Figure 7-19. Thermocouple Bead Placement - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual
Thermal and mechanical design guidelines
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- Datasheet (100 pages) ,
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Case Temperature Reference Metrology
9. Lift the wire at the middle of groove with tweezers and bend the front of wire to
place the thermocouple in the groove ensuring the tip is in contact with the end
and bottom of the groove in the IHS (Figure 7-19-A and B).
Figure 7-19. Thermocouple Bead Placement
10. Place the package under the microscope to continue with process. It is also
recommended to use a fixture (like processor tray or a plate) to help holding the
unit in place for the rest of the attach process.
Thermal and Mechanical Design Guidelines
(A)
(B)
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