Electrostatic Discharge; Thermal Consideration - Quectel QuecOpen AG521R-NA Hardware Design

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LTE-TDD B14 (10 MHz)
LTE-TDD B25 (10 MHz)
LTE-TDD B26 (10 MHz)
LTE-TDD B29 (10 MHz)
LTE-TDD B30 (10 MHz)
LTE-TDD B66 (10 MHz)
LTE-TDD B71 (10 MHz)

5.7. Electrostatic Discharge

The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject to ESD
handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging
procedures must be applied throughout the processing, handling and operation of any application that incorporates
the module.
The following table shows the module electrostatic discharge characteristics.
Table 37: Electrostatic Discharge Characteristics
Tested Points
VBAT, GND
Antenna Interfaces
Other Interfaces

5.8. Thermal Consideration

In order to achieve better performance of the module, it is recommended to comply with the following principles
for thermal consideration:
On customers' PCB design, please keep placement of the module away from heating sources, especially high
power components such as ARM processor, audio power amplifier, power supply, etc.
AG521R-NA_QuecOpen_Hardware_Design
-99.6
-100
-98.8
-99
-100
-100.3
-98.5
-101
-97.7
-99
-98.3
-99.5
-100.5
-100.3
Contact Discharge
± 8
± 8
± 0.5
Automotive Module Series
AG521R-NA QuecOpen Hardware Design
-102.8
-102
-103
-102
-101
-101.5
-103.5
Air Discharge
± 10
± 10
± 1
-93.3 dBm
-92.8 dBm
-93.8 dBm
-93.3 dBm
-95.3 dBm
-95.8 dBm
-93.5 dBm
Unit
kV
kV
kV
78 / 92

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