IBM Power System Series Manual page 265
Temple's zeppelin procedures for install, remove, replace
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Also See for Power System Series:
- Handbook (336 pages) ,
- Manual (245 pages) ,
- Problem analysis, system parts, and locations (134 pages)
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Figure 214: Opening the system processor module packaging
3. Remove the heat sink from the system processor module.
(L007)
CAUTION: A hot surface nearby. (L007)
a. Loosen the heat sink actuation screw by turning the supplied hex key counterclockwise (A). Loosen
the screw until it moves freely. See Figure 215 on page 262.
b. Grip the heat sink (B) on opposing sides and remove the heat sink by lifting it upward. Set the heat
sink aside with the module side facing upward.
Note: If you plan to remove dust or debris from the heat sink, this operation must be performed in
another room that is greater than 7.6 m (24.9 ft) away from the work area.
System processor modules for the 9040-MR9 261
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