Sensor Head - Panasonic HG-T Series User Manual

Specifications and Dimensions

8.1.2 Sensor Head

Type
Model No.
Position detection
method
Installation distance
Measurement width
Light source
Sampling cycle
Repeatability (Note 2)
Linearity (Note 3)
Minimum sensing
object (Note 4)
Temperature charac-
teristics (Note 5)
Protective structure
Contamination level
Ambient temperature
Ambient humidity
Ambient illuminance
Elevation
Insulation resistance
Vibration resistance
Shock resistance
Grounding method
Materials
Cable
Weight (main unit only) Emitter: Approx. 30g, Receiver: Approx. 30g Emitter: Approx. 30g, Receiver: Approx. 25g
Standards compliance
All the specifications shown above are based on the values that are digitally measured when the sensor head is
combined with controller HG-TC□.
Specification conditions that are not particularly specified are shown below.
• Ambient temperature: +20°C
• Average number of controller setting times: 16 times
• Measured object: Opaque knife edge
• Installation distance: 100mm
• Measured object position conditions: Middle position of installation distance / Half shading
Notes: 1) Complies with the FDA regulations in accordance with FDA Laser Notice No. 50.
2) Peak-to-peak value of variations in digital measured values at the middle position of the installation dis-
tance and under half shading conditions
3) Indicates an error with the ideal straight line of digital measured values
4) When the light is blocked at the center position of 500 mm installation distance
5) When the light is half-blocked at the center position of 100 mm installation distance
6) When the sampling cycle of the controller is set to "standard sampling"
7) Do not use or store this product in environments where ambient air is pressurized to an air pressure
higher than the atmospheric pressure at an altitude of 0m.
8-8
Measurement width 10 mm / Standard type
HG-T1010
Red semiconductor laser: Class 1 [JIS / IEC / GB / FDA (Note 1)]
Maximum output: 0.3mW, Peak emission wavelength: 655nm
1ms (standard sampling) or 0.5ms (high-speed sampling)
ø0.5 mm in (Installation distance: 500 mm 19.685 in)
-10 to +45°C (No dew condensation or icing allowed), Storage: -20 to +60°C
Incandescent light: 5,000ℓx or less at the light-receiving face (Note 6)
20MΩ or higher, using 250VDC megger (between all terminals and case)
10 to 55Hz with 1.5mm amplitude in X, Y and Z directions for two hours each
196m/s
Case: Aluminum die casting, Light emitting and light receiving surfaces: Glass
0.2m 4-conductor shielded cable with round connectors
Measurement width 10 mm / Slim type
CMOS-based
0 to 500mm
10mm
1µm (Installation distance: 20mm)
2.5µm (Installation distance: 100mm)
5µm (Installation distance: 500mm)
±0.12% F.S (Installation distance: 20mm)
±0.28% F.S (Installation distance: 100mm)
±0.03%F.S./°C
IP67 (IEC)(Excluding connectors)
2
35 to 85% RH, Storage: 35 to 85% RH
2,000m or lower (Note 7)
2
in X, Y and Z directions three times each
Capacitor grounding
EMC Directive, FDA
HG-T1110
WUME-HGT-3