MI2S0_DATA1 LPI I2S0 data channel 1 4.8. ADC Interface The module provides one analog-to-digital converter (ADC) interface which support up to 15-bit resolution, and the pin definition is shown below. Table 20: Pin Definition of ADC Interfaces Pin Name Pin No.
  • Page 58 Smart Module Series DSI_CLK_P LCD MIPI clock (+) DSI_CLK_N LCD MIPI clock (-) DSI_LN0_P LCD MIPI lane 0 data (+) DSI_LN0_N LCD MIPI lane 0 data (-) DSI_LN1_P LCD MIPI lane 1 data (+) DSI_LN1_N LCD MIPI lane 1 data (-) DSI_LN2_P LCD MIPI lane 2 data (+) DSI_LN2_N...
  • Page 59 Smart Module Series The following figures show the reference design for LCM interface. LCD_VDD_2V8 VPH_PWR GPIO_09B BP/FB 1 μ F 100 nF 4.7 μ F 10 K LCD_VDD_2V8 LDO9_1V8 LEDA LCD_BL_A LCD_BL_K1 LEDK LCD_BL_K2 LCD_TE LPTE RESET LCD_ RST LCD_ID NC (SDA-TP) NC (SCL-TP) NC (RST-TP)

  • Page 60: Touch Panel Interface

    Smart Module Series You can design external backlight drive circuit for LCM according to actual requirement. The reference designs are shown in the figures below, in which PWM is used for backlight brightness adjustment. VPH_PWR LCD_BL_A Backlight Driver LCD_BL_K1 LCD_BL_K2 Module Figure 18: LCM External Backlight Driver Reference Circuit NOTE...

  • Page 61: Camera Interfaces

    Smart Module Series A reference design for TP interface is shown below. VPH_PWR TP_VDD_2V8 GPIO_26 BP/FB 4.7 μ F 10 K 1 μ F 10 nF LDO9_1V8 TP_VDD_2V8 Module 2.2 K 2.2 K TP_I2C_SDA TP_I2C_SCL RESET TP_RST TP_INT 4.7 μ F 100 nF Figure 19: Reference Circuit Design for TP Interface NOTE TP is powered by TP_VDD_2V8, which is an external LDO power supply.
  • Page 62 Smart Module Series Table 23: Pin Definition of Camera Interfaces Pin Name Pin No. Description Comment CSI0_CLK_P MIPI clock of rear camera (+) CSI0_CLK_N MIPI clock of rear camera (-) CSI0_LN0_P MIPI lane 0 data of rear camera (+) CSI0_LN0_N MIPI lane 0 data of rear camera (-) CSI0_LN1_P MIPI lane 1 data of rear camera (+)
  • Page 63 Smart Module Series CSI2_LN1_P MIPI lane 1 data of depth camera (+) CSI2_LN1_N MIPI lane 1 data of depth camera (-) CSI2_LN2_P MIPI lane 2 data of depth camera (+) CSI2_LN2_N MIPI lane 2 data of depth camera (-) CSI2_LN3_P MIPI lane 3 data of depth camera (+) CSI2_LN3_N MIPI lane 3 data of depth camera (-)
  • Page 64 Smart Module Series The following is a reference circuit design for three-camera applications. AFVDD_2V8 AVDD_2V8 DVDD_1V2 LDO9_1V8 MCAM_ RST MCAM_PWDN 2.2 K 2.2 K MCAM_MCLK CAM_I2C_SDA CAM_I2C_SCL CSI0_LN3_P CSI0_LN3_N CSI0_LN2_P CSI0_LN2_N CSI0_LN1_P CSI0_LN1_N CSI0_LN0_P CSI0_LN0_N DVDD_1V2 1 μF CSI0_CLK_P DOVDD CSI0_CLK_N 4.7 μF AVDD...
  • Page 65 Smart Module Series NOTE CSI0 is used for rear camera, CSI1 for front camera and depth camera. Refer to the reference circuit of CSI0 for that of CSI2. The camera interfaces are powered by an external power supply. The reference circuit design is as follows: VPH_PWR 2.2 μH...
  • Page 66 Smart Module Series impedance should be controlled to 85 Ω. Additionally, it is recommended to route the trace on the inner layer of PCB, and do not cross it with other traces. For the same group of DSI or CSI signals, all the MIPI traces should keep the same length.
  • Page 67 Smart Module Series CSI0_LN1_P 20.45 CSI0_LN2_N 20.84 0.20 CSI0_LN2_P 20.65 CSI0_LN3_N 21.17 0.16 CSI0_LN3_P 21.01 CSI1_CLK_N 13.17 0.06 CSI1_CLK_P 13.10 CSI1_LN0_N 12.82 0.00 CSI1_LN0_P 12.82 CSI1_LN1_N 12.97 0.29 CSI1_LN1_P 12.68 CSI1_LN2_N 12.82 -0.17 CSI1_LN2_P 12.99 CSI1_LN3_N 13.02 0.34 CSI1_LN3_P 12.6 CSI2_CLK_N 29.77 0.23...

  • Page 68: Sensor Interfaces

    Smart Module Series 4.12. Sensor Interfaces The module supports communication with sensors via I2C interface, and it supports various sensors such as acceleration sensor, gyroscopic sensor, compass, light sensor, temperature sensor, etc. Table 25: Pin Definition of Sensor Interfaces Pin Name Pin No.

  • Page 69: Keypad Interfaces

    Smart Module Series A reference circuit design is shown below. FLASH1_LED FLASH2_LED Module Figure 26: Reference Circuit Design for Flashlight Interfaces 4.14. Keypad Interfaces The module supports three keypads: PWRKEY for turning module on/off and VOL_UP and VOL_DOWN to adjust the volume. Table 27: Pin Definition of Keypad Interfaces Pin Name Pin No.

  • Page 70: Jtag Interface

    Smart Module Series output control The vibrator is driven by an exclusive circuit, and a reference circuit design is shown below. VIB_DRV VIB+ 33 pF VIB- Module Motor Figure 22: Reference Circuit for Vibrator Connection 4.16. JTAG Interface Table 29: Pin Definition of JTAG Interface Pin Name Pin No.

  • Page 71: Led Driver Interface

    Smart Module Series 4.17. LED Driver Interface The following is the pin definition of LED driver interfaces. Table 30: Pin Definition of LED Driver Interface Pin Name Pin No. Description Comment LED_RED Current source for the red LED. Sources up to 12 mA max LED_GRN Current source for the green LED.
  • Page 72 Smart Module Series DMIC1_CLK Digital microphone 1 clock DMIC2_DATA Digital microphone 2 data DMIC2_CLK Digital microphone 2 clock MIC_BIAS1 Microphone bias output voltage 1 MIC_BIAS2 Microphone bias output voltage 2 MIC_BIAS3 Microphone bias output voltage 3 Used for ECM MIC1_P Microphone input for channel 1 (+) microphone by default.

  • Page 73: Reference Circuit Design For Microphone Interfaces

    Smart Module Series 4.18.1. Reference Circuit Design for Microphone Interfaces MIC_BIAS1 2.2 K 2.2 K MIC1_P MIC1_M ECM MIC NM_0 R 33 pF 33 pF 100 nF Module Figure 24: Reference Circuit Design for ECM Microphone Interfaces MIC_BIAS3 MIC3_M 33 pF MIC3_P MEMS MIC Module...

  • Page 74: Reference Circuit Design For Receiver Interface

    Smart Module Series 4.18.2. Reference Circuit Design for Receiver Interface EAR_P 33 pF EAR_M 33 pF 33 pF Module Figure 26: Reference Circuit Design for Receiver Interface 4.18.3. Reference Circuit Design for Headset Interface MIC_BAIS2 MIC2_M MIC2_P HPH_L HS_DET 20 K HPH_R HPH_GND D1 D2 D3 D4...

  • Page 75: Reference Circuit Design For Loudspeaker Interface

    Smart Module Series 4.18.4. Reference Circuit Design for Loudspeaker Interface VPH_PWR Audio PA GPIO_100 10 K 100 pF 10 μF 82 K LINE_OUT_P 10 μ F 82 K LINE_OUT_M 22 μ F 1 μ F 33 pF 33 pF Figure 28: Reference Circuit Design for Loudspeaker Interface 4.18.5.

  • Page 76: Rf Specifications

    Smart Module Series RF Specifications 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands Table 32: Pin Definition of Cellular Network Interface Pin Name Pin No. Description Comment 50 Ω impedance ANT_MAIN Main antenna interface 50 Ω impedance ANT_DRX Diversity antenna interface ⚫...

  • Page 77: Tx Power

    Smart Module Series LTE-FDD B17 734–746 704–716 LTE-FDD B25 1930–1995 1850–1915 LTE-FDD B26 859–894 814–849 LTE-FDD B66 2110–2200 1710–1780 Table 34: Operating Frequency of SC690A-EM Operating Frequency Receive (MHz) Transmit (MHz) WCDMA B1 2110–2170 1920–1980 WCDMA B3 1805–1880 1710–1785 WCDMA B8 925–960 880–915 LTE-FDD B1...

  • Page 78: Reference Design

    Smart Module Series 5.1.3. Reference Design The module provides main and Rx-diversity RF antenna interfaces for antenna connection. It is recommended to reserve a π-type matching circuit for better RF performance, and the π-type matching components (R1/C1/C2, R2/C3/C4) should be placed as close to the antenna as possible. The capacitors are not mounted by default.

  • Page 79: Antenna Interface & Frequency Bands

    Smart Module Series 5.2.1. Antenna Interface & Frequency Bands The following table shows the pin definition, frequency, and performance of GNSS antenna interface. Table 36: Pin Definition of GNSS Antenna Interface Pin Name Pin No. Description Comment 50 Ω impedance ANT_GNSS GNSS antenna interface Table 37: GNSS Frequency...

  • Page 80: Recommended Circuit For Active Antenna

    Smart Module Series When the passive antenna is placed far away from the module (that is, the antenna trace is long), it is recommended to add an external LNA circuit for better GNSS receiving performance, and the LNA should be placed close to the antenna. 5.2.2.2.

  • Page 81: Wi-Fi/Bluetooth

    Smart Module Series ⚫ In user systems, GNSS RF signal lines and RF components should be placed far away from high- speed circuits, switched-mode power supplies, power inductors, the clock circuit of single-chip microcomputers, etc. ⚫ For applications with a harsh electromagnetic environment or with high requirement on ESD protection, it is recommended to add ESD protection diodes for the antenna interface.
  • Page 82 Smart Module Series ⚫ Support AP mode ⚫ Support Wi-Fi Direct ⚫ Support MCS 0-7 for HT20 and HT40 ⚫ Support MCS 0~8 for VHT20 ⚫ Support MCS 0~9 for VHT40和VHT80 The following table lists the Wi-Fi transmitting and receiving performance of the module. Table 40: Wi-Fi Transmitting Performance Standard Rate...
  • Page 83 Smart Module Series 802.11ac VHT80 MCS0 13 dBm ± 2.5 dB 802.11ac VHT80 MCS9 12 dBm ± 2.5 dB Table 41: Wi-Fi Receiving Performance Standard Rate Sensitivity 802.11b 1 Mbps 802.11b 11 Mbps 802.11g 6 Mbps 802.11g 54 Mbps 2.4 GHz 802.11n HT20 MCS0 802.11n HT20...

  • Page 84: Bluetooth Overview

    Smart Module Series NOTE The product conforms to the IEEE specifications. 5.3.2. Bluetooth Overview The module supports Bluetooth 5.1 (BR/EDR+BLE) specification, as well as GFSK, 8-DPSK, Π/4- DQPSK modulation modes. ⚫ Maximally support up to 7 wireless connections. ⚫ Maximally support up to 3.5 PICONETs at the same time. ⚫...

  • Page 85: Reference Design

    Smart Module Series Table 43: Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types 2-DH5 3-DH5 Transmitting Power 7 ± 2.5 dBm 6 ± 2.5 dBm 6 ± 2.5 dBm Receiver Performance Packet Types 2-DH5 3-DH5 Receiving Sensitivity -91 dBm -91 dBm -85 dBm 5.3.3.
  • Page 86 Smart Module Series Figure 34: Microstrip Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) SC690A_Series_Hardware_Design 85 / 105...

  • Page 87: Requirements For Antenna Design

    Smart Module Series Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.

  • Page 88: Rf Connector Recommendation

    Smart Module Series Active antenna embedded LNA gain: 17 dB VSWR: ≤ 2 Efficiency: > 30 % Gain: 1 dBi Max input power: 50 W Input impedance: 50 Ω GSM/EVDO/CDMA/UMTS/TD-SCDMA/LTE Polarization: Vertical Cable insertion loss: < 1 dB: LB (<1 GHz) <...
  • Page 89 Smart Module Series Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 39: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. SC690A_Series_Hardware_Design 88 / 105...
  • Page 90 Smart Module Series Figure 40: Space Factor of Mated Connector (Unit: mm) For more details, visit http://www.hirose.com. SC690A_Series_Hardware_Design 89 / 105...

  • Page 91: Electrical Characteristics & Reliability

    Smart Module Series Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 45: Absolute Maximum Ratings Parameter Min. Max.

  • Page 92: Power Supply Ratings

    Smart Module Series 6.2. Power Supply Ratings Table 46: The Module’s Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit The actual input voltages must stay between the VBAT VBAT_BB 3.55 minimum and maximum values. USB connection USB_VBUS detection 6.3.
  • Page 93 Smart Module Series LTE-FDD B17 @ max power LTE-FDD B25 @ max power LTE-FDD B26 @ max power LTE-FDD B66 @ max power Table 48: SC690A-EM Power Consumption Description Conditions Typ. Unit μA OFF state Power down Sleep (USB disconnected) @ DRX = 6 Sleep (USB disconnected) @ DRX = 7...

  • Page 94: Digital I/O Characteristic

    Smart Module Series B1 (HSUPA) @ max power B3 (HSUPA) @ max power B8 (HSUPA) @ max power 6.4. Digital I/O Characteristic Table 49: 1.8 V I/O Requirements Parameter Description Min. Max. Unit Input high voltage 1.17 Input low voltage -0.3 0.63 Output high voltage...

  • Page 95: Esd

    Smart Module Series Input low voltage -0.3 0.59 Output high voltage 2.36 2.95 Output low voltage 6.5. ESD If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent. Thus, please take proper ESD countermeasures and handling methods. For example, wearing anti-static gloves during the development, production, assembly and testing of the module;...

  • Page 96: Mechanical Information

    Smart Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 41: Module Top and Side Dimensions (Unit: mm) SC690A_Series_Hardware_Design 95 / 105...
  • Page 97 Smart Module Series Pin 1 Figure 42: Module Bottom Dimensions (TOP View, Unit: mm) ⚫ NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. SC690A_Series_Hardware_Design 96 / 105...

  • Page 98: Recommended Footprint

    Smart Module Series 7.2. Recommended Footprint Figure 43: Recommended Footprint (TOP View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least 1.2 mm.

  • Page 99: Top And Bottom Views

    Figure 44: Top & Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SC690A_Series_Hardware_Design 98 / 105...

  • Page 100: Storage, Manufacturing & Packaging

    Smart Module Series Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 101: Manufacturing And Soldering

    Smart Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven.
  • Page 102 2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [4].

  • Page 103: Packaging Specifications

    Smart Module Series 8.3. Packaging Specifications The module adopts carrier tape packaging and details are as follow: 8.3.1. Carrier Tape Dimension details are as follow: Figure 46: Carrier Tape Dimension Drawing Table 55: Carrier Tape Dimension Table (Unit: mm) 0.35 44.5 43.5 34.2...
  • Page 104 Smart Module Series Table 56: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 72.5 8.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection.
  • Page 105 Smart Module Series Appendix References Table 57: Related Documents Document Name [1] Quectel_Smart_EVB-G2_User_Guide [2] Quectel_SC690A_Series_GPIO_Configuration [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_Secondary_SMT_ User_Guide [5] Quectel_SC690A_Series_Reference_Design Table 58: Terms and Abbreviations Abbreviation Description Analog-to-Digital Converter AMR-WB Adaptive Multi-Rate Wideband Active Optical Network Application Processor Bits Per Second BPSK Binary Phase Shift Keying...
  • Page 106 Smart Module Series Commercial Sample II Clear To Send Digital Audio Interface Data Communications Equipment DC-HSDPA Dual-carrier High Speed Downlink Packet Access Double Data Rate DFOTA Delta Firmware Upgrade Over The Air Downlink Discontinuous Reception Diversity Receive Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Electrostatic Discharge...
  • Page 107 Smart Module Series HSDPA High Speed Downlink Packet Access HSPA High Speed Packet Access HSUPA High Speed Uplink Packet Access Integrated Circuit Inter-Integrated Circuit Inter-IC Sound Input/Output Inorm Normal Current License Assisted Access Low Band Light Emitting Diode Land Grid Array LMHB Low/Middle/High Band Low Noise Amplifier...
  • Page 108 Smart Module Series New Radio Non-Stand Alone Power Amplifier Password Authentication Protocol Personal Computer Printed Circuit Board PCIe Peripheral Component Interconnect Express Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Physical Layer PMIC Power Management Integrated Circuit Primary Receive Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying...
  • Page 109 Smart Module Series Surface Mount Device Short Message Service System on a Chip Set Top Box TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access Transmit & Receive Transmit UART Universal Asynchronous Receiver/Transmitter Ultra High Band Uplink UMTS Universal Mobile Telecommunications System Unsolicited Result Code...
  • Page 110 Smart Module Series Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network WWAN Wireless Wide Area Network SC690A_Series_Hardware_Design 109 / 105...

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