Case Temperature Reference Metrology; Objective And Scope; Supporting Test Equipment - Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual

Case Temperature Reference Metrology

Appendix D Case Temperature
D.1

Objective and Scope

This appendix defines a reference procedure for attaching a thermocouple to the IHS
of a 775-land LGA package for T
specific features of the 775-land LGA package and of the LGA775 socket for which it is
intended. The recommended equipment for the reference thermocouple installation,
including tools and part numbers are also provided. In addition a video Thermocouple
Attach Using Solder – Video CD-ROM is available that shows the process in real time.
D.2

Supporting Test Equipment

To apply the reference thermocouple attach procedure, it is recommended to use the
equipment (or equivalent) given in the following table.
Item
Microscope
DMM
Thermal Meter
Heater Block
Heater
Transformer
Solder
Flux
Loctite* 498
Adhesive
Adhesive
Accelerator
Kapton* Tape
Thermocouple
Thermal and Mechanical Design Guidelines
Reference Metrology
measurement. This procedure takes into account the
C
Description
Measurement and Output
Olympus* Light microscope or equivalent
Digital Multi Meter for resistance measurement
Hand held thermocouple meter
Solder Station (see note 1 for ordering information)
Heater assembly to reflow solder on IHS
WATLOW120V 150W Firerod
Superior Powerstat transformer
Miscellaneous Hardware
Indium Corp. of America
Alloy 57BI / 42SN / 1AG 0.010 Diameter
Indium Corp. of America
Super glue w/thermal characteristics
Loctite* 7452 for fast glue curing
For holding thermocouple in place
Omega *,36 gauge, "T" Type
(see note 2 for ordering information)
Part Number
SZ-40
Fluke 79 Series
Multiple Vendors
30330
0212G G1A38-
L12
05F857
52124
5RMA
49850
18490
Not Available
OSK2K1280/5SR
TC-TT-T-36-72
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